Patent Application
20230268104
The present patent application claims the priority of Japanese patent application No. 2022-025899 filed on Feb. 22, 2022, and the entire contents thereof are hereby incorporated by reference.
The present invention relates to a resistor.
Patent Literature 1 discloses a cement resistor including a case, a resistor arranged inside the case, and a cement material that is filled in the case and seals the resistor.
In the cement resistor described in Patent Literature 1, heat generated in the resistor is transferred to the cement material and the case in this order, then dissipated outside the cement resistor. However, there is a room for improving the cement resistor from the viewpoint of improving the heat dissipation.
The present invention was made in view of the aforementioned circumstances, and it is an object to provide a resistor that can improve the heat dissipation.
So as to achieve the above-mentioned object, one aspect of the present invention provides a resistor, comprising:
According to the present invention, it is possible to provide a resistor that can improve the heat dissipation.
The first embodiment of the present invention will be explained with referring to
The resistor 1 comprises a resistor main body 2 formed lengthy in one direction, and a resin portion 3 embedding the resistor main body 2. Hereinafter, a longitudinal direction of the resistor main body 2 will be simply referred to as the longitudinal direction X. In addition, a side closer to the center of the resistor main body 2 in the longitudinal direction X will be referred to as “longitudinally inward”. A side far from the center of the resistor main body 2 in the longitudinal direction X will be referred to as “longitudinally outward”.
The resistor main body 2 comprises a resistor element 21, and a pair of cap electrodes 22 fitted to both ends of the resistor element 21. In the present embodiment, the resistor element 21 is a so-called wire wound resistor element. The resistor element 21 comprises a core 211 having electric insulation, and a winding wire 212 spirally wound around an outer periphery of the core 211. For example, the core 211 is composed of a material having electric insulation such as ceramic with a cylindrical shape. The winding wire 212 is composed of wires such as nichrome wire. In the meantime, the resistor element 21 is not limited to the wire wound resistor element. For example, the resistor element 21 may be a ceramic resistor element without the winding wire 212, for example, may be composed of a ceramic having electrical conductivity with a pillar shape.
The cap electrode 22 is composed of an electrically conductive metal, etc. The cap electrode 22 comprises a disk-shaped bottom portion 221 which is orthogonal to the longitudinal direction X, a cylindrical side portion 222 extending longitudinally inward from a rim of the bottom portion 221. The cap electrode 22 is formed in a cap shape. In addition, the cap electrode 22 is opened at a side opposite to the bottom portion 221 in the side portion 222. The pair of cap electrodes 22 are fitted to the both ends of the resistor element 21 in the longitudinal direction X. In the state where the pair of cap electrodes 22 are fitted to the resistor element 21, the side portion 222 electrically contacts the winding wire 212 of the resistor element 21, and thus the cap electrode 22 is electrically connected to the winding wire 212. Note that the cap electrode 22 may be connected to the winding wire 212 by welding etc., in the state where the pair of cap electrodes 22 are fitted to the resistor element 21.
A flange 23 is formed at an end opposite to the bottom portion 221 in the side portion 222 of the cap electrode 22 to extend radially outwardly from the side portion 222. The flange 23 is formed in a plate-shape having a thickness in the longitudinal direction X. In the present embodiment, the flange 23 is integrally formed with the cap electrode 22. For example, the cap electrode 22 and the flange 23 can be formed at the same time by pressing a single plate. However, the present invention is not limited thereto, and the flange 23 and the cap electrode 22 may be formed separately (i.e., as separate pieces). In this case, the flange 23 may be connected to the cap electrode 22 by welding, etc.
The flange 23 comprises an exposed terminal 20 exposed from the resin portion 3. As shown in
The resin portion 3 comprises a rectangular column-shaped resin main body 31 formed lengthy in the longitudinal direction X and embedding the resistor main body 2 therein, and a plurality of radiation fins 32 protruded from the resin main body 31. In the present embodiment, the resin portion 3 is formed as a single resin molded article, and comprises the resin main body 31 and the plurality of radiation fins 32 integrally (i.e., as one piece). The resin portion 3 is a molded resin in which the resin main body 31 and the plurality of radiation fins 32 are formed at the same time by injecting a molten resin in a cavity and curing the resin in the state where the resistor main body 2 is accommodated in the mold.
