Claims
- 1. A resin composition comprising a polymer and at least 5% by weight of an ester compound, wherein the ester compound and the polymer are obtained by reacting a diene, a dienophile and a carboxylic acid.
- 2. A resin composition according to claim 1 comprising at least 10% by weight of the ester compound.
- 3. A resin composition according to claim 1, wherein the polymer has no acid functionalities.
- 4. A resin composition according to claim 1, wherein the ester compound and the polymer are obtained by reacting a diene, a dienophile and a carboxylic acid present in a reaction mixture, wherein the reaction mixture comprises up to about 75% by weight of the diene, up to about 55% by weight of the dienophile, and from about 10 to about 75% by weight of the carboxylic acid.
- 5. A resin composition according to claim 4, wherein the reaction mixture comprises from about 15 to about 60% by weight of the diene, from about 10 to about 45% by weight of the dienophile, and from about 15 to about 60% by weight of the carboxylic acid.
- 6. A resin composition according to claim 1, wherein the resin composition has an acid number below about 50.
- 7. A resin composition according to claim 1, wherein the resin composition has an acid number below about 20.
- 8. A resin composition according to claim 1, wherein the carboxylic acid is an organic carboxylic acid.
- 9. A resin composition according to claim 8, wherein the organic carboxylic acid is a rosin acid, a derivative of a rosin acid, or a mixture thereof.
- 10. A resin composition according to claim 1, wherein the diene is a hydrocarbon diene.
- 11. A resin composition according to claim 10, wherein the diene is a cyclic hydrocarbon diene.
- 12. A resin composition according to claim 11, wherein the diene is a polycyclic hydrocarbon diene.
- 13. A resin composition according to claim 12, wherein the diene is dicyclopentadiene.
- 14. A resin composition according to claim 1, wherein the dienophile is selected from the group consisting of terpenes, cyclic hydrocarbons, anhydrides, acid olefins, olefinic ketones and mixtures thereof.
- 15. A resin composition according to claim 1, wherein the dienophile is an aromatic vinylic hydrocarbon, an acrylic hydrocarbon or a mixture thereof.
- 16. A resin composition according to claim 15, wherein the dienophile is styrene.
- 17. A resin composition comprising a polymer and at least 5% by weight of an ester compound, wherein the ester compound and the polymer are obtained by reacting a polycyclic hydrocarbon diene, a dienophile and a rosin acid, a derivative of a rosin acid or a mixture thereof, wherein the resin composition has an acid number below about 50.
- 18. A resin composition according to claim 17, wherein the dienophile is selected from the group consisting of terpenes, cyclic hydrocarbons, anhydrides, acid olefins, olefinic ketones and mixtures thereof.
- 19. A resin composition according to claim 17, wherein the dienophile is an aromatic vinylic hydrocarbon or acrylic hydrocarbon or a mixture thereof.
- 20. A resin composition according to claim 17, wherein the ester compound and the polymer are obtained by reacting a diene, a dienophile and either a rosin acid, a derivative of a rosin acid, or a mixture thereof, present in a reaction mixture, wherein the reaction mixture comprises up to about 75% by weight of the diene, up to about 55% by weight of the dienophile, and from about 10 up to about 75% by weight of the rosin acid, the derivative of a rosin acid, or the mixture thereof.
- 21. A resin composition comprising at least 5% by weight of an ester compound, and a polymer, wherein the ester compound and the polymer are obtained by reacting a polycyclic hydrocarbon diene, styrene and a rosin acid, a derivative of a rosin acid, or a mixture thereof.
- 22. An adhesive composition comprising a resin composition, wherein the resin composition comprises at least 5% by weight of an ester compound, the resin composition also comprises a polymer, wherein the ester compound and the polymer are obtained by reacting a diene, a dienophile and a carboxylic acid.
- 23. An adhesive composition according to claim 22, which is an aqueous pressure sensitive adhesive composition.
- 24. An adhesive composition according to claim 22, which is a hot melt pressure sensitive adhesive composition.
- 25. An adhesive composition according to claim 22, which is a flooring pressure sensitive adhesive composition.
- 26. A method for producing a resin composition which comprises providing a reaction mixture comprising up to about 75% by weight of a diene, up to about 55% by weight of a dienophile, and from about 10 to about 75% by weight of a carboxylic acid, heating the reaction mixture at a temperature from about 175° C. up to about 310° C. for about 1 up to about 2 hours.
- 27. A method for producing a resin composition according to claim 26, wherein the reaction mixture comprises from about 15 to about 60% by weight of a diene, from about 10 to about 45% by weight of a dienophile, and from about 15 to about 60% by weight of a carboxylic acid.
Priority Claims (1)
| Number |
Date |
Country |
Kind |
| 03445008.0 |
Jan 2003 |
EP |
|
Parent Case Info
[0001] The present application claims priority of Europe Application No. 03445008.0, filed on Jan. 20, 2003 and U.S. Provisional Patent Application No. 60/441,494, filed on Jan. 21, 2003.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60441494 |
Jan 2003 |
US |