Other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings, in which like parts are designated by like reference numbers and in which:
An embodiment of the present invention will be described with reference to
The circuit board 10 includes a printed circuit board 13 on which wiring patterns and via holes for connecting the wiring patterns are formed. Electronic components such as a microcomputer, power transistors, resistors, capacitors (not shown) and the connector 20 as an input/output part to be connected with external devices are mounted on the printed circuit board 13. Also, the circuit board 10 includes terminal lands 11 to which terminals 22 of the connector 20 are connected and reinforcing lands 12 to which connecting portions 32 of the reinforcing tabs 30 are connected, on a surface of the printed circuit board 13. Further, joining materials such as solder (not shown) are formed on surfaces of the terminal lands 11 and the reinforcing lands 12.
The connector 20 is a surface-mounted type connector, and includes a housing 21 and the terminals 22. The terminals 22 are made of an electrical conductive material. The housing 21 is made of an electrical insulating material (e.g., synthetic resin). The terminals 22 are arranged in the housing such that first ends thereof are surface-mounted to the circuit board 10 and second ends thereof are disposed to be connectable with the external devices. The housing 21 has housing fixing portions 23 on its end surfaces with respect to a longitudinal direction, and to which the reinforcing tabs 30 are fixed so as to improve joining strength between the circuit board 10 and the connector 20.
The terminals 22 are fixed to the housing 21 such as by inserting. The terminals 22 are arranged at equal intervals with respect to the longitudinal direction of the housing 21 without interfering with each other.
The housing fixing portions 23 are configured to receive the reinforcing tabs 30 from top side. For example, the reinforcing tabs 30 can be fixed on the housing fixing portions 23 toward the circuit board 10, as shown in
The reinforcing tabs 30 are provided to bias the connector 20 toward the circuit board 10 so as to improve reliability of connection between the connector 20 and the circuit board 10. As shown in
The extending portions 34 extends substantially perpendicular to the tab fixing portion 31. The connecting portions 32 extend substantially perpendicular to the extending portions 34. Further, the connecting portion 32 provides a connecting surface on its end surface that is on a side opposite to the tab fixing portion 31 with respect to the extending portion 34. The connecting surface extends substantially parallel to the surface of the circuit board 10. The reinforcing tab 30 is connected to the circuit board 10 through the connecting surface.
As shown in
Further, the connecting portion 32 is formed with a first groove (recess) 33a and a second groove (recess) 33b at positions corresponding to ends of the bent portion 33. Namely, the first groove 33a is formed on the connecting surface, between the first connecting surface 32a1 and the second connecting surface 32b1. The second groove 33a is formed on an end surface of the connecting portion, which is opposite to the connecting surface. Thus, the end surfaces of the connecting portion 32 do not have projections or expansions, which are formed by bending the connecting portion 32 at the bent portion 33.
The connector 20 is mounted to the circuit board 10 in the following manner. First, the reinforcing tab 30 is fixed to the housing fixing portion 23 of the connector 20. Specifically, as shown in
Next, the terminals 22 of the connector 20 are soldered with the terminal lands 11 of the circuit board 10 such as by reflow soldering. Also, the connecting portions 32 of the reinforcing tab 30 are soldered with the reinforcing lands 12 such as by reflow soldering. As such, the connector 20 is mounted to the circuit board 10.
Since the connector 20 is biased toward the circuit board 10 by the reinforcing tabs 30, the connecting strength between the connector 20 and the circuit board 10 is improved. In this case, the first grooves 33a are formed at the ends of the bent portions 33. In other words, the connecting surface do not have projections at the positions corresponding to the bent portions 33. Therefore, the first and second connecting surfaces 32a1, 32b1 are properly soldered with the reinforcing lands 12. Accordingly, the reinforcing tabs 30 are connected to the circuit board 10 while sufficiently maintaining connecting areas with the circuit board 10. As a result, the connector 20 is connected to the circuit board 10 with a sufficient strength.
For example, the circuit board 10 on which the connector 20 is mounted is employed to an electronic device such as a control unit for a vehicle. In this case, it is generally subjected to high temperature, and thus the housing 21 and the circuit board 10 will be deformed by thermal expansion. Further, in a case that the housing 21 and the circuit board 10 are made of different materials having different coefficient of thermal expansion, the housing 21 and the circuit board 10 are likely to be displaced relative to each other. For example, the amount of displacement increases with a distance from the center of the housing 21. That is, the ends of the housing 21 with respect to the longitudinal direction is likely to more displace relative to the circuit board 10, and receive stress easily.
In this embodiment, the housing fixing portions 23 are formed on the ends of the housing 21 with respect to the longitudinal direction, and the reinforcing tabs 30, which is connected to the reinforcing lands 12 of the circuit board 10, are fixed to the housing fixing portions 23. Therefore, the connecting condition between the connector 20 and the circuit board 10 is sufficiently maintained.
