Subject matter described herein is similar to subject matter described in U.S. patent application Ser. No. 12/428,806, filed on Apr. 23, 2009, and entitled “CONNECTOR ASSEMBLIES AND SYSTEMS INCLUDING FLEXIBLE CIRCUITS”, which is incorporated by reference in the entirety.
The subject matter herein relates generally to interconnecting circuit boards, and more particularly, to electrical connector assemblies that are configured to electrically couple arrays of contacts.
Some electrical systems, such as servers, routers, and data storage systems, utilize connector assemblies for transmitting signals and/or power through the electrical system. Such connector assemblies typically include a backplane or a midplane circuit board, a motherboard, and a plurality of daughter cards. The connector assemblies also include one or more electrical connectors that are attached to the circuit board(s) for interconnecting the daughter cards to the circuit board(s) when the daughter card is inserted into the electrical system. Each daughter card includes a header or receptacle assembly having a mating face that is configured to connect to a mating face of the electrical connector. The header/receptacle assembly is typically positioned on or near a leading edge of the daughter card. Prior to being mated, the mating faces of the header/receptacle assembly and the electrical connector are aligned with each other and face each other along a mating axis. The daughter card is then moved in an insertion direction along the mating axis until the mating faces engage and mate with each other.
The conventional backplane and midplane connector assemblies provide for interconnecting the daughter cards to the backplane or midplane circuit board by moving the daughter card in an insertion direction which is the same as the mating direction. In some cases it may be desirable to mate the daughter card in a mating direction that is perpendicular to the insertion direction. However, when the header/receptacle assembly is on a surface of the daughter card and faces a direction perpendicular to the insertion direction and the electrical connector is on the backplane circuit board and also faces a direction perpendicular to the insertion direction, the daughter card and the backplane circuit board may be misaligned and unable to connect. In addition, connector assemblies that include a backplane or midplane circuit board may affect the electrical system's cooling capabilities by, for example, limiting airflow through the system.
Accordingly, there is a need for an electrical connector assembly that facilitates interconnection of circuit boards that are oriented in an orthogonal relationship. Furthermore, there is also a need for alternative electrical connector assemblies that are capable of connecting daughter cards to a backplane or midplane circuit boards of the subject systems.
In one embodiment, a removable card connector assembly configured to be inserted into and engage an electrical system is provided. The card connector assembly includes a circuit board that has a surface extending along a board plane in a longitudinal direction. The card connector assembly also includes an electrical connector assembly that is coupled to the circuit board. The electrical connector assembly includes a flexible circuit and a moveable contact array of mating contacts that are coupled to the flexible circuit. The moveable contact array is configured to engage a system contact array of mating contacts in the electrical system. The card connector assembly also includes a coupling mechanism that is configured to move the moveable contact array between a retracted position, at which the moveable contact array is located remotely from the system contact array, and an engaged position, at which the moveable and system contact arrays are engaged with one another. The mating contacts of the moveable contact array are arranged along a contact plane that extends in the longitudinal direction when in the engaged position.
In another embodiment, an electrical system is provided that includes an electrical component that has a system contact array of mating contacts extending along a surface thereof. The electrical system also includes at least one removable card connector assembly that is configured to be inserted alongside and engage the electrical component. The card connector assembly includes a circuit board that has a surface extending along a board plane in a longitudinal direction and an electrical connector assembly coupled to the circuit board. The electrical connector assembly includes a flexible circuit and a moveable contact array of mating contacts coupled to the flexible circuit. The moveable contact array is configured to engage the system contact array of mating contacts. The card connector assembly also includes a coupling mechanism that is configured to move the moveable contact array between a retracted position, at which the moveable contact array is located remotely from the system contact array, and an engaged position, at which the moveable and system contact arrays are engaged with one another. The mating contacts of the moveable contact array are arranged along a contact plane that extends in the longitudinal direction when in the engaged position.
