Claims
- 1. A resin molded article of a resin composition comprising 100 wt. parts of at least one thermoplastic resin selected from the group consisting of polyethylene, polypropylene, polystyrene, acrylic resins, polyester, polycarbonate and polyamide, or a thermosetting resin and 0.1 to 5 wt. parts of a compound having a perfluoroalkyl group which is obtained by reacting an epoxy compound having a C5-C18 perfluoroalkyl group with a polyalkylene oxide having a terminal hydroxyl group, wherein a contact angle of water is 50 degrees or less on the surface of said molded article.
- 2. A method for producing a resin molded article having a contact angle of water of 50 degrees or less on its surface comprising the steps of:molding a resin composition comprising 100 wt. parts of at least one thermoplastic resin selected from the group consisting of polyethylene, polypropylene, polystyrene, acrylic resins, polyester, polycarbonate and polyamide, or a thermosetting resin and 0.1 to 5 wt. parts of a compound having a perfluoroalkyl group which is obtained by reacting an epoxy compound having a C5-C18 perfluoroalkyl group with a polyalkylene oxide having a terminal hydroxyl group, and heating the molded article at a temperature in the range between 70° C. and 130° C., and producing said resin molded article.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-158987 |
Jun 1998 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/JP99/03022 which has an International filing date of Jun. 7, 1999, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP99/03022 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO99/64518 |
12/16/1999 |
WO |
A |
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
6225405 |
Yamaguchi et al. |
May 2001 |
B1 |
Foreign Referenced Citations (9)
Number |
Date |
Country |
58-149936 |
Sep 1983 |
JP |
62-196192 |
Aug 1987 |
JP |
3-41162 |
Feb 1991 |
JP |
5-59203 |
Mar 1993 |
JP |
7-149923 |
Jun 1995 |
JP |
7268184 |
Oct 1995 |
JP |
10-195302 |
Jul 1998 |
JP |
11-5967 |
Jan 1999 |
JP |
WO9815598 |
Apr 1998 |
WO |
Non-Patent Literature Citations (3)
Entry |
XP-002177332 English language abstract of JP4068006A(Mar. 3, 1992). |
XP-002177333 English language abstract of JP1131270A(May 24, 1989). |
XP-002177334 English language abstract of JP7011104A(Jan. 13, 1995). |