Patent Application
20240149504
The present invention relates to a resin-sealing method and a resin-sealing device.
As a method for manufacturing a package in which a component such as a semiconductor device is sealed with resin, the following method is known. That is, a resin is molded on a workpiece having a plurality of components mounted on a carrier, and a plurality of packages are collectively formed. One of such resin-sealing methods is a compression molding type.
Patent Document 1 discloses a resin supply method which is a method for supplying resin to a resin molding die of a compression molding type. The resin supply method includes steps of: while pressurizing a sheet resin so that a central portion of the sheet resin becomes convex and bending the sheet resin, pressing the sheet resin from the central portion of the sheet resin against an object to be supplied; and pressing the sheet resin against the object to be supplied toward an outer periphery of the sheet resin.
However, in the resin supply method described in Patent Document 1, when the sheet resin is heated and compressed, while an end of the sheet resin flows to an outer edge of a cavity, the central portion of the sheet resin is unable to flow. Thus, the resin formed at an end of a workpiece may have a smaller thickness than the resin formed in a central portion of the workpiece, and packages manufactured from one workpiece may vary in dimensions.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin-sealing method and a resin-sealing device in which variation in package dimensions can be reduced.
A resin-sealing method according to one aspect of the present invention is a resin-sealing method that compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one component is sealed with resin. The resin-sealing method includes a step of setting a sheet resin in a resin molding die and a step of compression molding the sheet resin set in the resin molding die. At least one penetrating hole or recess is formed in a central portion of the sheet resin so that the amount of resin is less in the central portion of the sheet resin than in a peripheral portion of the sheet resin in plan view.
According to this aspect, since the at least one penetrating hole or recess is formed in the central portion of the sheet resin, the sheet resin that has been heated and compressed flows inward so as to fill the at least one penetrating hole or recess. Accordingly, variation in thickness of a molding resin molded on the workpiece is reduced. Thus, variation in dimensions of a plurality of packages formed from the workpiece can be reduced.
In the above aspect, the resin-sealing method may further include a step of feeding a resin film of an elongated shape, a step of cutting out the sheet resin from the resin film, and a step of forming the at least one penetrating hole or recess in the resin film or the sheet resin.
In the above aspect, the at least one penetrating hole may be formed by punching.
In the above aspect, the at least one penetrating hole may be formed by sucking an area where a cut has been made.
In the above aspect, a cavity of the resin molding die may have a circular shape. The sheet resin may have a rectangular shape whose diagonal length is equal to or less than a diameter of the cavity.
In the above aspect, the sheet resin may have a rectangular shape. The amount of decrease of resin in a portion along a diagonal line of the sheet resin due to the at least one penetrating hole or recess may be greater than the amount of decrease of resin in a portion along a bisector of each side of the sheet resin due to the at least one penetrating hole or recess.
In the above aspect, the at least one penetrating hole or recess may be one penetrating hole or recess. The one penetrating hole or recess and the sheet resin may be similar in shape in plan view.
In the above aspect, in the step of setting the sheet resin in the resin molding die, the sheet resin may be laminated on the workpiece to be sealed with resin.
In the above aspect, in the step of setting the sheet resin in the resin molding die, the sheet resin may be laminated on a release film.
A resin-sealing method according to another aspect of the present invention is a resin-sealing method that compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one component is sealed with resin. The resin-sealing method includes a step of setting a sheet resin in a resin molding die and a step of compression molding the sheet resin set in the resin molding die. A plurality of penetrating holes or recesses are formed over an entire surface of the sheet resin in plan view. An edge of the plurality of penetrating holes or recesses of the sheet resin set in the resin molding die overlaps any of the plurality of components.
According to this aspect, the amount of flow of the sheet resin that has been heated and compressed can be made uniform on the entire surface. Accordingly, variation in thickness of a molding resin molded on the workpiece can be reduced, and variation in dimensions of a plurality of packages formed from the workpiece can be reduced.
