Reversed semilattice filter

Information

  • Patent Grant
  • 12170515
  • Patent Number
    12,170,515
  • Date Filed
    Monday, January 31, 2022
    2 years ago
  • Date Issued
    Tuesday, December 17, 2024
    a day ago
Abstract
Reversed semilattice filters with improved common mode rejection characteristics are disclosed. In one aspect, a filter may include two interior nodes coupled with an impedance that treats unwanted signals as common mode signals and provides rejection for common mode signals while passing differential signals of interest. The impedance is modified to have a resonant circuit that improves signal rejection in the stop band by lowering the effective impedance at those frequencies while leaving the pass band unaffected.
Description
BACKGROUND
I. Field of the Disclosure

The technology of the disclosure relates generally to filters and, more particularly, to reversed semilattice filters and, more particularly, to reversed semilattice filters with improved rejection characteristics.


II. BACKGROUND

Computing devices abound in modern society, and more particularly, mobile communication devices have become increasingly common. The prevalence of these mobile communication devices is driven in part by the many functions that are now enabled on such devices. Increased processing capabilities in such devices means that mobile communication devices have evolved from pure communication tools into sophisticated mobile entertainment centers, thus enabling enhanced user experiences. The advent of the Fifth Generation-new radio (5G-NR) cellular standards have imposed more stringent standards on signal processing. Not only are the standards more stringent, but they are also relevant at frequencies substantially higher than those contemplated by previous cellular standards. Accordingly, there remains room for improvement in the processing of high frequency signals including processing by filters.


SUMMARY

Aspects disclosed in the detailed description include reversed semilattice filters with improved common mode rejection characteristics. In particular, a filter may include two interior nodes coupled with an impedance that treats unwanted signals as common mode signals and provides rejection for common mode signals while passing differential signals of interest. The impedance is modified to have a resonant circuit that improves signal rejection in the stop band by lowering the effective impedance at those frequencies while leaving the pass band unaffected. The improved performance in the stop band improves overall performance and compliance with newer cellular standards.


In this regard in one aspect, a filter is disclosed. The filter comprises a first impedance path between an input node and an output node. The first impedance path comprises a first impedance and a second impedance serially connected to one another and defining a first node therebetween. The filter also comprises a second impedance path between the input node and the output node. The second impedance path is electrically parallel to the first impedance path. The second impedance path comprises a third impedance and a fourth impedance serially connected to one another and define a second node therebetween. The first impedance path and the second impedance path comprise a reversed semilattice filter. The filter also comprises a first inductor coupled the first node. The filter also comprises a second inductor serially coupling the first inductor to the second node. The filter also comprises a resonant circuit associated with the first inductor and the second inductor. The resonant circuit is configured to lower a common mode impedance for the filter at a predetermined notch frequency.


In another aspect, a filter is disclosed. The filter comprises a transformer comprising a first coil having a first center tap and a second coil having a second center tap. The filter also comprises a first impedance path. The first impedance path comprises a first impedance coupling an input node to the first coil. The first impedance path also comprises a second impedance coupling the second coil to an output node. The filter also comprises a second impedance path. The second impedance path comprises a third impedance coupling the input node to the first coil. The third impedance is electrically parallel to the first impedance. The second impedance path also comprises a fourth impedance coupling the second coil to the output node. The fourth impedance is electrically parallel to the second impedance. Collectively, the first impedance path, the second impedance path, and the transformer comprise a reversed semilattice filter. The transformer couples the first impedance to the second impedance. The transformer couples the third impedance to the fourth impedance. The filter also comprises a resonant circuit associated with the first center tap. The resonant circuit is configured to lower a common mode impedance for the filter at a predetermined notch frequency.


In another aspect, a filter is disclosed. The filter comprises a first impedance path between an input node and an output node. The first impedance path comprises a first impedance and a second impedance serially connected to one another and defining a first node therebetween. The filter also comprises a second impedance path between the input node and the output node. The second impedance path is electrically parallel to the first impedance path. The second impedance path comprises a third impedance and a fourth impedance serially connected to one another and defining a second node therebetween. The first impedance path and the second impedance path comprise a reversed semilattice filter. The filter also comprises a first inductor coupled the first node. The filter also comprises a second inductor serially coupling the first inductor to the second node and defining a third node between the first inductor and the second inductor. The filter also comprises a capacitor coupling the third node to ground to lower a common mode impedance for the filter at a predetermined notch frequency.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a circuit diagram of a conventional reversed semilattice filter;



