Claims
- 1. A method of replicating a surface, the method comprising the steps of:
a. providing a rigid substrate having positioning features; b. providing a plurality of relief structures each having a relief geometry and a positioning feature complementary to the substrate positioning features; c. joining the relief structures to the substrate by mating the substrate positioning features and the relief-structure positioning features, thereby forming a relief master; and d. replicating the relief master.
- 2. The method of claim 1 wherein the substrate positioning features are holes and the relief-structure positioning features are shafts received in the holes.
- 3. The method of claim 1 wherein the replicating step comprises:
a. fabricating a mold complementary to the relief master; and b. using the mold to repetitively form surfaces corresponding to the relief master.
- 4. The method of claim 3 wherein the using step comprises casting from the mold.
- 5. The method of claim 3 wherein the using step comprises embossing with the mold.
- 6. The method of claim 3 wherein the using step comprises injection molding with the mold.
- 7. The method of claim 1 wherein the replicating step comprises:
a. fabricating a mold complementary to the relief master; and b. using the mold to repetitively form surfaces corresponding to the relief master.
- 8. The method of claim 7 wherein the using step includes electroforming.
- 9. The method of claim 7 wherein the using step includes mechanical deformation.
- 10. The method of claim 1 wherein the feature elements are identical and produced by molding.
- 11. The method of claim 2 wherein the substrate positioning features are blind holes.
- 12. The method of claim 2 wherein the substrate positioning features are through-holes.
- 13. The method of claim 2 wherein the holes have sloping sidewalls.
- 14. The method of claim 1 wherein the wherein the substrate positioning features and the relief-structure positioning features are off-round to facilitate alignment of the relief structures with respect to the substrate.
- 15. The method of claim 1 wherein the joining step is preceded by a step of inducing dimensional disparity between the relief structures and the substrate by differential temperature-dependent expansion or contraction thereof.
- 16. The method of claim 1 wherein the joining step further comprises using an adhesive to retain the relief structures on the substrate.
- 17. The method of claim 1 wherein the joining step comprises friction-fitting the relief-structure positioning features with the substrate positioning features.
- 18. The method of claim 1 wherein the joining step is achieved using a pick-and-place insertion device.
- 19. A relief master comprising (a) a rigid substrate having positioning features and (b) a plurality of identical relief structures each having a relief geometry and a positioning feature complementary to the substrate positioning features, the relief structures being joined to the substrate and forming a surface pattern by mating of the substrate positioning features and the relief-structure positioning features.
- 20. The relief master of claim 19 wherein the substrate positioning features are holes and the relief-structure positioning features are shafts received in the holes.
- 21. The relief master of claim 19 wherein the substrate positioning features are blind holes.
- 22. The relief master of claim 19 wherein the substrate positioning features are through-holes.
- 23. The relief master of claim 20 wherein the holes have sloping sidewalls.
- 24. The relief master of claim 20 wherein the wherein the substrate positioning features and the relief-structure positioning features are off-round to facilitate alignment of the relief structures with respect to the substrate.
- 25. The relief master of claim 20 wherein the relief structures are retained on the substrate by an adhesive.
- 26. The relief master of claim 20 wherein the relief structures are retained on the substrate by friction.
RELATED APPLICATION
[0001] This application claims the benefits of U.S. Provisional Application Serial No. 60/309,663, filed on Aug. 2, 2001, the entire disclosure of which is hereby incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60309663 |
Aug 2001 |
US |