Claims
- 1. A thermosetting resin composition comprising the following components:
- (a) from about 0.5 to 40% by weight of a fluorinated polymer having a hydroxyl group and/or an acid group, represented by ##STR4## wherein said R.sub.1 represents a linear or branched alkyl group or an alkyloyl group, having 2 to 10 carbon atoms, R.sub.2 represents an alkylene group having 2 to 10 carbon atoms, R.sub.3 represents a hydrogen atom or --CO--R.sub.6 --COOH in which R.sub.6 represents a residue of a dibasic acid anhydride, X is a hydrogen atom, a chlorine atom or a fluorine atom, a, b and c are integers satisfying a.ltoreq.b+c,
- (b) from about 10 to 60% by weight of a polymer having a carboxyl group and a carboxylic ester, prepared by copolymerizing from about 15 to 40% by weight of an ethylenically unsaturated monomer having an acid anhydride group, and from about 60 to 85% by weight of another ethylenically unsaturated copolymerizable monomer to obtain a polymer having acid anhydride groups which are then reacted with a hydroxyl compound having 1 to 12 carbon atoms in a molar ratio of acid anhydride group to hydroxyl group of from about 1/1 to 1/1.5; % by weight of monomers being based on total monomer weight, and
- (c) from about 30 to 60% by weight of a polymer having a hydroxyl group and an epoxy group, prepared by copolymerizing
- (i) from about 5 to 40% by weight of a hydroxyalkyl (meth)acrylate represented by: ##STR5## wherein R represents a hydrogen atom or a methyl group and n is an integer of 2 to 8,
- (ii) from about 10 to 60% by weight of an epoxy group-containing ethylenically unsaturated monomer, and
- (iii) from about 0 to 85% by weight of another copolymerizable ethylenically unsaturated monomer; the % by weight being based on total monomer weight.
- 2. The thermosetting resin composition according to claim 1 further comprising (d) a quaternary ammonium salt as catalyst.
- 3. The thermosetting resin composition according to claim 1 further comprising (d) an organic tin compound as catalyst.
- 4. A coating composition comprising, as film-forming component, the thermosetting resin composition according to claim 1.
- 5. The resin composition according to claim 1 wherein the component (a) polymer is represented by ##STR6## wherein R.sub.1 represents an alkyl group having 2 to 8 carbon atoms and an alkyloyl group having 2 to 8 carbon atoms, R.sub.2 represents a linear or branched alkylene group having 2 to 8 carbon atoms, R.sub.3 represents a hydrogen atom, or --CO--R.sub.6 --COOH and R.sub.6 represents a residue of a dibasic acid anhydride selected from the group consisting of an alkenylene group, an alkylene and a cycloalkylene which all have 2 to 8 carbon atoms.
- 6. The resin composition according to claim 1 wherein the carboxylic ester of the component (b) polymer has 1 to 8 carbon atoms.
- 7. The resin composition according to claim 1 wherein the component (c) polymer has an average of 2 to 10 epoxy groups and an average 2 to 12 hydroxyl groups.
- 8. The resin composition according to claim 1 wherein the component (a) polymer has:
- (a) a number average molecular weight of 500 to 10,000,
- (b) a hydroxyl value of 20 to 150 mg KOH/g, and
- (c) an acid value of 60 to 180 mg KOH/g.
- 9. The resin composition according to claim 8 wherein the component (b) polymer has:
- (a) a number average molecular weight of 500 to 20,000, and
- (b) at least two acid anhydride groups in one molecule.
- 10. The resin composition according to claim 8 wherein the component (c) polymer has:
- (a) an epoxy equivalent of 100 to 800,
- (b) a hydroxyl equivalent of 200 to 1,200, and
- (c) a number average molecular weight of 500 to 20,000.
- 11. The resin composition according to claim 1 wherein a molar ratio of total acid groups in component polymers (a) and (b)/epoxy groups in component polymer (c) is from about 1/0.6 to 1/1.2.
- 12. The resin composition according to claim 1 wherein a molar ratio of total hydroxyl groups in component polymers (a) and (c)/acid groups in component polymers (b) is within the range of from about 1/2 to 2/1.
- 13. The resin composition according to claim 1, further comprising a curing catalyst for effecting reaction between acid and epoxy groups.
