Embodiments of the present invention generally relate to a heat exchanger for active cooling and an antenna system having the same.
As mobile communications evolve from 4G to 5G mobile networks, massive-element antenna assemblies have been employed to enable network transmissions at ultra-high speeds with ultra-low latency. However, massive-element antennas increase the amount of heat generated within the antenna assembly due to the increased power consumption associated with the large number of analog devices with the antenna assembly. To compensate for the increased heat associated in the increase in power, larger heat sinks can be utilized. However, the use of large heat sinks undesirably increases the size and weight of the antenna assembly, thus limiting the locations in which such large, heavy, and cumbersome antenna assemblies may be mounted.
Thus, there is a need for an improved antenna system able to efficiently handle heat generated by massive-element antennas devices.
An active cooling heat exchanger and an antenna assembly having the same are described herein that enable a compact antenna design with good thermal management. In one example, a heat exchanger is provided that includes a tube-shaped body having an inside wall, an outside wall, a top surface and a bottom surface. A main cooling volume is defined within the body and includes a first, second and third plenums. The first plenum is formed in the body adjacent the top surface and an inlet formed through the top surface. The second plenum formed in the body and fluidly couples the third plenum to the first plenum. The third plenum formed in the body adjacent the bottom surface and the second plenum. The third plenum has an outlet formed through the bottom surface. A plurality of fins extend into the second plenum with at least some of the plurality of fins being coupled to the outside wall. A passage is formed through the body and bounded by the inside wall. One or more exterior fins are coupled to an exterior side of the outside wall.
In other example, a heat exchanger is provided that includes cylindrical ring-shaped body having an inside diameter wall, an outside diameter wall, a top surface and a bottom surface. The inside diameter wall bounding a passage formed vertically through the body. A main cooling volume is formed in the body between the top surface and the bottom surface. The main cooling volume is disposed proximate to the outside diameter wall. The main cooling volume has an inlet formed through the top surface and an outlet formed through the bottom surface. A return volume is formed in the body adjacent the inside diameter wall and is circumscribed by the main cooling volume. The return volume has an outlet formed through the top surface and an inlet formed through the bottom surface. One or more exterior fins are coupled to an exterior side of the outside diameter wall. A plurality of fins extend into the main cooling volume in an interleaving radial orientation. A plurality of inner fins extend into the passage in a radial orientation from the inside diameter wall.
In yet other example, an antenna system is provide that includes an antenna assembly, a heat exchanger and a pump. The antenna assembly includes an antenna array, a radome disposed over the antenna array, and an active cooling device disposed below the radome and having a passage formed therein for circulating a heat transfer fluid therethrough. The heat exchanger includes a cylindrical ring-shaped body having an inside diameter wall, an outside diameter wall, a top surface and a bottom surface. The inside diameter wall bounding a passage formed vertically through the body. A main cooling volume is formed in the body between the top surface and the bottom surface. The main cooling volume is disposed proximate to the outside diameter wall. An inlet is formed through the top surface and couples the main cooling volume to an outlet the active cooling device of the antenna assembly. An outlet is formed through the bottom surface and couples to the main cooling volume. One or more exterior fins are coupled to an exterior side of the outside diameter wall. A plurality of fins extend into the main cooling volume. The pump is coupled between the outlet of the main cooling volume and an inlet of the active cooling device.
So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements of one embodiment may be beneficially incorporated in other embodiments.