FIG. 2A is a block diagram of a reversed semilattice filter with a common mode rejection circuit according to an exemplary aspect of the present disclosure;



FIG. 2B is a circuit diagram providing additional details of the common mode rejection circuit of FIG. 2A;



FIG. 3 is a circuit diagram of an exemplary aspect of a reversed semilattice filter with a simple resonant circuit used to form the common mode rejection circuit of FIG. 2A



FIG. 4 is a circuit diagram with a generic common mode impedance and multiple resonators used as impedance in the reversed semilattice filter to provide multiple resonances;



FIG. 5 is a circuit diagram of one exemplary aspect of the circuit of FIG. 4;



FIG. 6 is a circuit diagram of a second exemplary aspect of the circuit of FIG. 3 or 5;



FIG. 7 is a circuit diagram of another exemplary aspect of the circuit of FIG. 3 or 5;



FIG. 8 is a circuit diagram of a reversed semilattice filter that implements a differential impedance with a transformer; and



FIG. 9 is a circuit diagram of an alternate filter using the transformer of FIG. 8 and a higher order common mode rejection network.





DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.


It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.


It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.


Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.


The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.


Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.


Aspects disclosed in the detailed description include reversed semilattice filters with improved common mode rejection characteristics. In particular, a filter may include two interior nodes coupled with an impedance that treats unwanted signals as common mode signals and provides rejection for common mode signals while passing differential signals of interest. The impedance is modified to have a resonant circuit that improves signal rejection in the stop band by lowering the effective impedance at those frequencies while leaving the pass band unaffected. The improved performance in the stop band improves overall performance and compliance with newer cellular standards.


Before addressing exemplary aspects of the present disclosure, a brief review of a conventional reversed semilattice filter is provided with reference to FIG. 1. As a note of nomenclature, a semilattice filter may also be referred to in the literature as a half lattice or transversal filter. A discussion of exemplary aspects of the present disclosure begins below with reference to FIG. 2A.


In this regard, FIG. 1 is circuit diagram of a conventional reversed semilattice filter 100. The filter 100 includes an input node 102 and an output node 104. The filter 100 further includes an input LC circuit 106 formed from a first inductor 108 and a first capacitor 110. The filter further includes an output LC circuit 112 formed from a second inductor 114 and a second capacitor 116. The input LC circuit 106 and the output LC circuit 112 couple to a ground 118. The filter 100 further includes a first impedance path 120 between the input node 102 and the output node 104. The first impedance path 120 includes a first impedance 122 and a second impedance 124 serially connected to one another and defining a first node 126 therebetween. As illustrated, the first impedance 122 and the second impedance 124 may be bulk acoustic wave (BAW) resonators.


The filter 100 further includes a second impedance path 128 between the input node 102 and the output node 104. The second impedance path 128 is electrically parallel to the first impedance path 120. The second impedance path 128 includes a third impedance 130 and a fourth impedance 132 serially connected to one another and defining a second node 134 therebetween. As illustrated, the third impedance 130 and the fourth impedance 132 may be BAW resonators.


The filter 100 further includes an inductor 136 coupled to the first node 126. The inductor 136 is serially coupled to an inductor 138. The inductor 138 couples to the second node 134. A third node 140 is positioned between the inductor 136 and the inductor 138. The third node 140 may be coupled to ground 118. The inductor 136 and the inductor 138 are coupled to one another.


In the past, the impedances 122, 124, 130, 132 and the inductors 136, 138 are chosen such that the wanted in-band signals appear as a differential signal across the nodes 126, 134. In contrast, the unwanted, out-of-band signals, appear as common mode signals. The common mode signals are attenuated by a low common mode impedance between the nodes 126, and 134. Conventional approaches rely on tight coupling between the inductors 136, 138. As mobile communication devices move into the higher frequencies of the Fifth Generation-New Radio (5G-NR) cellular standards, the range of frequencies for which rejection is desired has increased. Likewise, the sizing requirements for modern circuitry makes it increasingly difficult to achieve a desired tight coupling. Accordingly, there is room for improvement of such filters.


Exemplary aspects of the present disclosure associate a resonant circuit with the inductors to lower a common mode impedance for the filter at a predetermined notch frequency. The details of the resonant circuit may be varied to meet design criteria in terms of frequencies rejected, cost, space, and the like.