However, the electrical system 100 shown in
When the card connector assembly 102 and the primary circuit board 104 are to be engaged, the card connector assembly 102 may be advanced along the surface 105 in a longitudinal mating direction (i.e., along a longitudinal axis 180). For example, the card connector assembly 102 may slidably engage guiding features 115, which are illustrated as rails in
As shown in
As used herein, the term “contact array” includes a plurality of mating contacts arranged in a predetermined configuration and held together by a common base material or structure. For example, a contact array may include or be part of a printed circuit or an interposer. A variety of mating contacts may be used in the contact arrays, including contacts that are stamped and formed, etched and formed, solder balls, pads, press-fit contacts, and the like. In some embodiments, the mating contacts form a planar array (i.e., the mating contacts are co-planar with respect to each other), but the mating contacts may form other arrangements in alternative embodiments. For example, the contact array may have multiple sub-arrays of mating contacts where each sub-array extends along a different plane.
As used herein, “removably coupled” means that the two coupled components, such as the mating side 112 and the primary circuit board 104, may be readily separated from and coupled to each other without destroying or damaging either of the components or corresponding mating contacts. As used herein, a “removable card connector assembly” is a card connector assembly that is configured to be positioned within an electrical system in a predetermined orientation and be removably coupled to an electrical component, such as the primary circuit board 104. A removable card connector assembly may be sized and shaped so that the card connector assembly may be carried and inserted/removed by an operator or an automated machine. Furthermore, a removable card connector assembly may have sufficient structure to withstand repeated insertions and removals from a corresponding electrical system without damaging the card connector assembly.
The term “printed circuit,” as used herein, includes any electric circuit in which the conducting connections have been printed or otherwise deposited in predetermined patterns on an insulating base. For example, a printed circuit may be a circuit board, an interposer made with printed circuit board material, a flexible circuit, a substrate having one or more layers of flexible circuit therealong, and the like. In the illustrated embodiment, the contact arrays 118 and 120 are part of printed circuits. More specifically, the contact array 118 may be part of an interposer manufactured from PCB and the contact array 120 may be part of the primary circuit board 104. A “flexible circuit” (also called flex circuit), as used herein, includes a printed circuit having an arrangement of conductors embedded within or between flexible insulating material(s). For example, the flexible circuit(s) 116 is configured to convey an electrical current between the primary and secondary circuit boards 104 and 106. As shown in
In some embodiments, the flexible circuit 116 may be attached to a rigid substrate or may form a rigid substrate in order to provide structural support for the flexible circuit along predetermined portions. The rigid substrate may also facilitate holding and moving the contact arrays. For example, the contact arrays 118 may be located along a rigid substrate. The rigid substrate may be a circuit board.
An “interposer,” as used herein, includes a planar body having opposing sides with corresponding contact arrays and a plurality of conductive pathways extending therebetween to connect the contact arrays. An interposer may be a printed circuit where mating contacts are etched and formed along two opposing sides of a circuit board. The circuit board may have conductive pathways coupling each mating contact to a corresponding mating contact on the other side. However, in other embodiments, the interposer might not be printed circuit. For example, an interposer may include a carrier having a planar body with a plurality of holes extending therethrough. Stamped and formed mating contacts may be arranged by the carrier such that each mating contact is positioned within a corresponding hole. The mating contacts may interface with one circuit board on one side of the carrier and have ball contacts that are soldered to another circuit board on the other side of the carrier. Furthermore, an interposer may take other forms.
Returning to
As shown in
More specifically, the primary circuit board 104 has the board surface 105 and the contact array 118 has a mating surface 128 that may extend adjacent to and substantially parallel to the board surface 105 (i.e., the mating surface 128 faces the board surface 105). As will be discussed further below, the contact array 118 may be held and moved toward the primary circuit board 104 until the corresponding mating contacts 122 and 132 are engaged. As such, the contact array 118 may be removably coupled to or engaged with the primary circuit board 104.
