The present disclosure relates to a resonator.
A piezoelectric resonator that vibrates in a so-called width-expansion vibration mode includes a support frame that has, for example, a rectangular shape and a vibrating portion that is disposed in the support frame and that has, for example, a rectangular shape. The vibrating portion includes, for example, four vibration regions that are arranged in a row in a first direction, and stretching vibration, which entails repetitive expansion and contraction, in the first direction occurs as a result of electric fields having opposite phases being alternately applied to the adjacent vibration regions.
The vibrating portion is connected to the support frame by, for example, two pairs of support portions each extending in a second direction, which is perpendicular to the first direction. Each of the two pairs of support portions are respectively connected to, for example, the two adjacent vibration regions that are the inner vibration regions located between the other two vibration regions, which are the outer vibration regions positioned at the opposite sides in the first direction. Each of the support portions is connected to one of the end portions of the corresponding inner vibration region, each of the end portions being defined as a node point, that is, a minimum displacement point, and being located on a center line of the vibration region in the first direction.
Patent Document 1: U.S. Pat. No. 7,639,105,
Patent Document 2: Japanese Unexamined Patent Application Publication No. 2008-228195,
It was found that, since the vibration regions are disposed on opposite sides of each of the adjacent inner vibration regions, as a result of each of the inner vibration regions being influenced by displacement of the vibration regions disposed on opposite sides thereof, neither of the end portions on the center lines of the inner vibration regions in the first direction serve as a node point. Consequently, even if the support portions are connected to the end portions on the center lines of the inner vibration regions, sufficient resonator characteristics are not obtainable.
The present disclosure has been made in view of the above situation, and provides a resonator having resonator characteristics that are further improved compared with the conventional designs.
A resonator according to an exemplary aspect includes a support frame, a rectangular vibrating plate that has a first side and a second side, which extend in a predetermined direction so as to be parallel to each other, and that performs contour vibration in a predetermined direction, and two pairs of support arms that connect the first side and the second side of the vibrating portion and the support frame to one another. The vibrating plate includes at least four vibration regions arranged in a row in the predetermined direction, each of the at least four vibration regions being configured to vibrate with a phase opposite to phases with which the adjacent vibration regions vibrate, and electrode films, each of which is formed so as to be included in one of the vibration regions. A center line of each of the electrode films in the predetermined direction is displaced from a center line of a corresponding one of the vibration regions in the predetermined direction, the corresponding one of the vibration regions including the electrode film.
A resonator according to another exemplary aspect includes a support frame, a rectangular vibrating plate portion that has a first side and a second side, which extend in a predetermined direction so as to be parallel to each other, and that performs contour vibration in a predetermined direction, and two pairs of support arms that connect the first side and the second side of the vibrating portion and the support frame to one another. The vibrating plate includes at least four vibration regions arranged in a row in the predetermined direction, each of the at least four vibration regions being configured to vibrate with a phase opposite to phases with which the adjacent vibration regions vibrate. A center line of each of the support portions in the predetermined direction is displaced from a center line of a corresponding one of the vibration regions in the predetermined direction, the corresponding one of the vibration regions being connected to the support portion.
According to the present disclosure, a resonator having resonator characteristics that are further improved compared with the conventional resonator designs is provided.
A first embodiment will be described below with reference to the accompanying drawings.
The piezoelectric vibrator 13 includes a support frame 14 extending along an XY plane of the rectangular coordinate system of
The support frame 14 includes a pair of long-side frame bodies 14a and 14a extending in a direction parallel to the X-axis (i.e., a first direction, shown as the lengthwise direction) and a pair of short-side frame bodies 14b and 14b extending in a direction parallel to the Y-axis (i.e., a second direction, shown as the widthwise direction). The ends of the short-side frame bodies 14b and 14b being connected to the ends of the long-side frame bodies 14a and 14a. The vibrating portion 15 has first and second long sides extending in the X-axis direction so as to be parallel to each other, and the first and second sides extend parallel to the frame bodies 14a and 14a. The pair of support portions 16a and 16a and the pair of support portions 16b and 16b each extend in a straight line parallel to the Y-axis and connect the frame bodies 14a and 14a and the vibrating portion 15 to one another.
The lower substrate 11 extends along the XY plane so as to have a flat plate-like shape, and a recess 17 having, for example, a flat rectangular parallelepiped shape is formed in the top surface of the lower substrate 11. The recess 17 forms part of the vibration space of the vibrating portion 15. The upper substrate 12 extends along the XY plane so as to have a flat plate-like shape, and a recess 18 having, for example, a flat rectangular parallelepiped shape is formed in the lower surface of the upper substrate 12. The recess 18 forms part of the vibration space of the vibrating portion 15. In the vibration space, a vacuum state is maintained. The lower substrate 11 and the upper substrate 12 are made of, for example, silicon (Si).