The plurality of radiation fins 32 are protruded toward an opposite side (i.e., upward) to the tip end side of the exposed terminal 20 (i.e., downward). The radiation fin 32 is lengthy in the longitudinal direction X, and formed continuously from one end to the other end of the resin portion 3 in the longitudinal direction X. A space between the adjacent radiation fins 32 is opened at both sides in the longitudinal direction X. The plurality of radiation fins 32 are arranged at equal intervals and to be parallel each other. The radiation fin 32 is configured in such a manner that a protrusion length from the resin main body 31 is longer than a thickness of the radiation fin 32.
Because of the filler 302 with thermal conductivity being included in the resin portion 3, the thermal conductivity in the entire resin portion 3 can be improved and the high temperature inside the resistor 1 can be prevented. In the present embodiment, the thermal conductivity of the resin portion 3 is higher than the thermal conductivity of cement, for example, 2 W/(m·K) or more, preferably, 3 W/(m·K) or more. In addition, the thermal conductivity of the resin portion 3 can be set at 10 W/(m·K) or less.
General cement resistor is made by filling cement in a case, and cement adheres to the case. The resistor 1 in the present embodiment does not have a case to adhere to the resin portion 3 and house the resin portion 3. Hereby, it is possible to suppress the increase in size of the resistor 1. Note that it is possible to assemble the resistor 1 to a case manufactured separately (i.e., as a separate piece) from the resistor 1 when using the resistor 1. In this case, the resistor 1 is detachably attached to the case. However, the resistor 1 per se without the case is formed in a small size.
For example, the resistor 1 can be configured to be arranged within an engine room of a vehicle. In this case, for example, the resistor 1 may be arranged in a motor wiring for connecting a stator coil of a motor and a terminal block of the motor, to constitute a snubber circuit for suppressing a surge voltage. When the resistor 1 is arranged in high-temperature environments such as in the engine room, the environmental temperature of the resistor 1 becomes high and the resistor 1 is required to have high heat dissipation property. Thus, the resistor 1 according to the present embodiment is suitably used. In the state where the resistor 1 is attached to the circuit board 11, a lower surface of the rectangular column-shaped resin portion 3 faces the circuit board 11. The heat generated from the resistor 1 is transferred to the resin portion 3 and dissipated especially from a portion where the radiation fin 32 is provided to the air around the resistor 1 and the like, and the heat is transferred to the circuit board to be dissipated.
Note that the resistor 1 may be attached to an attaching object (i.e., attaching target member) other than the circuit board 11. In this case, for example, when a contact surface of the attaching object contacting the resistor 1 has a non-planar shape such as a curved surface, the contact surface of the resin portion 3 contacting the attaching object can be formed to have a shape in accordance with the non-planar shape of the resistor 1. In addition, the resin portion 3 may have a specific shape other than the rectangular column shape.
Next, a method for manufacturing the resistor 1 according to the present embodiment will be explained. In the method for manufacturing the resistor 1 according to the present embodiment, the resistor main body 2 is manufactured and provided in the mold. As the mold, it is possible to use two dies configured to reciprocate along a protruding direction of the exposed terminal 20 (i.e., the vertical direction Z). A lower die is provided with an insertion hole to which the exposed terminal 20 is inserted. The resistor main body 2 is arranged in the lower die by inserting the exposed terminal 20 into the lower die. An upper die is provided with convex and concave portions to form the plurality of radiation fins 32. After the resistor main body 2 is accommodated in the mold, the resin portion 3 is formed integrally with the resistor main body 2 by insert molding, which comprises a step of injecting the molten resin in a cavity and a step of curing the resin. As described above, it is possible to manufacture the resistor 1 according to the present embodiment.
In addition, for improving the removal of the upper die after the resin portion 3 is molded, the plurality of radiation fins 32 may be provided with a draft angle. For example, the radiation fin 32 may be configured in such a manner that surfaces other than the upper surface are inclined to decrease the thickness and the length in the longitudinal direction X toward the upper side.
Functions and Effects of the First Embodiment
In the resistor 1 according to the present embodiment, the resin portion 3 comprises the radiation fin 32. Therefore, a surface area of the resistor 1 is increased and thus the dissipation of the resistor 1 is improved. In addition, it is possible to easily form the radiation fin 32 by molding by providing the radiation fins 32 at the resin portion 3. In addition, the degree of freedom in forming the radiation fin 32 is improved by the configuration in which the resin portion 3 is provided with the radiation fin 32.
In addition, the radiation fin 32 is formed lengthy in the longitudinal direction X. Thus, the surface area of the resin portion 3 is increased easily, so that the heat dissipation property of the resistor 1 is improved.
