Resin product having luster metallic coating film with discontinuous structure

Abstract

The present invention provides a resin product which includes a resin base material, a luster metallic coating film provided on the resin base material. The metallic coating film is made of indium, and has a discontinuous structure. The resin product also includes a corrosion-resistant protective film that improves the corrosion resistance of the metallic coating film. The corrosion-resistance of the metallic coating film is made of at least one of a silicon compound, an aluminum compound, a titanium compound, a cerium compound, a zirconium compound, a zinc compound, and a chromium compound, and is provided only in a position under the metallic coating film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of an example in which a metallic coating film is made of indium; and

FIG. 2 is a schematic sectional view of an example in which the metallic coating film is made of tin.

DETAILED DESCRIPTION OF THE INVENTION

A resin product includes a resin base material, and a luster metallic coating film provided on the resin base material. The metallic coating film is made of indium, and has a discontinuous structure.

The resin product also includes a corrosion-resistant protective film that improves the corrosion resistance of the metallic coating film. The corrosion-resistant protective film is made of at least one of silicon oxynitride, aluminum nitride, aluminum oxynitride, and chromium oxide, and is provided only in a position under the metallic coating film.

Another resin product includes a resin base material, and a luster metallic coating film provided on the resin base material. The metallic coating film is made of tin, and has a discontinuous structure.

The resin product also includes a corrosion-resistant protective film that improves the corrosion resistance of the metallic coating film. The corrosion-resistant protective film is made of at least one of silicon oxynitride, aluminum nitride, aluminum oxynitride, and chromium oxide, and is provided in at least one of a position on the metallic coating film and a position under the metallic coating film.

EXAMPLES

Examples and comparative examples of the metallic coating film on a resin base material (substrate) made of polycarbonate, as shown in Table 1 below, will be explained below. The examples and comparative examples vary according to the type of the metallic coating film, the method by which the metallic coating film was formed, the presence or absence of the corrosion-resistant protective film which is provided on or under the metallic coating film, the type of the corrosion-resistant protective film, and the method by which the corrosion-resistant protective film was formed. Note that the examples of the present invention and the comparative examples are divided into nine groups by study item.