The fixing direction of the reinforcing tabs 30 to the connector 20 may be decided in view of a direction in which the circuit board 10 on which the connector 20 and the reinforcing tabs 30 are mounted is carried and/or a direction in which heat is applied, during the reflow soldering, for soldering the terminals 22 and the connecting portions 32 with the terminal lands 11 and the reinforcing lands 12, respectively.
For example, during the reflow soldering, reflow heat is applied in the longitudinal direction of the connector 20 from a top of the circuit board 10, and the circuit board 10 is carried in a left direction in
Next, structure of the reinforcing tabs 30 will be described more in detail. The reinforcing tabs 30 are formed by shaping a metallic plate into a predetermined shape such as by punching and bending. The metallic plate is for example made of copper such as brass. For example, the metallic plate can be primarily coated with nickel and then coated with tin.
As described in the above, each reinforcing tab 30 includes the tab fixing portion 31, the extending portions 34 and the connecting portions 32. When viewed from a bottom, as shown in
The tab fixing portion 31 is inserted to the housing fixing portion 23 from the top side and fixed to the housing 21 in a condition that the engagement between the housing fixing portion 23 and the tab fixing portion 31 is maintained in the predetermined strength. The extending portions 34 extend from ends of the tab fixing portion 31 substantially perpendicular to the tab fixing portion 31.
The connecting portions 32 are located at the ends of the extending portions 34 on the side opposite to the tab fixing portion 31. Thus, the reinforcing tab 30 is connected to the circuit board 10 at two positions. Here, each connecting portion 32 is bent at the bent portion 33 so as to increase the connecting area with the circuit board 10.
The second connecting portion 32b extends from the extending portion 34 in a direction substantially parallel to the tab fixing portion 31. The first connecting portion 32a connects to the second connecting portion 32b through the bent portion 33. For example, the second connecting portion 32b extends in a direction perpendicular to the longitudinal direction of the housing 21. The first connecting portion 32a extends in a direction substantially parallel to the longitudinal direction of the housing 21.
The first connecting portion 32a has the first connecting surface 32a1 on its lower end that is opposed to the circuit board 10, and the second connecting portion 32b has the second connecting surface 32b1 on its lower end that is opposed to the circuit board 10. The first connecting surface 32a1 and the second connecting surface 32b1 connect to each other through the bent portion 33.
The connecting portion 32 has a rectangular shape in a cross-section defined in a direction perpendicular to its axis, e.g., in a cross-section taken along a dashed chain line A1 in
Also, surfaces of the connecting portion 32 that extend along the long side of the rectangular shape of the cross-section are substantially coplanar with surfaces of the extending portion 34 and the fixing portion 31 before the connecting portion 32 is bent at the bent portion 33. After the connecting portion 32 is bent at the bent portion 33, the surfaces of the second connecting portion 32b that extend along the long side of the rectangular shape of the cross-section are substantially coplanar with the surfaces of the extending portion 34 and the fixing portion 31, and these surfaces are also referred to as second surfaces S2, hereafter.
The first groove 33a is formed on the lower end of the bent portion 33 and has a length in a direction in which a thickness of the metallic plate forming the reinforcing tab 30 is measured. That is, the first groove 33a extends in a direction in which the thickness of the metallic plate is measured.
In a condition that the first connecting portion 32a is bent relative to the second connecting portion 32b, the inner surfaces of the first groove 33a are recessed from the first and second connecting surfaces 32a1, 32b1. In other words, the first and second connecting surfaces 32a1, 32b1 are coplanar and do not have projections between them.
In a case that a metallic plate member without having a groove such as the first groove 33a on its end surface is bent, a portion corresponding to the end of the bent portion is likely to expand or project. If a connecting portion having such a projection on the end surface is connected to the circuit board 10, a first connecting surface and a second connecting surface are separated from the circuit board 10 due to the projection. As a result, the connecting area between the connecting portion and the circuit board reduces.
In this embodiment, since the first groove 33a is formed at the position corresponding to the lower end of the bent portion 33, it is less likely that such a projection will be formed when bending the connecting portion 32. Therefore, the first and second connecting surfaces 32a1, 32b1 are sufficiently connected to the circuit board 10. Accordingly, the connection between the reinforcing tab 30 and the circuit board 10 improves.
Further, the connecting portion 32 has the second groove 33b on the side opposite to the first groove 33a. The second groove 33b extends in the direction in which the thickness of the metallic plate is measured, similar to the first groove. Thus, the connecting portion 32 is easily bent at the bent portion 33. However, the second groove 33b is not always necessary.
In the above example, each connecting portion 32 has the substantially L-shape, as shown in
Next, a method of manufacturing the reinforcing tab 30 will be described. First, as shown in
Then, as shown in
Accordingly, since the first and second grooves 33a, 33b are formed before the bending, it is less likely that the ends of the bent portions will be projected outwardly from the connecting surface. As such, the first and second connecting surfaces 32a1, 32b1 are properly connected to the circuit board 10 without causing clearances between the first and second connecting surfaces 32a1, 32b1 and the circuit board 10. Thus, the reinforcing tabs 30 that provide reliable connections with the circuit board 10 are manufactured.