Examples of a heat exchanger and an antenna system having the same are described below that utilize integrated active cooling to provide enhanced temperature management of the solid state components within an antenna assembly of the antenna system. The heat exchanger of the antenna system is decoupled from the antenna assembly (i.e., the heat exchanger and antenna assembly are independent and physically separate units), thus allowing both of the heat exchanger and antenna assembly to be separately constructed in a manner unconstrained from the design constraints of the other. Active cooling integrated into the antenna system allows for improved thermal management of high performance electronics within the antenna assembly without of the bulk of structures/devices that would be required to shed heat directly from the antenna assembly into the ambient environment. Advantageously, the efficient thermal management enables greater processing speeds with lower ultra-high speeds with ultra-low latency without the use of large onboard antenna heat sinks as would be required in conventional devices. Heat removed from the antenna assembly by the active cooling is transferred to a separate and remote heat exchanger where the heat can be efficiently passed to the ambient environment. By making the active cooling of the antenna system remote from the antenna assembly itself, the size and cost of the antenna assembly is beneficially reduced, while the heat exchanger optimized without concern of the weight or size constraints of the detached antenna assembly. Moreover, as the antenna assembly is purposefully designed without having to accommodate onboard heat sinks with active cooling, the size and weight of the antenna assembly is significantly less than conventional designs. The light weight of the antenna assembly is very important for enabling large scale implementation of and reliable performance from massive-element antennas utilized by next generation (e.g., 5G) mobile communication devices without a corresponding need for increase antenna assembly footprint or cost. Furthermore, improved thermal management of the active components and circuits of the antenna circuit board allows a more compact antenna design, thus enabling a smaller, lighter and more desirable antenna footprint, while making cooling simpler and improving the service life.
Turning now to
In addition to the heat exchanger 108 and the antenna assembly 106, the antenna system 100 also includes a pump 110. The pump 110 circulates the heat transfer fluid between the heat exchanger 108 and the antenna assembly 106. In the example depicted in
In the example depicted in
The heat exchanger 108 may be mounted vertically below, vertically above or to one of the sides the antenna assembly 106. The heat exchanger 108 may be also be mounted between the antenna assembly 106 and the structure 102.
The antenna assembly 106 includes a radome 202, a heat sink 204, an antenna array 208, an antenna circuit board 212 and at least one active cooling device 216. The radome 202 is sealingly coupled to the heat sink 204, forming a housing 238 having an interior volume 206 in which the antenna array 208 and the antenna circuit board 212 are disposed. The housing 238 has a top surface 230, a bottom surface 232, an antenna side 234, and a mounting side 236. The mounting side 236 is used to couple the antenna assembly 106 to the structure 102 (shown in
The heat sink 204 is generally fabricated from a metal material, such as aluminum or zinc die case, and is utilized to remove heat generated with the housing 238. The heat sink 204 may include exterior fins, not shown.
The radome 202 is generally fabricated from a material suitable for outdoor use and has a suitable radio frequency (RF) transmission properties, while providing sufficient structural rigidity to inhibit excessive deflection due to wind loading. Suitable materials include, but are not limited to, glass reinforced plastics, thermoplastic compounds, fiberglass, and UV stabilized plastics, such as outdoor grade polyvinyl chloride (PVC).
The antenna array 208 is disposed within the interior volume 206 adjacent to the radome 202. The antenna array 208 generally includes a plurality of radiating elements 210 disposed below the antenna side 234 of the radome 202. In one example, radiating elements 210 are arranged in an 8×8 array. The radiating elements 210 may alternatively different in number and/or arrangement. The radiating elements 210 are generally a metal patch configured to communicate signals on a wireless or mobile network, such as 4G and 5G networks. In one example, the radiating elements 210 are arranged to form a phased array of beam-forming antenna elements 210.
The antenna circuit board 212 generally includes a printed circuit board (PCB) 240 to which at least one chip package 214 is mounted. The chip package 214 includes at least one integrated circuit (IC) die electrically and mechanically mounted to a package substrate (not shown). An optionally interposer (not shown) maybe disposed between the IC die and the package substrate. The chip package 214 is electrically and mechanically mounted to to the PCB 240 utilizing solder balls (not shown) or other suitable connection.
Although only one chip package 214 is illustrated in
The antenna circuit board 212 generally includes passive circuit components (not shown), control circuitry, a power supply, and an array of transceivers. The control circuitry and the array of transceivers may be embodied on the circuitry of the one or more chip packages 214 mounted to the PCB 240.