	TABLE 1
	Film Configuration
			Corrosion-resistant
	Corrosion-resistant		protective film 14
	protective film 13		provided on
	provided under		metallic coating film
	metallic coating film		Material/
	Material/		Metallic coating film 12	Nitrogen content
	Nitrogen content	Film		Film	Ratio/
Study		Ratio/	thickness	Material/	thickness	(Film-forming	Film thickness
Group	Category	(Film-forming method)	(nm)	(Film-forming method)	(nm)	method)	(nm)
1a	Comparative	None	—	In (vacuum vapor	40	None
	Example			deposition)
	Example	Silicon oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Aluminum oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Aluminum nitride	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Titanium oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Cerium oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Zirconium oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Zinc sulfide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
1b	Comparative	None	—	Sn (vacuum vapor	40	None
	Example			deposition)
	Example	Silicon oxynitride	30	Sn (vacuum vapor	40	None
		60% (spattering)		deposition)
	Example	Aluminum oxide	30	Sn (vacuum vapor	40	None
		(vacuum vapor		deposition)
		deposition)
2a	Comparative	None	—	Sn (vacuum vapor	40	None
	Example			deposition)
	Example	Silicon oxide	10	Sn (vacuum vapor	40	None
		(vacuum vapor		deposition)
		deposition)
	Example	Silicon oxynitride	10	Sn (vacuum vapor	40	None
		4% (vacuum vapor		deposition)
		deposition)
	Example	Silicon oxynitride	10	Sn (vacuum vapor	40	None
		10% (ion plating)		deposition)
	Example	Silicon oxynitride	10	Sn (vacuum vapor	40	None
		20% (ion plating)		deposition)
2b	Comparative	None	—	In (spattering)	40	None
	Example
	Example	Silicon oxide	10	In (spattering)	40	None
		(spattering)
	Example	Silicon oxynitride	10	In (spattering)	40	None
		5% (spattering)
	Example	Silicon oxynitride	10	In (spattering)	40	None
		20% (spattering)
	Example	Silicon oxynitride	10	In (spattering)	40	None
		60% (spattering)
	Example	Silicon nitride	10	In (spattering)	40	None
		(spattering)
3a	Comparative	None	—	In (vacuum vapor	40	None
	Example			deposition)
	Example	Aluminum oxide	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	40	None
		4% (ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	40	None
		20% (ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	40	None
		60% (ion plating)		deposition)
	Example	Aluminum nitride	10	In (vacuum vapor	40	None
		(ion plating)		deposition)
3b	Comparative	None	—	In (vacuum vapor	80	None
	Example			deposition)
	Example	Silicon oxide	10	In (vacuum vapor	80	None
		(ion plating)		deposition)
	Example	Aluminum oxide	10	In (vacuum vapor	80	None
		(ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	80	None
		4% (ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	80	None
		20% (ion plating)		deposition)
	Example	Aluminum oxynitride	10	In (vacuum vapor	80	None
		60% (ion plating)		deposition)
	Example	Aluminum nitride	10	In (vacuum vapor	80	None
		(ion plating)		deposition)
4a	Comparative	None	—	In (vacuum vapor	45	None
	Example			deposition)
	Example	Chromium oxide	20	In (vacuum vapor	45	None
		(ion plating)		deposition)
4b	Comparative	None	—	Sn (vacuum vapor	45	None
	Example			deposition)
	Example	Chromium oxide	20	Sn (vacuum vapor	45	Chromium oxide	20
		(ion plating)		deposition)		(ion plating)
	Example	Chromium oxide	20	Sn (vacuum vapor	45	Chromium oxide	10
		(ion plating)		deposition)		(ion plating)
	Example	Chromium oxide	20	Sn (vacuum vapor	45	Chromium oxide	2
		(ion plating)		deposition)		(ion plating)
	Example	Chromium oxide	2	Sn (vacuum vapor	45	Chromium oxide	2
		(ion plating)		deposition)		(ion plating)
5	Comparative	None	—	Sn (vacuum vapor	40	None
	Example			deposition)
	Example	None	—	Sn (vacuum vapor	40	Silicon oxynitride	30
				deposition)		60% (spattering)
	Example	None	—	Sn (vacuum vapor	40	Silicon oxynitride	100
				deposition)		60% (spattering)
	Comparative	None	—	Sn (vacuum vapor	40	Aluminum	30
	Example			deposition)		oxynitride
						20% (vacuum
						vapor
						deposition)
	Comparative	None	—	Sn (vacuum vapor	40	Aluminum	100
	Example			deposition)		oxynitride 20%
						(vacuum vapor
						deposition)
	Corrosion
	resistance	Adhesion
	(Environmental	Abrasion
	resistance test)	resistance/
	Moisture	Gauze
	resistance	abrasion
	Measured		Measured
	value		value
				Amount			Amount
				of			of
				change			change
			Film Configuration	in			in
	Study		Press coating film 15	transmittance			transmittance
	Group	Category	(Protective film)	(%)	ΔE	Evaluation	(%)	Evaluation
	1a	Comparative	Yes		3.1	X
		Example
		Example	Yes		1.4	◯
		Example	Yes		0.7	⊚
		Example	Yes		0.5	⊚
		Example	Yes		2.2	Δ
		Example	Yes		1.3	◯
		Example	Yes		1.9	◯
		Example	Yes		2.9	Δ
	1b	Comparative	Yes		5.3	X
		Example
		Example	Yes		1.8	◯
		Example	Yes		2.6	Δ
	2a	Comparative	No	25.3		X	95	X
		Example
		Example	No	8.9		Δ	22	◯
		Example	No	0.8		◯	16.8	◯
		Example	No	−2.8		◯	3.8	◯
		Example	No	0.4		◯	0.5	⊚
	2b	Comparative	Yes		4.3	X
		Example
		Example	Yes		2.8	Δ
		Example	Yes		1.7	◯
		Example	Yes		1.6	◯
		Example	Yes		1.8	◯
		Example	Yes		1.9	◯
	3a	Comparative	Yes		3.1	X
		Example
		Example	Yes		1.1	◯
		Example	Yes		0.4	⊚
		Example	Yes		0.4	⊚
		Example	Yes		0.5	⊚
		Example	Yes		0.6	⊚
	3b	Comparative	Yes		3.3	X
		Example
		Example	Yes		1.0	◯
		Example	Yes		0.5	⊚
		Example	Yes		0.7	⊚
		Example	Yes		0.6	⊚
		Example	Yes		0.5	⊚
		Example	Yes		2.1	Δ
	4a	Comparative	No	8.2		Δ
		Example
		Example	No	0.9		⊚
	4b	Comparative	No	25.3		X
		Example
		Example	No	−1.5		◯
		Example	No	1.6		◯
		Example	No	2.8		◯
		Example	No	9.8		Δ
	5	Comparative	No	31.5		X
		Example
		Example	No	2.12		◯
		Example	No	2.52		◯
		Comparative	No	93.1		XX
		Example
		Comparative	No	91.2		XX
		Example