A resin-sealing device according to another aspect of the present invention is a resin-sealing device that compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one component is sealed with resin. The resin-sealing device includes: a sheet cutting part, cutting out a sheet resin from a resin film of an elongated shape; a reducing part, forming at least one penetrating hole or recess in the resin film or the sheet resin; and a resin molding die, compression molding the sheet resin that has been set. The at least one penetrating hole or recess is formed in a central portion of the sheet resin so that the amount of resin is less in the central portion of the sheet resin than in a peripheral portion of the sheet resin in plan view.
According to this aspect, since the at least one penetrating hole or recess is formed in the central portion of the sheet resin, the sheet resin that has been heated and compressed flows inward so as to fill the at least one penetrating hole or recess. Accordingly, variation in thickness of a molding resin molded on the workpiece is reduced. Thus, variation in dimensions of a plurality of packages formed from the workpiece can be reduced.
According to the present invention, a resin-sealing method and a resin-sealing device can be provided in which variation in package dimensions can be reduced.
An embodiment of the present invention is hereinafter described with reference to the drawings. The drawings of the present embodiment are illustrative, and the dimensions or shapes of each part are schematic. The technical scope of the present invention should not be construed as being limited to the embodiment.
<Resin-Sealing Device>
A configuration of a resin-sealing device 1 according to one embodiment of the present invention is described with reference to
The resin-sealing device 1 is a device that compression molds a resin on a workpiece 10 having a plurality of components 12 mounted on a carrier 11 and manufactures a plurality of packages in each of which at least one component 12 is sealed with resin (molded). The resin-sealing device 1 includes a resin supply device 100 that supplies a sheet resin SP1 and a resin molding die 190 that heats and compresses the sheet resin SP1. Here, the sheet resin SP1 is, for example, formed to have an arbitrary thickness by rolling a thermosetting resin such as an epoxy resin into a sheet.
As an example, the carrier 11 is a stainless steel carrier, and the component 12 is a semiconductor device (such as an integrated circuit (IC) chip, a diode, or a transistor) mounted on the carrier 11. However, the carrier 11 and the component 12 are not limited to the above. For example, the carrier 11 may be formed using a material such as resin, glass, metal, or semiconductor, and may be an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or the like. For example, the component 12 may be a microelectromechanical systems (MEMS) device or an electronic device (such as a capacitor, an inductor, or a resistor). The component 12 may be mounted on the carrier 11 by a wire bonding method or a flip chip method, or may be detachably fixed to the carrier 11. The component 12 includes, for example, two types of components, namely a component 12a and a component 12b. However, the component 12 may include a single component or may include three or more types of components.
The workpiece 10 is provided with a plurality of package areas PA demarcated by a plurality of division lines LN1 arranged side by side in an X-axis direction and a plurality of division lines LN2 arranged side by side in a Y-axis direction. The plurality of division lines LN1 and LN2 are imaginary lines for dividing the workpiece 10 on which resin is compression molded into a plurality of packages. The package area PA is an area to become a package. In the package area PA, for example, a plurality of components 12a and 12b are arranged.
The resin supply device 100 includes a feed roll FR, a pinch roll PR, a winding roll WR, a sheet cutter CT, and a mechanical punch PN.
The feed roll FR is a driving roll that feeds a resin film LP of an elongated shape from a resin roll around which the resin film LP is wound. The resin film LP fed by the feed roll FR has, for example, a protective film PF stuck on both sides thereof. The feed roll FR corresponds to an example of a film supply that supplies the resin film LP.
The pinch roll PR is a driving roll that transfers the fed resin film LP to the sheet cutter CT. The resin film LP is sandwiched by the pinch roll PR, and is transferred by rotation of the pinch roll PR. The resin film LP is fed, for example, by driving the feed roll FR and the pinch roll PR in conjunction with each other. The pinch roll PR corresponds to an example of a film transfer part that transfers the resin film LP.