In the illustrated embodiment, the mating surface 128 and the board surface 105 extend substantially parallel to one other while in the engaged and retracted positions 192 and 190 and in any position therebetween. The contact array 118 may form a contact plane 193 that is substantially parallel to a board plane 195 formed by the board surface 105 and/or the mating contacts 122. As such, each mating contact 132 may be aligned with the corresponding mating contact 122, but spaced apart from the corresponding mating contact 122 by substantially the same distance D1. When the contact array 118 is moved toward the primary circuit board 104 in a linear manner along the vertical axis 184, the distance D1 that separates the corresponding mating contacts 122, and 132 decreases until the mating contacts 132 and mating contacts 122 are engaged.
In alternative embodiments, the contact array 118 may be moved toward and engage the primary circuit board 104 in a non-linear manner. For example, the board surface 105 and the mating surface 128 may be parallel, but the contact array 118 may approach the primary circuit board 104 at an angle such that the mating contacts 122 and mating contacts 132 become aligned when the contact array 118 reaches the engaged position 192. In another alternative embodiment, the board surface 105 and the mating surface 128 may not be parallel when in the retracted position 190, but may become aligned and parallel with each other when the contact array 118 is in the engaged position 192.
In
In the illustrated embodiment, the mating contacts 132 include resilient beams 131 that flex to and from the mating surface 128. The resilient beams 131 resist deflection and exert a resistance force FR in a direction away from the mating surface 128. As such, the resilient beams 131 may compensate for slight misalignment between the contact array 118 of mating contacts 132 and the contact array 120 of mating contacts 122 when the contact array 118 is moved into the engaged position 192.
In alternative embodiments, the resilient beams 131 of the mating contacts 132 may be bifurcated or the mating contacts 132 may include two separate beams that project toward each other or in opposite directions. The dual-beam mating contacts 132 may be configured to engage one corresponding mating contact 122. As such, the bifurcated beam or the dual-beam mating contacts 132 may have two separate contact points with the corresponding mating contact 122. Also, in other alternative embodiments, the mating contacts 132 may be rounded protrusions or pads that project away from the mating surface 128.
The contact array 162 may include, for example, a flex circuit 163 that is coupled to a substrate or stiffener 165. The contact array 162 has an array 170 of mating contacts 172 that are configured to engage the mating contacts 166 on the mating surface 168. The secondary circuit board 160 may have a contact array 174 of mating contacts 175 configured to engage the mating contacts 156 on the mating surface 158. As shown, when the contact arrays 152 and 162 and the secondary circuit board 160 are moved to the engaged position 178, the mating contacts 156 engage the mating contacts 175 and the mating contacts 166 engage the mating contacts 172. As such, the contact array 152 may be an intervening electrical component that is sandwiched between the secondary circuit board 160 and the contact array 162 to establish an electrical connection therebetween.
Also, the electrical connector assembly 110 includes the circuit assembly 114 that includes the flexible circuits 116 (indicated by phantom lines in
However, in alternative embodiments, a shorter dimension (e.g., a width) of the contact plane 193 may extend parallel to the longitudinal axis 180. For instance, the length L1 of the electrical connector assembly 110 may be positioned proximate to and oriented to extend along the side edge 125 (shown in
With reference to
The contact arrays 118 and 213 and the flexible circuit 116 of the circuit assembly 114 may be molded together into one unit. The contact array 213 may be an interposer that engages the flexible circuit 116 on one side of the interposer and engages the secondary circuit board 106 (
The mating side 112 includes the contact array 118, a substrate 260, and a panel 262 that are all fastened together (e.g., with screws or adhesives) and extend substantially parallel to the axis 290 of the axle 230. The contact array 118 in
Also shown in
Also shown in
In some embodiments, the alignment feature(s) have a fixed position with respect to an array of mating contacts on a corresponding electrical component (e.g., the contact array 118 or the primary circuit board 104). Although
In some embodiments, the mating side 112 may float with respect to the header 210 (
Furthermore, in embodiments where the mating contacts 132 include resilient beams 131 (
Alternative alignment mechanisms may be used. For example, the alignment projection 288 may be a cylindrical pin that projects from the mating side 112. The primary circuit board 104 may have a conical or funnel-like aperture with a hole at the bottom configured to receive the pin. When the contact array 118 is moved toward the primary circuit board 104, the pin may engage the surface of the conical aperture and be directed toward the hole where the pin is eventually received. As such, this alternative alignment mechanism may operate similarly to the illustrated mechanism described above. In addition, the alignment projection 288 may have other shapes (e.g., pyramid, semi-spherical).
