Claims
- 1. A resin composition comprising:(A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium, and an organic compound which includes a polymerizable unsaturated group and a group shown by the following formula (1) wherein X represents NH, O (oxygen atom), or S (sulfur atom), and Y represents O or S,(B) an oligomeric polymerization initiator having recurring units represented by the following formula (3) and(C) a compound having at least two polymerizable unsaturated groups in the molecule.
- 2. The resin composition according to claim 1, wherein the organic compound includes a group represented by [—O—C(═O)—NH—] and at least one of the groups represented by [—O—C(═S)—NH—] or [—S—C(═O)—NH—].
- 3. The resin composition according to claim 1, wherein the organic compound is a compound having a silanol group or a compound which forms a silanol group by hydrolysis.
- 4. The resin composition according to claim 1, wherein the weight average molecular weight of said oligomeric polymerization initiator is in the range from 400 to 10,000.
- 5. The composition of claim 1, wherein said oligomeric radiation polymerization initiator is represented by the following formula (4): wherein R represents an organic mono-valent group, and n represents an integer from 2 to 45.
- 6. The composition of claim 5, wherein said compound having at least two polymerizable unsaturated groups is selected from the group consisting of dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol tetra(meth)acrylate, and ditrimethylolpropane tetra(meth)acrylate.
- 7. The composition of claim 1, wherein said compound having at least two polymerizable unsaturated groups is selected from the group consisting of dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol tetra(meth)acrylate, and ditrimethylolpropane tetra(meth)acrylate.
- 8. The composition of claim 6, wherein said composition comprises, relative to the combined weight of particles (A) and compound (C), 10-95 wt % of compound (C).
- 9. A process comprising:coating a substrate with the composition of claim 6, and curing the composition of claim 6.
- 10. The composition of claim 1, wherein said composition comprises, relative to the combined weight of particles (A) and compound (C), 10-95 wt % of compound (C).
- 11. The composition of claim 1, wherein said composition comprises, relative to the combined weight of particles (A) and compound (C), 30-95 wt % of compound (C).
- 12. A process comprising:coating a substrate with the composition of claim 1, and curing the composition of claim 1.
- 13. A cured product produced by curing the resin composition according to claim 1.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-228296 |
Aug 1999 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This Application is a continuation of International Application PCT/NL00/00537, filed Jul. 27, 2000, which designated the U.S. and was published in the English language. The entire contents of this PCT application are hereby incorporated by reference.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
4672079 |
Li Bassi et al. |
Jun 1987 |
A |
4950795 |
Husler et al. |
Aug 1990 |
A |
6013749 |
Baba et al. |
Jan 2000 |
A |
6355703 |
Baba et al. |
Mar 2002 |
B1 |
6521677 |
Yashiro et al. |
Feb 2003 |
B2 |
Foreign Referenced Citations (4)
Number |
Date |
Country |
0433727 |
Jun 1991 |
EP |
06240181 |
Aug 1994 |
JP |
09118838 |
May 1997 |
JP |
9712942 |
Jan 1997 |
WO |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/NL00/00537 |
Jul 2000 |
US |
Child |
10/073075 |
|
US |