The winding roll WR is a driving roll that peels the protective film PF from the resin film LP and winds the protective film PF. The winding roll WR corresponds to an example of a film peeling part that peels off the protective film PF.
The sheet cutter CT is a cutting machine that cuts out the sheet resin SP1 from the resin film LP from which the protective film PF has been removed. The sheet cutter CT corresponds to an example of a sheet cutting part that cuts out the sheet resin SP1 from the resin film LP. The sheet cutter CT may cut out the sheet resin SP1 by cutting once, or may cut out the sheet resin SP1 by cutting a plurality of times. In the case of cutting out the sheet resin SP1 by cutting a plurality of times, the sheet cutter CT may include, for example, a first sheet cutter that cuts the resin film LP and a second sheet cutter that cuts out the sheet resin SP1 from the resin film LP that has been cut. By the sheet cutter CT, the sheet resin SP1 may be cut out to have a circular or polygonal (such as octagonal or hexagonal) outer shape.
The mechanical punch PN is a punching machine that forms a penetrating hole ST1 by punching in the sheet resin SP1 cut out by the sheet cutter CT. The mechanical punch PN forms the penetrating hole ST1 in a central portion of the sheet resin SP1 so that the amount of resin is less in the central portion of the sheet resin SP1 than in a peripheral portion of the sheet resin SP1 in plan view. Accordingly, a portion where the amount of resin is small in a thickness direction is formed in the central portion of the sheet resin SP1. As illustrated in
The mechanical punch PN may form at least one penetrating hole in the resin film LP before the sheet resin SP1 is cut out by the sheet cutter CT. In this case, the sheet cutter CT cuts out the sheet resin SP1 from the resin film LP so that at least one penetrating hole formed by the mechanical punch PN is located in the central portion of the sheet resin SP1. That is, the sheet resin SP1 is cut out from the resin film LP so that the amount of resin is less in the central portion of the sheet resin SP1 than in the peripheral portion of the sheet resin SP1 in plan view due to at least one penetrating hole.
The mechanical punch PN may form at least one penetrating hole at the same time as the sheet resin SP1 is cut out by the sheet cutter CT.
In the present embodiment, the mechanical punch PN that forms a penetrating hole is described as an example of a forming part. However, if the amount of resin is less in the central portion of the sheet resin SP1 than in the peripheral portion of the sheet resin SP1 in plan view, the forming part is not limited to a device that forms a penetrating hole. For example, the forming part may be a device that forms at least one recess in the sheet resin SP1 or the resin film LP.
The resin molding die 190 includes a pair of dies (lower die 191 and upper die 192) for sealing the workpiece 10 with resin using a compression molding technology. Of the lower die 191 and the upper die 192, a release film RF is set in the die having a cavity 199, and the workpiece 10 is set in the other die. The sheet resin SP1 is laminated on one of the release film RF and the workpiece 10 that is set in the lower die 191, and is set in the resin molding die 190. In the present embodiment, the resin molding die 190 has an upper die cavity structure having the cavity 199 in the upper die 192. Accordingly, the workpiece 10 and the sheet resin SP1 that is laminated on the workpiece 10 are set in the lower die 191. If the resin molding die 190 has a lower die cavity structure having the cavity 199 in the lower die 191, the workpiece 10 is set in the upper die 192, and the release film RF and the sheet resin SP1 laminated on the release film RF are set in the lower die 191.
