Number | Date | Country | Kind |
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99112538 | Jul 1999 | EP |
This application claims the benefit of U.S. Provisional Application No. 60/147,574, filed Aug. 6, 1999.
Number | Name | Date | Kind |
---|---|---|---|
3724275 | Battaglini et al. | Apr 1973 | A |
4212209 | Newbold et al. | Jul 1980 | A |
4218925 | DiDomizio, Jr. | Aug 1980 | A |
4425799 | Park | Jan 1984 | A |
5457999 | Feldman | Oct 1995 | A |
Entry |
---|
Vincent, J.H., and Humpston, G., “Lead-Free Solders for Electronic Assembly”, 645 The GEC Jouranl of Research, 11 (1994) No. 2, Chelmsford, Essex, GB, vol. II, No. 2, 1994, 14 pages (No month). |
Number | Date | Country | |
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60/147574 | Aug 1999 | US |