In this regard, FIG. 2A illustrates a generic filter 200 according to an aspect of the present disclosure. The filter 200 includes an input node 202 and an output node 204. The filter 200 further includes an input LC circuit 206 formed from a first inductor 208 and a first capacitor 210. The filter 200 further includes an output LC circuit 212 formed from a second inductor 214 and a second capacitor 216. The input LC circuit 206 and the output LC circuit 212 couple to a ground 218. The filter 200 further includes a first impedance path 220 between the input node 202 and the output node 204. The first impedance path 220 includes a first impedance (ZA) 222 and a second impedance (ZA) 224 serially connected to one another and defining a first node 226 therebetween. As illustrated, the first impedance 222 and the second impedance 224 may be identical.


The filter 200 further includes a second impedance path 228 between the input node 202 and the output node 204. The second impedance path 228 is electrically parallel to the first impedance path 220. The second impedance path 228 includes a third impedance (ZB) 230 and a fourth impedance (ZB) 232 serially connected to one another and defining a second node 234 therebetween.


The filter 200 further includes a common mode rejection circuit 236 that couples the nodes 226 and 234 to ground 218. Additional details of the common mode rejection circuit 236 are provided in FIG. 2B, where a first inductor 238 is coupled to the first node 226 and a second inductor 240 is coupled to the second node 234. The first inductor 238 is serially connected to the second inductor 240 with a third node 242 therebetween. A resonant circuit 244 is associated with the first inductor 238 and the second inductor 240, and particularly coupled to the third node 242. The resonant circuit 244 is configured to lower a common mode impedance for the filter 200 at a predetermined notch frequency.



FIGS. 3-7 provide exemplary aspects of the resonant circuit 244 as well as variations in the impedances 222, 224, 230, 232. In this regard, FIG. 3 illustrates a filter 300 according to an aspect of the present disclosure. The filter 300 includes an input node 302 and an output node 304. The filter 300 further includes an input LC circuit 306 formed from an inductor 308 and a capacitor 310. The filter 300 further includes an output LC circuit 312 formed from an inductor 314 and a capacitor 316. The input LC circuit 306 and the output LC circuit 312 couple to a ground 318. The filter 300 further includes a first impedance path 320 between the input node 302 and the output node 304. The first impedance path 320 includes a first impedance 322 and a second impedance 324 serially connected to one another and defining a first node 326 therebetween. As illustrated, the first impedance 322 and the second impedance 324 may be identical BAW resonators.


The filter 300 further includes a second impedance path 328 between the input node 302 and the output node 304. The second impedance path 328 is electrically parallel to the first impedance path 320. The second impedance path 328 includes a third impedance 330 and a fourth impedance 332 serially connected to one another and defining a second node 334 therebetween. As illustrated, the third impedance 330 and the fourth impedance 332 may be identical BAW resonators.


The filter 200 further includes a common mode rejection circuit 336 that couples the nodes 326 and 334 to ground 318. The common mode rejection circuit 336 may include a first inductor 338 and a second inductor 340 serially coupling the first node 326 to the second node 334 and defining a third node 342 therebetween. A capacitor 344 couples the third node 342 to ground 318. The capacitor 344 may be chosen to determine a notch frequency. The inductors 338, 340 may be coupled to one another.


Another exemplary aspect of the present disclosure is provided in FIG. 4, which illustrates a filter 400, which expands the impedances in the first and second impedance paths. In this regard, the filter 400 includes an input node 402 and an output node 404. The filter 400 further includes an input LC circuit 406 formed from an inductor 408 and a capacitor 410. The filter further includes an output LC circuit 412 formed from an inductor 414 and a capacitor 416. The input LC circuit 406 and the output LC circuit 412 couple to a ground 418. The filter 400 further includes a first impedance path 420 between the input node 402 and the output node 404. The first impedance path 420 includes a first impedance 422 formed from electrically parallel BAW resonators 422A, 422B and a second impedance 424 formed from electrically parallel BAW resonators 424A, 424B. The impedances 422, 424 are serially connected to one another and defining a first node 426 therebetween. Note that in some cases, such as the filter 400, the impedances may be formed from distinct impedance elements and form an impedance network (e.g., BAW resonators 422A, 422B form an impedance network within the impedance 422). Accordingly, the use of “impedance” herein includes such impedance networks.


The filter 400 further includes a second impedance path 428 between the input node 402 and the output node 404. The second impedance path 428 is electrically parallel to the first impedance path 420. The second impedance path 428 includes a third impedance 430 formed from electrically parallel BAW resonators 430A, 430B and a fourth impedance 432 formed from electrically parallel BAW resonators 432A, 432B. The impedances 430, 432 are serially connected to one another and defining a second node 434 therebetween.


