Claims
- 1. A method of producing an electrode plate having a conductive tab area comprising the steps of:(a) piercing an area of an electrode plate with opposing, offset piercing plates having raised surface probes; (b) clearing the resulting area to expose a porous substrate forming a conductive tab area; (c) reinforcing the exposed porous substrate; and (d) attaching a conductive tab to the reinforced porous substrate.
- 2. The method of claim 1, wherein the reinforcing step comprises placing a reinforcing material over the exposed porous substrate.
- 3. The method of claim 2, wherein the reinforcing step further comprises compressing the reinforcing material into the exposed porous substrate.
- 4. The method of claim 3, wherein the reinforcing material is double ply.
- 5. The method of claim 3, wherein the attaching step includes applying ultrasonics.
- 6. The method of claim 5, wherein the ultrasonics include an ultrasonic horn having raised surfaces and an anvil having a flat surface.
- 7. The method of claim 3, wherein the attaching step includes resistance welding.
- 8. The method of claim 7, further comprising the step of applying ultrasonics to the reinforcing material compressed into the exposed porous substrate prior to the attaching step.
- 9. The method of claim 1, further comprising the step of punching a hole in the conductive tab after the attaching step.
- 10. The method of claim 1, further comprising the step of taping the conductive tab and conductive tab area after the attaching step.
- 11. The method of claim 1, wherein the clearing step includes applying ultrasonics to the resulting area.
- 12. The method of claim. 11, wherein the ultrasonics are applied by an ultrasonic horn having a smooth surface and an anvil having raised surfaces.
- 13. The method of claim 1, wherein the conductive tab is a single layer conductive tab.
- 14. The method of claim 1, wherein the conductive tab is a double layer conductive tab.
- 15. The method of claim 1, wherein the exposed porous surface is reinforced by placing a reinforcing material over the exposed porous substrate on two surfaces of the substrate.
- 16. The method of claim 14, wherein the conductive tab includes nickel.
Parent Case Info
This application is a continuation of U.S. patent application Ser. No. 08/908,881, filed Aug. 8, 1997, now abandoned, the entire contents of which are hereby incorporated by reference.
US Referenced Citations (9)
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2200068A |
Jul 1988 |
GB |
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Mar 1978 |
JP |
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JP |
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Non-Patent Literature Citations (2)
Entry |
Crompton, TR, Battery Reference Book, 2nd Edition;(Reed Educational and Professional Publishing, Ltd., Boston 1996), Chapter 19, p. 10 (No Month available). |
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Continuations (1)
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Number |
Date |
Country |
Parent |
08/908881 |
Aug 1997 |
US |
Child |
09/589852 |
|
US |