Claims
- 1. A removable male mandrel for composite resin transfer molding processes, said male mandrel comprising:
- a. a foam that is dimensionally stable at a first temperature;
- b. said foam capable of irreversibly shrinking to less than about 0.5 said foam's original size at a second temperature that is above said first temperature; and
- c. said foam encapsulated by a non-stick elastomer skin.
- 2. The removable male mandrel as recited in claim 1 wherein the foam comprises a maleic anhydride-styrene copolymer.
- 3. The removable male mandrel as recited in claim 1 wherein the elastomer skin comprises a silicone polymer.
- 4. The removable male mandrel as recited in claim 1 wherein the elastomer skin is about 3.05 millimeters to about 6.35 millimeters thick.
- 5. The removable male mandrel as recited in claim 1 wherein the first temperature is about 107.degree. C. to about 149.degree. C.
- 6. The removable male mandrel as recited in claim 1 wherein the second temperature is about 149.degree. C. to about 177.degree. C.
- 7. A resin transfer composite matched mold comprising a male mandrel and a female mold having a cavity wherein the improvement comprises said male mandrel comprising:
- a. a foam that is dimensionally stable at a first temperature of about 107.degree. C. to about 149.degree. C.;
- b. said foam capable of irreversibly shrinking to less than about 0.5 said foam's original size at a second temperature of about 149.degree. C. to about 177.degree. C.; and
- c. said foam encapsulated by a non-stick elastomer skin.
- 8. A composite resin transfer molding process comprising placing a fiber covered male mandrel in a female mold cavity injecting said female mold cavity with a resin and curing the resin at its cure temperature comprising:
- a. forming a male mandrel from a foam
- (i) that is dimensionally stable at a first temperature which corresponds to said resin's cure temperature;
- (ii) said foam capable of irreversibly shrinking to less than about 0.5 said foam's original size at a second temperature that is above said first temperature;
- b. encapsulating said foam male mandrel with a non-stick elastomer at a third temperature;
- c. covering said elastomer encapsulated foam with fibers;
- d. placing said fiber covered elastomer encapsulated foam in a female mold cavity;
- e. injecting said female mold cavity with a resin;
- f. curing said resin and said fibers at said first temperature to form a composite component;
- g. removing said female mold cavity from said composite component;
- h. irreversibly shrinking said elastomer encapsulated foam male mandrel to less than about 0.5 said elastomer encapsulated foam's original size by raising the temperature to said second temperature; and
- i. withdrawing said irreversibly shrunken elastomer encapsulated foam male mandrel from said composite component.
- 9. The resin transfer molding process as recited in claim 8 wherein said foam male mandrel is formed by molding.
- 10. The resin transfer molding process as recited in claim 8 wherein said first temperature is about 107.degree. C. to about 149.degree. C.
- 11. The resin transfer molding process as recited in claim 8 wherein said second temperature is about 149.degree. C. to about 177.degree. C.
- 12. The resin transfer molding process as recited in claim 8 wherein said third temperature is about room temperature to about 122.degree. C.
- 13. The resin transfer molding process as recited in claim 8 wherein said foam is encapsulated with said non-stick elastomer by casting.
- 14. The resin transfer molding process as recited in claim 8 wherein said elastomer encapsulated foam is wrapped with fibers.
- 15. The resin transfer molding process as recited in claim 8 wherein said foam mandrel comprises a maleic anhydride-styrene copolymer.
- 16. The resin transfer molding process as recited in claim 8 wherein said non-stick elastomer comprises a silicone polymer.
- 17. The resin transfer molding process as recited in claim 8 wherein said fibers are resin impregnated fibers.
- 18. The resin transfer molding process as recited in claim 8 wherein said resin comprises an epoxy resin.
Government Interests
This effort was sponsered by the United States Government.
US Referenced Citations (6)