As shown in FIGS. 1 and 2, each test piece that was used included a resin base material 11 made of polycarbonate with a thickness of 5 mm, on which a metallic coating film 12, as well as a corrosion-resistant protective film 14 which is provided on the metallic coating film 12 (hereinafter, “overlying corrosion-resistant protective film 14”), a corrosion-resistant protective film 13 which is provided under the metallic coating film 12 (hereinafter, “underlying corrosion-resistant protective film 13”), or both the underlying and overlying corrosion-resistant protective films 13, 14 were formed. In a case where the test piece had a press coating film 15, the press coating film 15 was formed using a two-component type, thermal drying, black acrylic material, and the film thickness was 15 μm.

<Oxynitride Films>

In this example, oxynitride films were formed, and their nitrogen content ratios were measured, as described below.

(a) Film-Forming Method

Films of silicon oxynitride and aluminum oxynitride were formed as described below.

A film of silicon oxynitride (SiO_xN_y) formed by spattering, using silicon (Si) in a target and using the partial pressures of nitrogen (N₂) and oxygen (O₂) in the atmosphere to control the composition.

A film of silicon oxynitride (SiO_xN_y) formed by ion plating, using silicon nitride (Si₃N₄) in an evaporation material and using an output of an RF plasma in a nitrogen (N₂) (oxygen (O₂)) atmosphere to control the composition.

A film of silicon oxynitride (SiO_xN_y) formed by vacuum vapor deposition, using silicon nitride (Si₃N₄) in an evaporation material.

A film of aluminum oxynitride (AlO_xN_y) formed by spattering, using aluminum (Al) in a target and using the partial pressures of nitrogen (N₂) and oxygen (O₂) in the atmosphere to control the composition.

A film of aluminum oxynitride (AlO_xN_y) formed by ion plating, using aluminum nitride (AlN) in an evaporation material and using an output of an RF plasma in a nitrogen (N₂) atmosphere to control the composition.

(b) Nitrogen Content Ratios

The nitrogen content ratios (N/(O+N)) of the films were measured by X-ray photoelectron spectroscopy (XPS).

<Group 1a>

In this group of examples, the indium metallic coating film 12 was formed by vacuum vapor deposition. Silicon oxide, aluminum oxide, aluminum nitride, titanium oxide, cerium oxide, zirconium oxide, and zinc sulfide films formed by ion plating were provided as the underlying corrosion-resistant protective films 13. The press coating film 15 was provided over the indium metallic coating film 12. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 1b>

In this group of examples, the metallic coating film 12 was changed to tin formed by vacuum vapor deposition, in contrast to group la. The underlying corrosion-resistant protective films 13 were changed to films of silicon oxynitride formed by spattering and aluminum oxide formed by vacuum vapor deposition. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 2a>

In this group of examples, the tin metallic coating film 12 was formed by vacuum vapor deposition. Silicon oxynitride films (including silicon oxide and silicon nitride) formed by vacuum vapor deposition and by ion plating, and having different nitrogen content ratios, were provided as the underlying corrosion-resistant protective films 13. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 2b>

In this group of examples, in contrast to group 2a, the metallic coating film 12 was changed to indium formed by spattering, and the press coating film 15 was provided over the indium metallic coating film 12. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 3a>