As described above, the vibrating portion 15 is supported by the support frame 14 with the two pairs of support portions 16a, 16a and 16b, 16b. The pair of support portions 16a and 16a connect the vibration region 15b, which is positioned further inside than the outer vibration region 15a, and frame bodies 14a and 14a to one another. The pair of support portions 16b and 16b connect the vibration region 15c, which is positioned further inside than the outer vibration region 15d, and frame bodies 14a and 14a to one another.
The Si oxide film 21 is a film for correcting the frequency-temperature characteristics of the piezoelectric vibrator 13, and for example, SiO2 is used for forming the Si oxide film 21. Instead of SiO2, a silicon oxide material containing a suitable composition of a SiaOb layer (a and b are integers) may be used for forming the Si oxide film 21. The Si layer 22 is formed of an n-type Si semiconductor in a degenerate state and includes phosphorus (P) as an n-type dopant. For example, aluminum nitride (AlN) is used for forming the piezoelectric thin film 23. However, instead of AlN, scandium aluminum nitride (ScAlN) or the like may be used for forming the piezoelectric thin film 23.
The lower electrode film 24 is formed across all the vibration regions 15a and 15d and serves as an electrode common to all the vibration regions 15a and 15d. The lower electrode film 24 is formed as a floating electrode. In contrast, the upper electrode films 25 are each formed so as to correspond to one of the vibration regions 15a and 15d. For example, molybdenum (Mo) is used for forming the lower electrode film 24 and the upper electrode films 25. Note that, instead of providing the single lower electrode film 24, a plurality of lower electrode films 24 may each be formed so as to correspond to one of the vibration regions 15a and 15d.
The AlN included in the piezoelectric thin film 23 has a wurtzite structure, and the c-axis thereof is oriented substantially perpendicularly to the Si layer 22. When alternating-current (AC) electric fields are applied to the upper electrode films 25 in the c-axis direction such that the AC electric fields having opposite phases are alternately applied to the adjacent upper electrode films 25, the vibration regions 15a and 15d are mechanically coupled to one another, and as a result, the entire vibrating portion 15 performs harmonic contour vibration. In other words, in the X-axis direction, the vibrating portion 15 vibrates in a width-expansion mode in which the vibrating portion 15 repeatedly expands and contracts.
Returning to
In the present embodiment, in the inner vibration regions 15b and 15c, the center lines L1 of the upper electrode films 25 respectively coincide with the center line of the support portions 16a and 16a and the center line of the support portions 16b and 16b in the X-axis direction as is clear from
In the piezoelectric vibrator 13 according to the present embodiment, for example, the Si layer 22 has a width of 200 μm in the X-axis direction, a length of 74 μm in the Y-axis direction, and a thickness of 10 μm in the Z-axis direction. Each of the support portions 16a and 16b has a width of 5 μm in the X-axis direction and a length of 5 μm in the Y-axis direction. In this case, in the inner vibration regions 15b and 15c, displacement between each of the center lines L1 of the upper electrode films 25 and the support portions 16a and 16b and the corresponding one of center lines L2 of the vibration regions 15b and 15c is set to 2 μm. In addition, the ratio of the width of each of the upper electrode films 25 to the width of the corresponding one of the vibration regions 15a and 15d in the X-axis direction is set to 0.7.
In the piezoelectric vibrator 13, which has been described above, the vibration regions 15a and 15c are arranged adjacent to the vibration region 15b, and the vibration regions 15b and 15d are arranged adjacent to the vibration region 15c. As will be described later, in the verification conducted by the inventors of the present invention, it was found that, as a result of the vibration regions 15b and 15c respectively being influenced by displacement of the adjacent vibration regions located on the opposite sides thereof, the actual minimum displacement point (maximum deformation point) of the vibration region 15b and the actual minimum displacement point (maximum deformation point) of the vibration region 15c were respectively displaced, toward the inside of the vibrating portion 15 in the X-axis direction, from the center line L2 of the vibration region 15b, on which the original minimum displacement point (maximum deformation point) of the vibration region 15b was considered to be present, and the center line L2 of the vibration region 15c, on which the original minimum displacement point (maximum deformation point) of the vibration region 15c was considered to be present.