In other alternative embodiments, the primary circuit board 104 may have the alignment projection 288 and the mating side 112 may have the corresponding aperture 311. Furthermore, alternative embodiments may use multiple alignment features on each end or both ends of the primary circuit board 104 and the mating side 112. For example, the mating side 112 may have one alignment projection 288 configured to engage an aperture 311 in the primary circuit board 104 and also one aperture 311 configured to receive an alignment projection 288 from the primary circuit board 104.
Also, although not shown, the alignment features may also be a frame or other guiding structure that engages an edge or projection when the contact array 118 approaches the primary circuit board 104. The frame and the edge (or projection) have fixed positions with respect to their corresponding contacts. More specifically, a frame may surround the contact array 120 and project from the primary circuit board 104. When the contact array 118 approaches the primary circuit board 104, an edge (or projection) of the contact array 118 may engage the frame. The frame may be shaped to redirect the contact array 118 if the contact array 118 approaches the primary circuit board 104 along a misaligned path so that the corresponding contacts engage. Alternatively, the contact array 118 or the connector assembly 110 may have a frame or other guiding structure and the primary circuit board 104 may have an edge or projection. Similar to above, when the contact array 118 approaches the primary circuit board 104, the frame may engage the edge and redirect the contact array 118 so that the corresponding contacts engage.
Accordingly, if the mating contacts are misaligned as the contact array 118 approaches the primary circuit board 104, the mating side 112 may float with respect to the primary circuit board 104 in order to align and engage the mating contacts. The springs 264 allow the mating side 112 to move in various directions. Moreover, the springs 264 may be configured to provide an outward mating force in the mating direction M to maintain the electrical connection between the mating contacts 132 of the contact array 118 and the mating contacts 122 of the primary circuit board 104.
In the illustrated embodiment, the card connector assembly 402 is a server blade that is configured to be slidably engaged or coupled to a mother board of a server system (not shown). For example, the card connector assembly 402 may have guiding features 440 and 442 for slidably coupling to corresponding features or elements within the server system. In
The electrical connector assembly 410 includes a mating side 412 that is configured to be removably coupled to a surface 405 (shown in
Prior to inserting the card connector assembly 402 (
The electrical connector assembly 510 may be similarly constructed as the electrical connector assemblies 110 and 410. However, the electrical connector assembly 510 is configured to move the mating side 512 in a linear manner away from the secondary circuit board 506. In such configurations, for example, the mating side 512 may be positioned where the non-mating side 253 (
Accordingly, embodiments described herein may be used to interconnect primary and secondary circuit boards that extend along respective planes that are perpendicular to one another or parallel to one another. Furthermore, in alternative embodiments, the primary and secondary circuit boards may be oriented in other positional relationships.
Thus, it is to be understood that the above description is intended to be illustrative, and not restrictive. As such, many other electrical connector assemblies and coupling mechanisms may be used that electrically couple an array of mating contacts to another array of mating contacts other than the electrical connector assemblies and the coupling mechanism described above. For example, the electrical connector assembly and coupling mechanisms may be like the electrical connector assemblies and coupling mechanisms described in U.S. patent application Ser. No. 12/428,806, which is incorporated by reference in the entirety.
In addition, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. Furthermore, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third.” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
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