In this group of examples, the indium metallic coating film 12 was formed by vacuum vapor deposition. Aluminum oxynitride films (including aluminum oxide and aluminum nitride) formed by ion plating, and having different nitrogen content ratios, were provided as the underlying corrosion-resistant protective films 13. The press coating film 15 was provided over the indium metallic coating film 12. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 3b>

In this group of examples, in contrast to group 3a, the thickness of the indium metallic coating film 12 was increased, and the underlying corrosion-resistant protective films 13 were changed to silicon oxide films formed by ion plating. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 4a>

In this group of examples, the indium metallic coating film 12 was formed by vacuum vapor deposition. A chromium oxide film formed by ion plating was provided as the underlying corrosion-resistant protective film 13. In the comparative example, the underlying corrosion-resistant protective film 13 was not provided.

<Group 4b>

In this group of examples, in contrast to group 4a, the metallic coating film 12 was changed to tin formed by vacuum vapor deposition. Both the underlying and overlying corrosion-resistant protective films 13, 14 made of chromium oxide were provided, and the thicknesses of the underlying and overlying corrosion-resistant protective films 13, 14 were varied. In the comparative example, the underlying and overlying corrosion-resistant protective films 13, 14 were not provided.

<Group 5>

In this group of examples, the underlying corrosion-resistant protective film 13 was not provided. Only the overlying corrosion-resistant protective film 14, made of silicon oxynitride and formed by spattering, was provided on the tin metallic coating film 12 formed by vacuum vapor deposition. In one comparative example, neither of the underlying and overlying corrosion-resistant protective films 13, 14 was provided. In the other comparative examples, the overlying corrosion-resistant protective film 14, made of aluminum oxynitride and formed by vacuum vapor deposition, was provided.

<Corrosion Resistance (Environmental Resistance Test)>

Moisture resistance was tested in order to evaluate corrosion resistance (environmental resistance).

(a) Test Conditions

Moisture resistance was tested under the following conditions:

Humidity: 98% to 100%

Temperature: 40° C.

Time: 480 hours

(b) Evaluation Methods

Amount of change in transmittance

In cases where the press coating film was not provided, as shown in FIGS. 1A and 2A, light was directed from the direction of the resin base material 11, and the transmittance was measured based on the transmitted light that passed through the resin base material 11 and the films 12, 13, 14. The moisture resistance test causes the indium and tin to oxidize, which makes the metallic coating film 12 (luster layer) transparent, increasing the transmittance of the light. Accordingly, the transmittance was measured before and after the moisture resistance test to determine the amount of change in the transmittance from before the test to after the test. The evaluations were then made based on the amount of change in the transmittance.

Color change: ΔE (Change in hue)

In cases where the press coating film was provided, as shown in FIGS. 1B and 2B, the hue of a test piece was measured from the direction of the resin base material 11. The moisture resistance test causes the indium and tin to oxidize, which makes the metallic coating film 12 (luster layer) transparent, such that the black press coating film (protective film) behind the metallic coating film appears transparent. Accordingly, the hue was measured before and after the moisture resistance test. The color change (ΔE) from before the test to after the test was determined by the equation shown below, in accordance with JIS K5600-4-6. The evaluations were then made based on the color change.

ΔE=√{square root over ((ΔL)²+(Δa)²+(Δb)²)}{square root over ((ΔL)²+(Δa)²+(Δb)²)}{square root over ((ΔL)²+(Δa)²+(Δb)²)}  Equation 1

ΔL: Luminance difference

Δa: Chromaticity difference (red-green direction)

Δb: Chromaticity difference (yellow-blue direction)

The evaluations were conducted as described below.

(a) As shown by the results for group 1a and group 1b, in the examples which were provided with the underlying corrosion-resistant protective film 13, the corrosion resistance was improved in comparison to the comparative examples which was not provided with the underlying corrosion-resistant protective film 13. In the examples, in which the film made of aluminum oxide (by vacuum vapor deposition), silicon oxide, cerium oxide, zirconium oxide, tinanium oxide, silicon oxynitride, or zinc sulfide was used as the underlying corrosion-resistant protective film 13, the improvement in the corrosion resistance was smaller than the other examples. This is considered to be due to the low denseness of the film and the effects of damage to the film from the oxygen and oxygen plasmas during the formation of the film.