The filter 400 further includes a common mode rejection circuit 436 that couples the nodes 426 and 434 to ground 418. The common mode rejection circuit 436 includes a first inductor 438 coupled to the first node 426 and a second inductor 440 coupled to the second node 434. The first inductor 438 is serially connected to the second inductor 440 with a third node 442 therebetween. A resonant circuit 444 is associated with the first inductor 438 and the second inductor 440, and particularly coupled to the third node 442. The resonant circuit 444 is configured to lower a common mode impedance for the filter 400 at a predetermined notch frequency.


Combining the concepts of FIG. 3 and FIG. 4 results in a filter 500 illustrated in FIG. 5. In this regard, the filter 500 includes an input node 502 and an output node 504. The filter 500 further includes an input LC circuit 506 formed from an inductor 508 and a capacitor 510. The filter further includes an output LC circuit 512 formed from an inductor 514 and a capacitor 516. The input LC circuit 506 and the output LC circuit 512 couple to a ground 518. The filter 500 further includes a first impedance path 520 between the input node 502 and the output node 504. The first impedance path 520 includes a first impedance 522 formed from electrically parallel BAW resonators 522A, 522B and a second impedance 524 formed from electrically parallel BAW resonators 524A, 524B. The impedances 522, 524 are serially connected to one another and defining a first node 526 therebetween.


The filter 500 further includes a second impedance path 528 between the input node 502 and the output node 504. The second impedance path 528 is electrically parallel to the first impedance path 520. The second impedance path 528 includes a third impedance 530 formed from electrically parallel BAW resonators 530A, 530B and a fourth impedance 532 formed from electrically parallel BAW resonators 532A, 532B. The impedances 530, 532 are serially connected to one another and defining a second node 534 therebetween.


The filter 500 further includes a common mode rejection circuit 536 that couples the nodes 526 and 534 to ground 518. The common mode rejection circuit 536 includes a first inductor 538 coupled to the first node 526 and a second inductor 540 coupled to the second node 534. The first inductor 538 is serially connected to the second inductor 540 with a third node 542 therebetween. Optionally, the first inductor 538 may be inductively coupled to the second inductor 540. A resonant circuit 544, which may be a capacitor 544C, is associated with the first inductor 538 and the second inductor 540, and particularly coupled to the third node 542. The capacitor 544C may be chosen to lower a common mode impedance for the filter 500 at a predetermined notch frequency.


The notch frequency may be more specifically determined by a higher order common mode rejection circuit and more particularly by changing the resonant circuit to a higher order resonant circuit. In this regard, a filter 600, illustrated in FIG. 6, includes an input node 602 and an output node 604. The filter 600 further includes an input LC circuit 606 formed from an inductor 608 and a capacitor 610. The filter 600 further includes an output LC circuit 612 formed from an inductor 614 and a capacitor 616. The input LC circuit 606 and the output LC circuit 612 couple to a ground 618. The filter 600 further includes a first impedance path 620 between the input node 602 and the output node 604. The first impedance path 620 includes a first impedance 622. The first impedance 622 may be formed from a BAW resonator 622A, and optionally an electrically parallel BAW resonator 622B. The first impedance path 620 further includes a second impedance 624 formed from a BAW resonator 624A and optionally an electrically parallel BAW resonator 624B. The impedances 622, 624 are serially connected to one another and defining a first node 626 therebetween.


The filter 600 further includes a second impedance path 628 between the input node 602 and the output node 604. The second impedance path 628 is electrically parallel to the first impedance path 620. The second impedance path 528 includes a third impedance 630. The third impedance 630 may be formed from a BAW resonator 630A, and optionally an electrically parallel BAW resonator 630B. The second impedance path 628 further includes a fourth impedance 632 formed from a BAW resonator 632A and optionally an electrically parallel BAW resonator 632B. The impedances 630, 632 are serially connected to one another and defining a second node 634 therebetween.


The filter 600 further includes a common mode rejection circuit 636 that couples the nodes 626 and 634 to ground 618. The common mode rejection circuit 636 includes a first inductor 638 coupled to the first node 626 and a second inductor 640 coupled to the second node 634. The first inductor 638 is serially connected to the second inductor 640 with a third node 642 therebetween. Optionally, the first inductor 638 may be inductively coupled to the second inductor 640. A resonant circuit 644, which may be a capacitor 644C1 positioned in parallel to an inductor 644L and capacitor 644C2, is associated with the first inductor 638 and the second inductor 640, and particularly coupled to the third node 642. The capacitors 644C1, 644C2, and inductor 644L may be chosen to lower a common mode impedance for the filter 600 at a predetermined notch frequency.