- 14. A thermosetting resin composition comprising the following components:
- (a) from about 0.5 to 40% by weight of a fluorinated polymer having a hydroxyl group and/or an acid group, represented by ##STR7## wherein said R.sub.1 represents a linear or branched alkyl group or an alkyloyl group, having 2 to 10 carbon atoms, R.sub.2 represents an alkylene group having 2 to 10 carbon atoms, R.sub.3 represents a hydrogen atom or --CO--R.sub.6 --COOH in which R.sub.6 represents a residue of a dibasic acid anhydride, X is a hydrogen atom, a chlorine atom or a fluorine atom, a, b and c are integers satisfying a.ltoreq.b+c, said polymer having a number average molecular weight of from about 500 to 10,000, a hydroxyl value of 20 to 150 mg KOH/g, and acid number of 60 to 180 mg KOH/g,
- (b) from about 10 to 60% by weight of a polymer having a carboxyl group and a carboxylic ester, prepared by copolymerizing from about 15 to 40% by weight of an ethylenically unsaturated monomer having an acid anhydride group, and from about 60 to 85% by weight of another ethylenically unsaturated copolymerizable monomer to obtain a polymer having acid anhydride groups which are then reacted with a hydroxyl compound having 1 to 12 carbon atoms in a molar ratio of acid anhydride group to hydroxyl group of from about 1/1 to 1/1.5; % by weight of monomers being based on total monomer weight and said polymer having a number average molecular weight of 500 to 20,000, and at least two acid anhydride groups in one molecule, and
- (c) from about 30 to 60% by weight of a polymer having a hydroxyl group and an epoxy group, prepared by copolymerizing
- (i) from about 5 to 40% by weight of a hydroxyalkyl (meth)acrylate represented by: ##STR8## wherein R represents a hydrogen atom or a methyl group and n is an integer of 2 to 8,
- (ii) from about 10 to 60% by weight of an epoxy group-containing ethylenically unsaturated monomer, and
- (iii) from about 0 to 85% by weight of another copolymerizable ethylenically unsaturated monomer; the % by weight being based on total monomer weight; said (c) polymer having an epoxy equivalent of 100 to 800, a hydroxyl equivalent of 200 to 1,200 and a number average molecular weight of 500 to 20,000.
- 15. A thermosetting resin composition comprising the following components:
- (a) from about 0.5 to 40% by weight of a fluorinated polymer having a hydroxyl group and/or an acid group, represented by ##STR9## wherein said R.sub.1 represents a linear or branched alkyl group or an alkyloyl group, having 2 to 8 carbon atoms, R.sub.2 represents an alkylene group having 2 to 8 carbon atoms, R.sub.3 represents a hydrogen atom or --CO--R.sub.6 --COOH in which R.sub.6 represents a residue of a dibasic acid anhydride, X is a hydrogen atom, a chlorine atom or a fluorine atom, a, b and c are integers satisfying a.ltoreq.b+c, said polymer having a number average molecular weight of from about 2,000 to 7,000, a hydroxyl value of 60 to 120 mg KOH/g, and acid number of 60 to 140 mg KOH/g,
- (b) from about 10 to 60% by weight of a polymer having a carboxyl group and a carboxylic ester, prepared by copolymerizing from about 15 to 30% by weight of an ethylenically unsaturated monomer having an acid anhydride group, and from about 70 to 85 % by weight of another ethylenically unsaturated copolymerizable monomer to obtain a polymer having acid anhydride groups which are then reacted with a hydroxyl compound having 1 to 8 carbon atoms in a molar ratio of acid anhydride group to hydroxyl group of from about 1/1 to 1/1.5; % by weight of monomers being based on total monomer weight and said polymer having a number average molecular weight of 1,500 to 10,000, and at least two acid anhydride groups in one molecule, and
- (c) from about 30 to 60% by weight of a polymer having a hydroxyl group and an epoxy group, prepared by copolymerizing
- (i) from about 15 to 30% by weight of a hydroxyalkyl (meth)acrylate represented by: ##STR10## wherein R represents a hydrogen atom or a methyl group and n is an integer of 2 to 8,
- (ii) from about 15 to 50% by weight of an epoxy group-containing ethylenically unsaturated monomer, and
- (iii) from about 10 to 60% by weight of another copolymerizable ethylenically unsaturated monomer; the % by weight being based on total monomer weight; said (c) polymer having an epoxy equivalent of 200 to 700, a hydroxyl equivalent of 400 to 1,000 and a number average molecular weight of 1,500 to 10,000.
- 16. The composition of claim 14 wherein a molar ration of total acid groups in component polymers (a) and (b)/epoxy groups in component polymers (c) is from about 1/0.6 to 1/1.2.
- 17. The composition of claim 15 wherein a molar ration of total acid groups in component polymers (a) and (b)/epoxy groups in component polymers (c) is from about 1/0.6 to 1/1.2.
- 18. A coating composition comprising, as film-forming component, the thermosetting resin composition according to claim 2.
- 19. A coating composition comprising, as film-forming component, the thermosetting resin composition according to claim 3.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-134826 |
May 1992 |
JPX |
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CROSS REFERENCE TO A RELATED APPLICATION
This is a continuation-in-part application of co-pending application Ser. No. 08/065,910 filed May 25, 1993, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5166265 |
Nakahata et al. |
Nov 1992 |
|
5229461 |
Saitoh |
Jul 1993 |
|
5270392 |
Okude et al. |
Dec 1993 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
2045577 |
Feb 1990 |
JPX |
3287650 |
Dec 1991 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
65910 |
May 1993 |
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