Further, the resin portion 3 comprises the radiation fin 32 protruding toward the opposite side to the tip end side of the exposed terminal 20. That is, the resin portion 3 comprises the radiation fin 32 protruding toward an opposite side to the attaching object of the resistor 1 (in the present embodiment, the circuit board 11). Therefore, it is possible to improve the heat dissipation property of the resistor 1 since the heat of the resistor 1 is dissipated from one side to the attaching object and dissipated from the other side to the air by the radiation fin 32.
Further, the resin portion 3 comprises the base resin 301, and the filler 302 having the thermal conductivity higher than the thermal conductivity of the base resin 301. Thus, the heat dissipation property of the resistor 1 is improved.
Furthermore, the thermal conductivity of the resin portion 3 is 3 W/(m·K) or more. It is possible to improve the heat dissipation property of the resistor 1 by setting the thermal conductivity of the resin portion 3 at 3 W/(m·K) or more. In addition, it is possible to reduce the cost of the resin portion 3 and improve the formability of the resin portion 3 by setting the thermal conductivity of the resin portion 3 at 10 W/(m·K) or less. It is necessary to include a large amount of filler 302 to increase the thermal conductivity of the resin portion 3. However, as increasing the amount of the filler 302, the cost of manufacturing the resin portion 3 increases, and the fluidity of molten material for the resin portion 3 becomes worse so the formability of the resin portion 3 tends to become worse. Thus, it is possible to reduce the cost of manufacturing the resin portion 3 and improve the formability, by setting the thermal conductivity of the resin portion 3 at 10 W/(m·K) or less.
As described above, according to the present embodiment, it is possible to provide a resistor that can improve the heat dissipation property.
The resistor main body 2 according to the present embodiment comprises a pair of lead wires 24 respectively connected to a pair of cap electrodes 22. The lead wire 24 is jointed to a bottom portion 221 of the cap electrode 22 by welding or the like. The lead wire 24 is composed of a conductor wire such as tin-plated wire. In the pair of lead wires 24, a portion opposite to the cap electrode 22 is the exposed terminal 20 exposed outside the resin portion 3. Although
In the present embodiment, the resin main body 31 is formed in a columnar shape which is lengthy in the longitudinal direction X. The plurality of radiation fins 33, 34 are protruded from the resin main body 31 radially outwardly.
The plurality of radiation fins 33, 34 includes the plurality of radiation fins 33 formed radially at an upper half of the resin portion 3, and the plurality of radiation fins 34 that are formed beneath the plurality of radiation fins 33 and protruded from the resin main body 31 toward both sides in the lateral direction Y. The plurality of radiation fins 33 are formed radially when viewed from the longitudinal direction X. The plurality of radiation fins 33 are formed at equal angle pitches around a predetermined center axis. The radiation fins 33 have protrusion lengths equal to each other. Of the radiation fins 33, a radiation fin 33 located at the center protrudes toward a side opposite to the protrusion of the bent exposed terminal 20 (i.e., the upper side). In addition, a pair of radiation fins 33 located at the lowermost of the plurality of radiation fins 33 protrude from both sides in the lateral direction Y and are formed in parallel to the plurality of radiation fins 34. The protrusion length of the radiation fin 34 is longer as being located lower. Bottom surfaces of the lowermost pair of radiation fins 34 constitute the main surface 300.
For example, the resistor 1 according to the present embodiment can be manufactured by arranging the resistor main body 2 in a pair of dies reciprocating in the longitudinal direction X and by insert molding, which comprises a step of injecting the molten resin in a cavity and a step of curing the resin.
The other structure according to the present embodiment is the same with the structure according to the first embodiment. In addition, the same reference signs used in previously presented from the reference signs used after the second embodiment will indicates elements in the embodiment previously presented unless otherwise specified.
Functions and Effects of the Second Embodiment
In the present embodiment, the resin portion 3 comprises the plurality of radiation fins 33 that are radially formed. Thus, it is possible to minimize the size of the resistor 1 without losing the heat dissipation property. Besides, the resistor 1 in the second embodiment has similar effects to those of the first embodiment.
In the present embodiment, the protrusion length of the lowermost pair of radiation fins 34 may be made longer than the length shown in
In the present embodiment, a configuration of the resistor 1 according to the second embodiment is modified to improve the formability.