In the present embodiment, in the inner vibration regions 15b and 15c, the center lines L1 of the corresponding upper electrode films 25 are each displaced toward the inside of the vibrating portion 15, that is, the actual minimum displacement point thereof, and each of the corresponding upper electrode films 25 is formed with its actual maximum deformation point corresponding to its center. Thus, vibration efficiency can be improved, and as a result, vibrator characteristics can be improved. As a result of each of the center lines of the pairs of support portions 16a, 16a and 16b, 16b being displaced toward the inside of the vibrating portion 15, that is, toward the corresponding actual minimum displacement point, such that each of the pairs of support portions 16a, 16a and 16b, 16b is aligned to the corresponding actual minimum displacement point, loss of vibration of the vibration regions 15b and 15c as a result of being supported by the support portions 16a and 16b can be minimized.
When the verification was conducted, the ratio dx/W of the displacement amount dx of each of the center lines L1 of the upper electrode films 25 and the support portions 16a and 16b from the corresponding center line L2 of the vibration region 15b and 15c to the width W of the vibration region 15b and 15c in the X-axis direction was varied. As a result, as illustrated in
Each of the slits 27 is a through hole extending through a corresponding one of the frame bodies 14a in the Z-axis direction. For example, each of the slits 27 has a rectangular shape elongated in the X-axis direction as its contour shape, and the center line of the slit 27 extending in the X-axis direction coincides with a corresponding one of the center lines L1 of the upper electrode films 25 and the support portions 16a and 16b. With the above-described configuration, the support portions 16a and 16b are connected to the support frame 14 by the bending-vibration portions 28. The bending-vibration portions 28 extend so as to be elongated in the X-axis direction perpendicular to the Y-axis direction. For example, each of the bending-vibration portions 28 has a length of 5 μm in the Y-axis direction and a width of 25 μm in the X-axis direction.
In the piezoelectric vibrator 13a, when vibration of the vibrating portion 15 is transmitted to the bending-vibration portions 28 via the support portions 16a and 16b, the vibration is converted into bending vibration in the Z-axis direction in the bending-vibration portions 28. Since the interfaces between the bending-vibration portions 28 and the corresponding frame bodies 14a indicated by dotted lines in
Note that the distance D from each of the ends of the support portions 16a and 16b in the X-axis direction to a corresponding one of the interfaces between the bending-vibration portions 28 and the frame bodies 14a is set in accordance with the natural vibration frequency in the vibrating portion 15. More specifically, in the case where the wavelength of bending vibration corresponding to the natural vibration frequency of the vibrating portion 15 is λ, the distance D is set to λ/4. With the above-described configuration, vibration can be contained in the bending-vibration portions 28 with certainty. In addition, since the area of the support frame 14 outside the interfaces is large, the acoustic reflection effect can be improved, and as a result, vibration can be contained by the bending-vibration portions 28 with higher certainty.
In
In
In the above-described piezoelectric vibrators 13 and 13a, even in the case where the vibrating portion 15 has five vibration regions, advantageous effects similar to those described above can be realized. In this case, it is preferable that an additional vibration region be formed between the above-described vibration regions 15b and 15c. In addition, in the case where a plurality of lower electrode films 24 are each formed so as to correspond to one of the vibration regions 15a and 15d instead of providing the above-described single lower electrode film 24, it is preferable that the lower electrode films 24 formed in or on the vibration regions 15b and 15c be offset inwardly in a similar manner to the above-described upper electrode films 25.
It is noted that each of the embodiments has been described above for ease of understanding of the present disclosure and is not intended to limit the scope of the present invention. Changes and improvements may be made to the present disclosure within the scope of the present invention, and the present invention includes equivalents thereof. In other words, design changes may be suitably made to the embodiments by those skilled in the art, and such embodiments are also within the scope of the present invention as long as they have the features of the present invention. For example, the elements included in the embodiments and the arrangements, materials, conditions, shapes, sizes and the like of the elements are not limited to those described above as examples, and they may be suitably changed. Each of the embodiments is an example, and it is obvious that the configurations according to the different embodiments may be partially replaced with one another or may be combined with each other, and other embodiments obtained as a result of such replacements and combinations are also within the scope of the present invention as long as they have the features of the present invention.
13 vibrator (piezoelectric vibrator)
13
a vibrator (piezoelectric vibrator)
14 support frame
15 vibrating portion
15
a to 15d vibration region
16
a support portion
16
b support portion
25 electrode film (upper electrode film)
L1 center line
L2 center line
Number | Date | Country | Kind |
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2015-007029 | Jan 2015 | JP | national |
The present application is a continuation of PCT/JP2016/050545 filed Jan. 8, 2016, which claims priority to Japanese Patent Application No. 2015-007029, filed Jan. 16, 2015, the entire contents of each of which are incorporated herein by reference.
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Entry |
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Number | Date | Country | |
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20170222621 A1 | Aug 2017 | US |
Number | Date | Country | |
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Parent | PCT/JP2016/050545 | Jan 2016 | US |
Child | 15483161 | US |