The resin molding die 190 illustrated in
The upper die 192 includes a chase 19A, a cavity block 19B fixed to the lower die 191 side of the chase 19A, a clamper 19C surrounding the cavity block 19B, and a chamber block 19D surrounding the clamper 19C at a spacing therefrom. The cavity block 19B is fixed to the lower die 191 side of the chase 19A. The clamper 19C protrudes toward the lower die 191 from the cavity block 19B, and forms the cavity 199 together with the cavity block 19B. The clamper 19C is connected to the chase 19A via a spring, and is configured to be slidable with respect to the cavity block 19B. When mold clamping is completed, an outer edge (carrier 11) of the workpiece 10 is sandwiched between the clamper 19C and the lower die 191. On a facing surface (surface facing the lower die 191) of the clamper 19C, a plurality of air vents are provided connecting a space on the chamber block 19D side and the cavity 199. The plurality of air vents are grooves provided radially about the cavity 199. The plurality of air vents function as exhaust holes that discharge air remaining in the cavity 199 of the resin molding die 190 that has been clamped or gas generated from the sheet resin SP1. The air vents are formed to a depth (for example, about several lam) that allows the air or gas to be discharged but does not allow the resin to flow out. The seal ring 193 contacts the chamber block 19D.
The sheet resin SP1 heated and compressed by the resin molding die 190 fills the cavity 199 and flows to have a uniform thickness. However, if a large amount of other resin exists in a direction in which the resin flows, the flowing of the resin may be hindered.
However, as illustrated in
In the example illustrated in
The size relationship or positional relationship between the penetrating hole ST1 and the component 12 are not particularly limited. For example, an edge of the penetrating hole ST1 partially overlaps the component 12 in plan view. The penetrating hole ST1 is provided over a plurality of package areas PA, and two or more components 12 are arranged inside the penetrating hole ST1.
Next, an example of a resin-sealing method using the resin-sealing device 1 is described with reference to
First, a resin film is fed (S11). A resin roll around which the resin film LP of an elongated shape is wound is set on the feed roll FR. Next, while the feed roll FR is driven to feed the resin film LP, the pinch roll PR is driven to transfer the resin film LP. At this time, the protective film PF is peeled from the resin film LP.
Next, the sheet resin SP1 is cut out (S12). The sheet resin SP1 is cut out from the resin film LP by the sheet cutter CT. In the case of the sheet resin SP1 of a circular shape, for example, first, the sheet cutter CT cuts the resin film LP into a rectangular shape by a first sheet cutter extending in a width direction of the resin film LP. Next, by a second sheet cutter extending in a circular shape, the sheet cutter CT cuts out the sheet resin SP1 from the resin film LP cut in a rectangular shape. The sheet cutter CT may also cut out the sheet resin SP1 directly from the resin film LP by cutting once.
Next, the sheet resin SP1 is subjected to punching (S13). The penetrating hole ST1 is formed in the sheet resin SP1 by the mechanical punch PN. The penetrating hole ST1 is formed in the central portion of the sheet resin SP1 so that the amount of resin is less in the central portion of the sheet resin SP1 than in the peripheral portion of the sheet resin SP1. The order of step S12 and step S13 may be reversed. That is, the penetrating hole ST1 may be formed in the resin film LP by the mechanical punch PN, and the sheet resin SP1 may be cut out so that the penetrating hole ST1 is located in the central portion.
Next, the sheet resin SP1 is laminated on the workpiece 10 (S14). The sheet resin SP1 is arranged inside the workpiece 10 in plan view. The sheet resin SP1 covers most of the plurality of components 12. The edge of the penetrating hole ST1, for example, partially overlaps the component 12, and two or more components 12 are arranged inside the penetrating hole ST1. Here, the sheet resin SP1 is arranged so as to have its center aligned with the center of the workpiece 10.
Next, the workpiece 10 having the sheet resin SP1 placed thereon is set in the resin molding die 190 (S15). The sheet resin SP1 is set together with the workpiece 10 in the lower die 191 of the resin molding die 190.
