Claims
- 1. A water soluble, A-stage, unreacted, uncured but curable composition consisting of:
- (a) an alkaline phenolic resole resin having a formaldehyde to phenol mole ratio of from 0.5:1 to 3.5:1 and a base catalyst to phenol mole ratio of from 0.01:1 to 1:1;
- (b) melamine crystal dispersed in the resole resin, wherein the melamine crystal to phenol mole ratio is from 0.01:1 to 1.0:1.0; and
- (c) an acid selected from the group consisting of oxalic acid, sulfamic acid, nitric acid, and methane sulfonic acid, in an amount sufficient to catalyze the polymerization reaction of said resin with the melamine crystal upon subsequent exposure to elevated temperatures, neutralize the base and drop the pH of the dispersion to a level of from 2.5 to about 5.5; and wherein the dispersion produced is a water soluble, curable, A-stage composition.
- 2. The composition of claim 1 wherein the formaldehyde to phenol mole ratio is from 1.0:1 to 3.0:1.
- 3. The composition of claim 1 wherein the base catalyst is sodium hydroxide and is present in the resole of step (a) at a level of about 8 weight percent based on phenol.
- 4. The composition of claim 1 wherein the dispersion is first dissolved in water, then recrystallized in water to form a dispersion.
- 5. The composition of claim 1 wherein the melamine to phenol mole ratio is from 0.20:1 to about 0.75:1.
- 6. The composition of claim 1 wherein the acid is oxalic or sulfamic acid.
- 7. The composition of claim 1 wherein the acid is sulfamic acid and the pH in step (c) is about 4.5.
- 8. The composition of claim 1 wherein the elevated temperature is about 350.degree. to 550.degree. F.
- 9. A substrate bearing on its surface the curable composition of claim 1.
- 10. The substrate of claim 9 wherein the substrate is a glass fiber mat.
- 11. The composition of claim 1 which is essentially free of methylol melamine.
- 12. The composition of claim 1 which is essentially free of methoxy methyl melamine.
- 13. The composition of claim 1 which eliminates water and not formaldehyde upon polymerization of step (c).
- 14. The composition of claim 1 wherein the resole exhibits 200 to 600 ppm unreacted phenol.
- 15. The composition of claim 1 which exhibits 2 to 15 ppm formaldehyde.
- 16. The composition of claim 1 which is yellow colored.
- 17. The composition of claim 1 wherein the base catalyst is present at a level of from 18 to 20 mole percent based on the phenol content in the composition.
- 18. The composition of claim 1, wherein the pH in step (c) is 5.0 to 5.5, any liquid and volatile components have been removed, and a dry, solid composition is provided.
- 19. The composition of claim 1 wherein the phenolic to melamine crystal ratio on a solids weight ratio is from about 95:5 to 65:35.
- 20. The composition of claim 1 wherein the base catalyst is selected from alkali metals, salts thereof and hexamine in an amount sufficient to provide the alkaline resole.
- 21. A method of preparing a water-soluble curable composition consisting of the steps of:
- (a) preparing an alkaline resole resin composition by combining formaldehyde and phenol at a formaldehyde to phenol mole ratio of from about 0.5:1 to 3.5:1 in the presence of a basic catalyst, wherein the catalyst to phenol mole ratio is from about 0.01:1 to 1:1;
- (b) dispersing in said resole resin a quantity of melamine crystal, wherein the melamine crystal to phenol mole ratio is from 0.01:1 to 1:1; and
- (c) adding to the dispersion of step (b) an acid selected from the group consisting of oxalic acid, sulfamic acid, nitric acid, and methane sulfonic acid in an amount sufficient to drop the pH to a level of from 2.5 to 5.5, wherein the temperature is not sufficient to dissolve the melamine or to initiate any polymerization between the melamine and the resole.
- 22. The method of claim 21 wherein the pH in step (c) is from 5.0 to 5.5.
FIELD OF THE INVENTION
This is a continuation-in-part of Ser. No. 886,428 filed May 20, 1992, now abandoned.
US Referenced Citations (5)
Foreign Referenced Citations (1)
| Number |
Date |
Country |
| 6089555 |
Jul 1981 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
| Parent |
886428 |
May 1992 |
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