In the example shown in
On the other hand, the width of the first groove 33a may be increased in the direction that the force is applied. Namely, the width of the first groove 33a may be increased from the lower surface, which corresponds to the outer side of the bent, toward the upper surface, which corresponds to the inner side of the bent. Thus, when the reinforcing tab 30 is viewed from the bottom as in
Also, since the first and second groove 33a, 33b are formed on sides of the connecting portion 32, a width of the connecting portion 32 is reduced at the positions corresponding to the first and second grooves 33a, 33b. Therefore, this narrowed portion reduces heat of the solder and the connecting portion 32 from transferring toward the tab fixing portion 31 during the reflow soldering. As such, the solder to be connected with the connecting portions 32 is easily melted during the reflow soldering. Accordingly, the reinforcing tab 30, which is capable of improving the quality of soldering, is produced.
Further, as shown in
It is preferable that both of the first connecting surface 32a1 and the second connecting surface 32b1 are connected to the circuit board 10. However, there may be possibility that the first connecting surface 32a1 or the second connecting surface 32b1 is separated from the circuit board 10 for some reason, which may be caused when the reinforcing tab 30 is formed or when the reinforcing tab 30 is fixed to the housing 21.
For example, as shown in
Further, the above situation also occurs even in the reinforcing tab 30 in which the angle θ1 between the first surface S1 and the second surface S2 is approximately 90°. For example, as shown in
On the other hand, when the connecting portion 32 is formed such that first connecting surface 32a1 is inclined to separate from the circuit board 10 such as by means shown in
Other examples of the connecting structure of the reinforcing tab 30 to the circuit board 10 will be described with reference to
In an example shown in
In an example shown in
In an example shown in
In the examples shown in
Further, the connecting portion 32 can be modified.
As shown in
In the example shown in
In the example shown in
In the example shown in
In the example shown in
In the example shown in
When the connecting portions 32 shown in
Also, the extending portions 34 of the reinforcing tab 30 can be modified. For example, as shown in
Since the extending portions 34 have the narrowed portion 300, the heat of the solder and the connecting portion 32 is restricted from being transferred toward the fixing portion 31 during the reflow soldering for soldering the reinforcing tab 30 with the circuit board 10. Thus, in the reflow soldering, the solder is easily melted and hence the reinforcing tab 30 is properly soldered with the circuit board 10. Here, the narrowed portions 300 can be formed at the same time as punching the base member.
Further, the shape of the reinforcing tab 30 can be modified.
In this case, the connecting area between the reinforcing tab 30 and the circuit board 10 increases. As such, the connection between the reinforcing tab 30 and the circuit board 10 improves, and hence the connector 20 is further securely connected to the circuit board 10 through the reinforcing tab 30.
The reinforcing tab 30 shown in
Also, even in the case in which each connecting portion 32 has one first connecting portion 32a, the first connecting portions 32a1 of the reinforcing tab 30 can be bent in different direction. For example, in the example shown in
In the above discussion, each connecting portion 32 has at least one bent portion 33 and the first groove 33a at the end of the bent portion 33, the end facing the circuit board 10. However, the reinforcing tab 30 is not limited to the above.
For example, as shown in
Thus, the end surface 33d of the bent portion 33 is coplanar with the first and second connecting surfaces 32a1, 32b1. As such, the reinforcing tab 30 without having the projection or expansion at the end of the bent portion 33 is produced. Accordingly, the connection between the reinforcing tab 30 and the circuit board 10 improves.
In the above embodiment, solder as the joining material is applied to surfaces of the lands 11, 12, and the terminals 22 and the reinforcing tabs 30 are soldered to the lands 11, 12 of the circuit board 10 in a reflow oven. Therefore, in addition to the above discussed structure, a positioning projection as disclosed in Japanese Unexamined Patent Publication No. 11-317265 may be provided. For example, as shown in
The shape of the reinforcing tab 30 is not particularly limited to the illustrated shapes, but may have another shape. For example, the reinforcing tab 30 may have one extending portion 34 and one connecting portion 32 at the end of the extending portion 34. Further, the above discussed and illustrated examples may be employed with various combinations.
As discussed in the above, the connection between the connector 20 and the circuit board 10 is improved by the reinforcing tab 30. When the circuit board 10 mounting the connector 20 is employed in the electronic device for a vehicle, it generally receives stress due to heat. Even in such a condition, the connection between the connector 20 and the circuit board 10 is effectively reinforced by the reinforcing tab 30.
The example embodiments of the present invention are described above. However, the present invention is not limited to the above example embodiment, but may be implemented in other ways without departing from the spirit of the invention.
Number | Date | Country | Kind |
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2006-125732 | Apr 2006 | JP | national |