Finally, the sheet resin SP1 is heated and compressed (S16). The sheet resin SP1 accommodated in the cavity 199 in the resin molding die 190 that has been clamped is softened by heating. The softened sheet resin SP1 is compressed to be filled into a gap between the components 12, a gap between the carrier 11 and the component 12, or the like. At this time, the sheet resin SP1 flows so as to fill a gap between the sheet resin SP1 and the clamper 19C, or the penetrating hole ST1. When the resin compression molded from the sheet resin SP1 is cured, the resin molding die 190 is opened, and the workpiece 10 in which the component 12 is sealed with resin is taken out. The workpiece 10 taken out is divided along the plurality of division lines LN1 and LN2, and is separated into a plurality of packages.
As described above, by compression molding using the sheet resin SP1 having the penetrating hole ST1 formed in the central portion, when the sheet resin SP1 is heated and compressed, the amount of flow of the sheet resin SP1 in the peripheral portion and that in the central portion can be made uniform. Accordingly, a difference between the thickness of the resin molded into the central portion of the workpiece 10 and the thickness of the resin molded into the peripheral portion of the workpiece 10 can be reduced. That is, variation in dimensions of a plurality of packages manufactured from one workpiece 10 can be reduced.
Modifications of a sheet resin are described below. The matters common to the above embodiment can be applied in the same way in the following modifications and description thereof is omitted. Only different points are described. In particular, the same configurations are denoted by the same reference numerals, and description of the same configurations and the same effects resulting therefrom is not repeated.
In plan view, four penetrating holes of a circular shape, ST2a, ST2b, ST2c, and ST2d, are formed in a central portion of the sheet resin SP2. The penetrating holes ST2a, ST2b, ST2c, and ST2d are of substantially equal size. The penetrating holes ST2a, ST2b, ST2c, and ST2d are arranged in two columns and two rows along each side of the sheet resin SP2. Specifically, the penetrating hole ST2a and the penetrating hole ST2b are arranged side by side in the X-axis direction, and the penetrating hole ST2c and the penetrating hole ST2d are arranged side by side in the X-axis direction. The penetrating hole ST2a and the penetrating hole ST2c are arranged side by side in the Y-axis direction, and the penetrating hole ST2b and the penetrating hole ST2d are arranged side by side in the Y-axis direction. The penetrating hole ST2a and the penetrating hole ST2d are arranged side by side on one diagonal line of the sheet resin SP2, and the penetrating hole ST2b and the penetrating hole ST2c are arranged side by side on the other diagonal line of the sheet resin SP2. That is, the amount of resin in a portion along a diagonal line of the sheet resin SP2 decreases, and the amount of resin in a portion along a bisector of each side does not decrease. According to this, on the diagonal line of the sheet resin SP2 where a spacing between the edge of the sheet resin SP2 and the edge of the cavity 199 is small, a large amount of resin is able to flow inward during thermal compression; on the bisector of each side of the sheet resin SP2 where the spacing between the edge of the sheet resin SP2 and the edge of the cavity 199 is large, a large amount of resin is able to flow outward during thermal compression. Accordingly, it is possible to use the sheet resin SP2 of a rectangular shape for the cavity 199 of a circular shape, and loss of a resin film of a band shape that occurs when the sheet resin SP2 of a circular shape is cut from the resin film can be reduced. The penetrating holes ST2a, ST2b, ST2c, and ST2d may be arranged inclined at an angle of 45 degrees relative to, for example, the center of the sheet resin SP2 from the arrangement illustrated in
As described above, according to one aspect of the present invention, a resin-sealing method and a resin-sealing device can be provided in which variation in package dimensions can be reduced.
The embodiments described above are for facilitating the understanding of the present invention rather than for limiting the interpretation of the present invention. Each element included in the embodiments and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated and can be appropriately changed. It is possible to partially replace or combine the configurations shown in different embodiments.
1: resin-sealing device; 10: workpiece; 11: carrier; 12: component; 100: resin supply device; FR: feed roll; PR: pinch roll; CT: sheet cutter; PN: mechanical punch; SP1: sheet resin; ST1: penetrating hole; 190: resin molding die; 191: lower die; 192: upper die; 199: cavity.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2021/020674 | 5/31/2021 | WO |
