Claims
- 1. A resin composition comprising a poly(phenylene sulfide) resin and .alpha.-alumina, wherein the composition comprises:
- (A) 15 to 45 wt. % of a poly(phenylene sulfide) resin having a melt viscosity of 5 to 100 Pa.multidot.s as measured at 310.degree. C. and a shear rate of 1200/sec, and
- (B) 85 to 55 wt. % of .alpha.-alumina which contains .alpha.-alumina (B1) composed of .alpha.-crystals having an average particle size of at least 5 .mu.m in a proportion of at least 40 wt. %.
- 2. The resin composition according to claim 1, wherein the .alpha.-alumina (B1) is .alpha.-alumina composed of .alpha.-crystals having an average particle size of 5 to 80 .mu.m.
- 3. The resin composition according to claim 1, wherein the .alpha.-alumina contains 40 to 100 wt. % of the .alpha.-alumina (B1) composed of .alpha.-crystals having an average particle size of 5 to 80 .mu.m and 0 to 60 wt. % of .alpha.-alumina (B2) composed of .alpha.-crystals having an average particle size smaller than 5 .mu.m.
- 4. The resin composition according to claim 1 which has a heat conductivity of at least 1.5 W/m.multidot.K.
- 5. The resin composition according to claim 1, which has a Mg ion content of 200 ppm or lower.
- 6. The resin composition according to claim 1 which further comprises (C) at least one filler selected from the group consisting of fibrous fillers and non-fibrous fillers other than the .alpha.-alumina within a range of 0 to 30 wt. % based on the total weight of the resin composition.
- 7. A microplate formed from a resin composition comprising (A) 15 to 45 wt. % of a poly(phenylene sulfide) resin having a melt viscosity of 5 to 100 Pa.multidot.s as measured at 310.degree. C. and a shear rate of 1200/sec, and (B) 85 to 55 wt. % of .alpha.-alumina which contains .alpha.-alumina (B1) composed of .alpha.-crystals having an average particle size of at least 5 .mu.m in a proportion of at least 40 wt. %.
- 8. The microplate according to claim 7, wherein the resin composition has a Mg ion content of 200 ppm or lower.
Priority Claims (2)
Number |
Date |
Country |
Kind |
8-293153 |
Oct 1996 |
JPX |
|
8-336364 |
Dec 1996 |
JPX |
|
Parent Case Info
This application claims the benefit under 35 USC 371 of PCT/JP97/03739 which has an international filing date of Oct. 16 1997.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/JP97/03739 |
10/16/1997 |
|
|
4/15/1999 |
4/15/1999 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO98/16585 |
4/23/1998 |
|
|
US Referenced Citations (6)
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JPX |
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Non-Patent Literature Citations (1)
Entry |
Database WPI, Section Ch, Week 199235, Derwent Publications Ltd., London, GB; AN 1992-289001. |