The control circuitry residing in the chip package 214 is coupled to the power supply and to the transceivers residing in the antenna assembly 106. The control circuitry is also coupled to one or more data ports formed on the PCB 240. The data ports enable the antenna assembly 106 to communicate with an external electronic device, such as a base band unit of a cell site. The control circuitry residing in the chip package 214 includes processors or other digital logic for processing signals that may be produced and/or received by the antenna array 208.
The power supply is similarly coupled to the control circuitry and to the transceivers. The power supply is also coupled to one or more power ports formed on the PCB 240. The power ports allow the antenna assembly 106 to received power from an external power source, such as a generator or the electrical grid.
The transceivers are coupled to the power supply, the control circuitry and the antenna array 208. The transceivers include circuitry having at least one or more of digital-to-analog converters (DAC), analog-to-digital converters (ADC), filters, modulators and high-performance RF front ends. The RF front ends are coupled to the individual radiating elements of the antenna array.
The exposed surface of the chip package 214 faces the heat sink 204. Thermal interface material (TIM) is disposed between the chip package 214 and the heat sink 204 such that a conductive heat transfer path is established through the TIM between the chip package 214 and the heat sink 204. The TIM may be a thermal gel, thermal epoxy, thermal grease, thermally conductive epoxy, phase-change materials (PCMs), conductive tapes, and silicone-coated fabrics among other suitable materials.
As disclosed above, at least one active cooling device 216 is utilized in the antenna assembly 106 to remove heat generated by the circuitry and devices disposed within the housing 238. In one example, an active cooling device 216 is present in or in contact with the head sink 204. The active cooling device 216 includes a conduit 226 for flowing a heat transfer fluid therethrough, with the ends of the conduit 226 providing the inlet and outlet ports of the active cooling device 216. The conduit 226 of the active cooling device 216 is fluidly coupled to ports 220 formed in the housing 238. The ports 220 are adapted to sealing connect to the conduits 112, 114 so that the heat transfer fluid may be pumped through the head sink 204, the heat exchanger 108 and antenna assembly 106 to cool the chip package 214 and other components disposed within the antenna assembly 106.
In another example, an active cooling device 216 is present between the chip package 214 and the head sink 204. This cooling device 216 may be utilized in addition or alternatively to the cooling device 216 disposed in the heat sink 204. The active cooling device 216 includes a conduit 218 for flowing a heat transfer fluid therethrough. The conduit 218 of the active cooling device 216 is fluidly coupled to ports 220 formed in the housing 238. The ports 220 are adapted to sealing connect to the conduits 112′, 114′ so that the heat transfer fluid may be pumped through the heat exchanger 108 and antenna assembly 106 to cool the chip package 214 disposed within the antenna assembly 106.
It is contemplated that an active cooling device 216 may be present in another location in or in contact with the housing 238.
The heat exchanger 108 also includes one or more outer heat transfer fins 312. In the example of
The generally horizontal or near horizontal orientation of the outer heat transfer fins 312 effectively promotes good air circulation horizontally around the body 302 when surface air (e.g., wind) is present in the environment in which the antenna system 100 is disposed. The air circulation horizontally around the body 302 along and between the outer heat transfer fins 312 enhances heat transfer away from the body 302, thus beneficially increasing the heat transfer efficiency of the heat exchanger 108.
Continuing to refer to
The main cooling volume 408 has an inlet port 430 and an outlet port 432. The inlet port 430 is coupled to the outlet conduit 112 via a fitting 440 to allow heat transfer fluid exiting the active cooling element(s) 116 of the antenna assembly 106 to be received in the main cooling volume 408 of the heat exchanger 108. The outlet port 432 is coupled to the pump inlet conduit 116 via a fitting 440 to allow heat transfer fluid exiting the heat exchanger 108 to be routed to the inlet of the pump 110.
The main cooling volume 408 includes a first plenum 412, a second plenum 414 and a third plenum 416. The first plenum 412 is bounded on one side by the top surface 304 and on the other side by the second plenum 414. The first plenum 412 is also bounded on one side by the outside diameter wall 402 and on the other side by the interior wall 418. The first plenum 412 may be a cylindrical ring, or have another suitable shape. The inlet port 430 is formed through the top surface 304 and is open to the first plenum 412.