The resistor main body 2 comprises a pair of protruding pieces 25 that respectively protrudes from a pair of cap electrode 22 toward one side orthogonal to the longitudinal direction X. The protruding piece 25 is extended from an end opposite to the bottom portion 221 in the side portion 222 of the cap electrode 22. In the present embodiment, the protruding piece 25 is formed integrally with the cap electrode 22. A protruding end of the protruding piece 25 is provided as the exposed terminal 20 exposed from the main surface 300 of the resin portion 3 to the outside of the resin portion 3. A locating hole (i.e., positioning hole) 251 for enabling the positioning with respect to the mold is provided in the exposed terminal 20. The positioning will be explained below. In the present embodiment, as with the first embodiment, the direction where the tip end of the exposed terminal 20 faces will be referred to as the vertical direction Z, one side in the vertical direction Z to which the main surface 300 faces will be referred to as the lower side, and the opposite side to the lower side will be referred to as the upper side. In addition, the direction orthogonal to both the longitudinal direction X and the vertical direction Z will be referred to as the lateral direction Y.
Nests 26 are respectively fitted to the pair of cap electrodes 22 of the resistor main body 2. The nest 26 is composed of a resin and formed in a cap shape to which the cap electrode 22 can be inserted. The nest 26 comprises a disk-shaped nest bottom portion 261 facing the bottom portion 221 of the cap electrode 22, and a cylindrical nest side portion 262 extended from a rim of the nest bottom portion 261 toward the longitudinal direction X and facing the side portion 222 of the cap electrode 22. The nest 26 further comprises a plate-shaped portion 263 having a thickness in the vertical direction Z at a lower end.
As shown in
The resin portion 3 comprises a column-shaped resin main body 31 embedding the resistor main body 2 therein, and the plurality of radiation fins 35, 36 protruded from the resin main body 31. As shown in
As shown in
As shown in
In addition, as described below, a draft for easily removing the stationary die 5 and the movable die 6 described below in manufacturing the resistor 1 is formed on a surface of the resin portion 3. Firstly, as shown in
Next, the method for manufacturing the resistor 1 in the present embodiment will be explained.
After the resistor assy 4 is obtained, as shown in
As shown in
After the movable die 6 is fastened (i.e., mold-closed) to the stationary die 5, the sliding core 7 is inserted into the stationary side opening 52 and the movable side opening 62. The side surface of the sliding core 7, an inner surface of the stationary side opening 52, and an inner surface of the movable side opening 62 are formed with a draft for easily removing the sliding core 7 from the stationary side opening 52 and the movable side opening 62. After the sliding core 7 is tightened by the stationary die 5 and the movable die 6, the resin portion 3 is formed by insert molding by injecting a molten resin into a region surrounded by the stationary side cavity surface 51, the movable side cavity surface 61, and sliding core 7, and curing the resin. After the resin portion 3 is molded, the sliding core 7 is removed from the stationary side opening 52 and the movable side opening 62, and the movable die 6 is moved away from the stationary die 5 along the longitudinal direction X so that the resistor 1 can be taken away from the stationary die 5.
Functions and Effects of the Third Embodiment
The length L of each of the radiation fins 35, 36 is not less than two times the maximum thickness T of each of the radiation fins 35, 36 in the cross-section of the resistor 1 in a direction orthogonal to the longitudinal direction X. Thus, it is possible to easily increase an entire surface area of the resistor 1 and easily improve the heat dissipation property of the resistor 1. In addition, by forming the radiation fins 35, 36 as a part of the resin portion 3, it is possible to easily form the radiation fin 35, 36 each having a long protrusion length as described above by molding. Furthermore, since the inclination to improve the removal of the stationary die 5 and the movable die 6 is formed at the surface of the resin portion 3, and thus it is possible to more easily form the resin portion 3. Besides, the similar effects to the first embodiment and the second embodiment can be obtained.
As shown in
The resistor main body 2 comprises a pair of terminal pieces 27 respectively connected to the bottom portions 221 of the pair of cap electrodes 22. Each terminal piece 27 is protruded from the cap electrode 22 toward one direction orthogonal to the longitudinal direction X. The terminal piece 27 as a whole constitutes the exposed terminal 20 exposed from the resin portion 3. In the present embodiment, as with the first embodiment, the direction where the tip end of the exposed terminal 20 faces will be referred to as the vertical direction Z. The side to which the main surface 300 faces will be referred to as the lower side and the opposite side of that will be referred to as the upper side. In addition, the direction orthogonal to both the longitudinal direction X and the vertical direction Z will be referred to as a lateral direction Y.