(b) As shown by the results for group 2a, group 2b, group 3a, and group 3b, in the examples, in which the film made of silicon oxynitride, aluminum oxynitride or the like was used as the underlying corrosion-resistant protective film 13, the corrosion resistance was improved in comparison to the comparative examples which was not provided with the underlying corrosion-resistant protective film 13. In the examples, in which the film made of silicon nitride or aluminum nitride was used as the underlying corrosion-resistant protective film 13, the improvement in the corrosion resistance was smaller than the other examples. This is considered to be due to the effects of damage to the film from the high-output plasmas that are required during the formation of the film.

(c) As shown by the results for group 4a and group 4b, in the examples, in which the film or films made of chromium oxide was used as the underlying corrosion-resistant protective film 13 or the underlying and overlying corrosion-resistant protective films 13, 14, respectively, the corrosion resistance was improved in comparison to the comparative examples which were not provided with the underlying or overlying corrosion-resistant protective film 13, 14.

(d) The results for group 5 showed an effect of the corrosion resistance with a nitrogen content ratio of 60 mol % in the silicon oxynitride.

<Adhesion (Abrasion Resistance)>

The adhesion (abrasion resistance) between the metallic coating film 12 and the resin base material 11 was evaluated by conducting a gauze abrasion test using a test material of group 2b.

(a) Test Conditions

The gauze abrasion test was conducted under the following conditions:

A (100% cotton) gauze 12 mm wide was used as an abrasive material. A load of 6.9 N was applied to the gauze, and the gauze was moved reciprocally 100 times over a distance of 30 mm.

(b) Evaluation Method

Amount of change in transmittance

The transmittance was measured as described above. The gauze abrasion test reduces the thickness of the metallic coating film 12 (luster layer), increasing the transmittance of the light. Accordingly, the transmittance was measured before and after the gauze abrasion test to determine the amount of change in the transmittance from before the test to after the test. The amount of change in the transmittance was then used as the evaluation of adhesion.

It was seen that the adhesion increased to the extent that the nitrogen content ratio of the silicon oxynitride increased.

Note that the present invention is not limited by the examples described above, and that the structure of each part may be freely modified without departing from the spirit and scope of the present invention.

Claims

1. A resin product comprising: a resin base material;a luster metallic coating film provided on the resin base material, the metallic coating film being made of indium, and having a discontinuous structure; anda corrosion-resistant protective film that improves the corrosion resistance of the metallic coating film;wherein the corrosion-resistant protective film is made of at least one of a silicon compound, an aluminum compound, a titanium compound, a cerium compound, a zirconium compound, a zinc compound, and a chromium compound, and is provided only in a position under the metallic coating film.

2. The resin product according to claim 1, wherein the one of the silicon compound, the aluminum compound, the titanium compound, the cerium compound, the zirconium compound, the zinc compound, and the chromium compound is one of an oxide, a nitride, an oxynitride, and a sulfide.

3. The resin product according to claim 1, wherein the silicon compound is one of a silicon oxide and a silicon oxynitride.

4. A resin product comprising: a resin base material;a luster metallic coating film provided on the resin base material, the metallic coating film being made of tin, and having a discontinuous structure; anda corrosion-resistant protective film that improves the corrosion resistance of the metallic coating film;wherein the corrosion-resistant protective film is made of an inorganic compound , and is provided in at least one of a position on the metallic coating film and a position under the metallic coating film.

5. The resin product according to claim 4, wherein the inorganic compound is one of a silicon compound, a chromium oxide, and an aluminum oxide.

6. The resin product according to claim 5, wherein the silicon compound is one of a silicon oxide and a silicon oxynitride.

7. The resin product according to claim 1, wherein the corrosion-resistant protective film is formed by vapor deposition.

8. The resin product according to claim 2, wherein the corrosion-resistant protective film is formed by vapor deposition.

9. The resin product according to claim 3, wherein the corrosion-resistant protective film is formed by vapor deposition.

10. The resin product according to claim 4, wherein the corrosion-resistant protective film is formed by vapor deposition.

11. The resin product according to claim 5, wherein the corrosion-resistant protective film is formed by vapor deposition.

12. The resin product according to claim 6, wherein the corrosion-resistant protective film is formed by vapor deposition.