The second plenum 414 is bounded on one side by the first plenum 412 and on the other side by the third plenum 416. The second plenum 414 is also bounded on one side by the outside diameter wall 402 and on the other side by the interior wall 418. The second plenum 414 may be a cylindrical ring, or have another suitable shape. The second plenum 414 generally includes a plurality of main heat transfer fins 428. The main heat transfer fins 428 may extend into the second plenum 414 from one or both of the outside diameter wall 402 or the interior wall 418. The main heat transfer fins 428 are generally configured to allow the flow of heat transfer fluid to pass from the first plenum 412 through the second plenum 414 to the third plenum 416.
The third plenum 416 is bounded on one side by the bottom surface 306 and on the other side by the second plenum 414. The third plenum 416 is also bounded on one side by the outside diameter wall 402 and on the other side by the interior wall 418. The third plenum 416 may be a cylindrical ring, or have another suitable shape. The outlet port 432 is formed through the bottom surface 306 and is open to the third plenum 416.
The return volume 410 has an inlet port 434 and an outlet port 436. The inlet port 434 is coupled to the pump outlet conduit 118 via a fitting 440 to allow heat transfer fluid exiting the outlet of the pump 110 to be received in the return volume 410 of the heat exchanger 108. The outlet port 436 is coupled to the inlet conduit 114 via a fitting 440 to allow heat transfer fluid exiting the heat exchanger 108 to be routed to the active cooling element(s) 116 of the antenna assembly 106.
The return volume 410 includes a fourth plenum 422, a fifth plenum 424 and a sixth plenum 426. The fourth plenum 422 is bounded on one side by the bottom surface 306 and on the other side by the fifth plenum 424. The fourth plenum 422 is also bounded on one side by the inside diameter wall 404 and on the other side by the interior wall 418. The fourth plenum 422 may be a cylindrical ring, or have another suitable shape. The inlet port 434 is formed through the bottom surface 306 and is open to the fourth plenum 422.
The fifth plenum 424 is bounded on one side by the fourth plenum 422 and on the other side by the sixth plenum 426. The fifth plenum 424 is also bounded on one side by the inside diameter wall 404 and on the other side by the interior wall 418. The fifth plenum 424 may be a cylindrical ring, or have another suitable shape. The fifth plenum 424 may optionally include a plurality of interior heat transfer fins 420 (shown in phantom). The interior heat transfer fins 420 may extend into the fifth plenum 424 from one or both of the inside diameter wall 404 or the interior wall 418. The interior heat transfer fins 420 are generally configured to allow the flow of heat transfer fluid to pass from the fourth plenum 422 through the fifth plenum 424 to the sixth plenum 426.
The sixth plenum 426 is bounded on one side by the top surface 304 and on the other side by the fifth plenum 424. The sixth plenum 426 is also bounded on one side by the inside diameter wall 404 and on the other side by the interior wall 418. The sixth plenum 426 may be a cylindrical ring, or have another suitable shape. The outlet port 436 is formed through the top surface 304 and is open to the sixth plenum 426.
Also illustrated in phantom in
In
Additionally illustrated in
In
The surface area of the inner heat transfer fins 502 may be substantially uniform across different regions of the fins 502. For example, the surface area of the inner heat transfer fins 502 in a region proximate to the bottom surface 306 of the body 302 may have the same surface area as a region of the inner heat transfer fins 502 proximate to the top surface 304 of the body 302. Alternatively, the surface area of the inner heat transfer fins 502 may be different across different regions of the fins 502. For example and as shown in
Thus, the antenna system described above provides improved thermal management of high performance electronics within the antenna assembly. Advantageously, the efficient thermal management enables greater processing speeds with lower ultra-high speeds with ultra-low latency, while enabling a beneficial reduction in the size, weight and cost of the antenna assembly.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
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