The resin portion 3 comprises the resin main body 31 embedding the resistor main body 2, and a lateral fin 37 and vertical fins 381, 382 protruded from the resin main body 31. The lateral fin 37 is a radiation fin protruded from the resin main body 31 toward both sides in the lateral direction Y. The vertical fins 381, 382 are radiation fins protruded from the resin main body 31 toward both sides in the vertical direction Z. In the present embodiment, the resin portion 3 comprises two lateral fins 37 at both respective sides in the lateral direction Y. In addition, the resin portion 3 comprises six vertical fins 381, 382 protruded upward.
Four lateral fins 37 are formed at the bottom end of the resin portion 3. The four lateral fins 37 have the same protrusion length. As shown in
Upper end positions of six vertical fins 381, 382 are at the same height in the vertical direction Z. The six vertical fins 381, 382 comprise four first vertical fins 381 formed straight upward from the resin main body 31, and two second vertical fins 382 each comprising a base end portion 382a along the lateral direction Y and a tip end portion 382b protruding upward from the base end portion 382a. The two second vertical fins 382 are formed at both sides of the four first vertical fins 381 in the lateral direction Y. Further, the second vertical fin 382 is formed at a location overlapping with the lateral fin 37 in the vertical direction Z. In other words, a formation area of the second vertical fin 382 overlaps a formation area of the lateral fin 37. In the present embodiment, a length of the base end portion 382a of the second vertical fin 382 in the lateral direction Y is shorter than a length of the lateral fin 37 in the lateral direction Y. In addition, the six vertical fins 381, 382 are formed to fall within a range from the protruding end of the lateral fin 37 on one side to the protruding end of the lateral fin 37 on the other side.
As shown in
In the cross-section of the resistor 1 in a direction orthogonal to the longitudinal direction X, a length of each radiation fin (i.e., the lateral fins 37 and the vertical fins 381, 382) is not less than two times, preferably not less than two and half times the maximum thickness T. Further, when the radiation fin has a curved shape like the second vertical fin 382, the length of the second vertical fin 382 means a total length of a length L1 of the base end portion 382a and a length L2 of the tip end portion 382b.
Next, the method for manufacturing the resistor 1 according to the present embodiment will be explained.
The sliding core 7 movable in the lateral direction Y is arranged in the stationary die 5. The sliding core 7 is provided for forming the lateral fin 37 of the resin portion 3 together with the stationary die 5. A pair of sliding cores 7 are fixed to the stationary die 5 at a predetermined location in the lateral direction Y in accordance with the length of the lateral fin 37. Then, the movable die 6 is moved toward the stationary die 5 in the vertical direction Z and the mold closing is completed.
The resin portion 3 is formed by insert molding by injecting a molten resin in a region surrounded by the stationary side cavity surface 51, the movable side cavity surface 61, and the pair of sliding cores 7 that are tightened, and curing the resin. After the resin portion 3 is molded, the pair of sliding cores 7 are moved in the lateral direction Y to separate from each other, and the movable die 6 is separated from the stationary die 5 in the vertical direction Z so that the resistor 1 can be taken away from the stationary die 5.
Functions and Effects of the Fourth Embodiment
In the present embodiment, the resin portion 3 comprises only the lateral fin 37 and the vertical fins 381, 382 as the radiation fins. Thus, it is possible to simplify a structure of a mold for molding the resin portion 3.
In addition, the resin portion 3 comprises the plurality of lateral fins 37 protruded toward both sides in the lateral direction Y and the plurality of vertical fins 381, 382 protruded only upward in the vertical direction Z. Further, the plurality of vertical fins 381, 382 comprise the first vertical fin 381 formed straight in the vertical direction Z, and the second vertical fins 382 each comprising the base end portion 382a along the lateral direction Y and the tip end portion 382b protruding upward from the base end portion 382a. Furthermore, the second vertical fin 382 is formed at a location overlapped with the lateral fin 37 in the vertical direction Z. Hereby, it is possible to suppress the increase in size of the resistor 1 and the increase in surface area of the resin portion 3 since the second vertical fin 382 is formed in a space between the first vertical fin 381 and the lateral fin 37, i.e., a dead space. Besides, the similar effects to the first embodiment are achieved.
The present embodiment has a main structure similar to the fourth embodiment except for a shape of the terminal piece 27 and a formation range of the resin portion 3.
The terminal piece 27 comprises a first portion 271 being joined to overlap with the bottom portion 221 of the cap electrode 22, a second portion 272 extended longitudinally outward from an end of the first portion 271 opposite to a protruding side of the vertical fins 381, 382, and a third portion 273 extended from a longitudinal outer end of the second portion 272 toward the protruding side of the vertical fins 381, 382. The terminal piece 27 constitutes a longitudinal outer portion of the second portion 272 and the exposed terminal 20 in which the third portion 273 is exposed from the resin portion 3. The resin portion 3 is formed longitudinally outward with respect to the pair of cap electrodes 22. The other structure of the resistor 1 is similar to the fourth embodiment.
In addition, the method for manufacturing the resistor 1 according to the present embodiment can be the same as the method according to the fourth embodiment. Note that, when the stationary die 5 holds the resistor main body 2, the stationary die 5 holds only the exposed terminal 20 in the present embodiment.
Functions and Effects of the Fifth Embodiment
In the present embodiment, it is possible to have the same effects with the fifth embodiment and it is possible to achieve further improvement in the heat dissipation property of the resistor 1 since the formation range of the resin portion 3 is large.
Next, the technical concept grasped from the above-described embodiment is described with reference to the signs or the like in the embodiment. However, each sign or the like in the following description is not limited to a member or the like specifically showing the elements in the following claims in the embodiment.
According to the first feature, a resistor 1 includes a resistor main body 2; and a resin portion 3 covering the resistor main body 2, wherein the resin portion 3 comprises a radiation fin 32, 33, 34, 35, 36, 37, 381, 382.
According to the second feature, in the resistor 1 according to the first feature, the radiation fin 32, 33, 34, 35, 36, 37, 381, 382 is formed lengthy in a longitudinal direction X of the resistor main body 2.
According to the third feature, in the resistor 1 according to the first or second feature, a length L of the radiation fin 32, 33, 34, 35, 36, 37, 381, 382 is not less than two times a maximum thickness T of the radiation fin 32, 33, 34, 35, 36, 37, 381, 382 in a cross-section orthogonal to a longitudinal direction X of the resistor main body 2.
According to the fourth feature, in the resistor 1 according to any one of the first to third features, the resin portion 3 includes only a lateral fin 37 protruded in a lateral direction Y orthogonal to the longitudinal direction X of the resistor main body 2, and a vertical fin 381, 382 protruded in a vertical direction Z orthogonal to both the longitudinal direction X and the lateral direction Y as the radiation fin 37, 381, 382.
According to the fifth feature, in the resistor 1 according to the fourth feature, the resin portion 3 includes a plurality of the lateral fins 37 protruded toward both sides in the lateral direction Y, and a plurality of the vertical fins 381, 382 protruded toward only one side in the vertical direction Z, wherein the plurality of vertical fins 381, 382 includes a first vertical fin 381 formed straight in the vertical direction Z, a second vertical fin 382 comprising a base end portion 382a along the lateral direction Y, and a tip end portion 382b protruded from the base end portion 382a toward the one side in the vertical direction Z, and wherein the second lateral fin 382 is formed at a location overlapping with the lateral fin 37 in the vertical direction Z.
According to the sixth feature, in the resistor 1 according to any one of the first to third feature, in the resin portion 3 comprises a plurality of the radiation fins 33, 35 that are radially protruded when viewed from a longitudinal direction X of the resistor main body 2.
According to the seventh feature, in the resistor 1 according to any one of the first to sixth features, the resistor main body 2 includes an exposed terminal 20 exposed from the resin portion 3, and wherein the resin portion 3 comprises the radiation fin 32, 33, 35, 381, 382 protruded toward a side opposite to a tip end side of the exposed terminal 20.
According to the eighths feature, in the resistor 1 according to any one of the first to the seventh features, the resin portion 3 comprises a base resin 301 and a filler 302 having a thermal conductivity higher than the base resin 301.
According to the ninth feature, in the resistor 1 according to the eighth feature, a thermal conductivity of the resin portion 3 is 3 W/m·K or more and 10 W/m·K or less.
Notes
Although the embodiments of the invention have been described, the invention is not to be limited to the embodiments. Please note that all combinations of the features described in the embodiments are not necessary to solve the problem of the invention. In addition, the various kinds of modifications can be implemented without departing from the gist of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-025899 | Feb 2022 | JP | national |