Alternatively, the common mode rejection circuit may be bifurcated to provide additional rejection notches. In this regard, a filter 700, illustrated in FIG. 7, includes an input node 702 and an output node 704. The filter 700 further includes an input LC circuit 706 formed from an inductor 708 and a capacitor 710. The filter 700 further includes an output LC circuit 712 formed from an inductor 714 and a capacitor 716. The input LC circuit 706 and the output LC circuit 712 couple to a ground 718. The filter 700 further includes a first impedance path 720 between the input node 702 and the output node 704. The first impedance path 720 includes a first impedance 722. The first impedance 722 may be formed from a BAW resonator 722A, and optionally an electrically parallel BAW resonator 722B. The first impedance path 720 further includes a second impedance 724 formed from a BAW resonator 724A and optionally an electrically parallel BAW resonator 724B. The impedances 722, 724 are serially connected to one another and defining a first node 726 therebetween.


The filter 700 further includes a second impedance path 728 between the input node 702 and the output node 704. The second impedance path 728 is electrically parallel to the first impedance path 720. The second impedance path 728 includes a third impedance 730. The third impedance 730 may be formed from a BAW resonator 730A, and optionally an electrically parallel BAW resonator 730B. The second impedance path 728 further includes a fourth impedance 732 formed from a BAW resonator 732A and optionally an electrically parallel BAW resonator 732B. The impedances 730, 732 are serially connected to one another and defining a second node 734 therebetween.


The filter 700 further includes a common mode rejection circuit 736 that couples the nodes 726 and 734 to ground 718. The common mode rejection circuit 736 includes a first inductor 738 coupled to the first node 726 and a second inductor 740 coupled to the second node 734. The first inductor 738 is serially connected to the second inductor 740 with a third node 742 therebetween. Optionally, the first inductor 738 may be inductively coupled to the second inductor 740. As noted, a resonant circuit 744 may be bifurcated into two circuits 744A, 744B. The circuit 744A may be a capacitor 746, which couples the third node 742 to ground 718. The circuit 744B may couple the first node 726 to the second node 734 electrically in parallel to the inductors 738, 740. The circuit 744B may include a second capacitor 748 and a third capacitor 750 serially positioned between the nodes 726, 734 and defining an LC node 752 therebetween. The LC node 752 may be coupled to ground 718 through a third inductor 754 and thus form an LC circuit. The values of the capacitors 746, 748, 750 and the inductor 754 may be chosen to lower a common mode impedance for the filter 700 at a predetermined notch frequency.


At some point, the complexity of increasingly higher order resonant circuits may exceed the return, but it should be appreciated that if there are critical frequencies which must be suppressed or blocked, an appropriate resonant frequency circuit may be crafted and remain in the scope of the present disclosure.


Instead of using the inductors to couple the nodes in the impedance paths, a transformer may be used as illustrated in FIGS. 8 and 9. The primary and secondary windings of the transformer may have center taps. The common mode impedance of the primary and/or secondary windings may be resonated by a resonant circuit such as a capacitor to ground on the center tap. This structure may provide three sources of common mode rejection: the resonance of the primary winding, the resonance of the secondary windings, and the common mode rejection of the transformer structure. It should be appreciated that the resonance of the primary and secondary windings may be placed at different frequencies to give rejections in different bands.


In this regard, FIG. 8 illustrates a filter 800. The filter 800 includes an input node 802 and an output node 804. The filter 800 further includes an input LC circuit 806 formed from an inductor 808 and a capacitor 810. The filter 800 further includes an output LC circuit 812 formed from an inductor 814 and a capacitor 816. The input LC circuit 806 and the output LC circuit 812 couple to a ground 818.


The filter 800 further includes a first impedance path 820 between the input node 802 and the output node 804. The first impedance path 820 includes a first impedance 822. The first impedance 822 may be formed from a BAW resonator 822A, and optionally an electrically parallel BAW resonator 822B. The first impedance path 820 further includes a second impedance 824 formed from a BAW resonator 824A and optionally an electrically parallel BAW resonator 824B.


The filter 800 further includes a second impedance path 828 between the input node 802 and the output node 804. The second impedance path 828 is electrically parallel to the first impedance path 820. The second impedance path 828 includes a third impedance 830. The third impedance 830 may be formed from a BAW resonator 830A, and optionally an electrically parallel BAW resonator 830B. The second impedance path 828 further includes a fourth impedance 832 formed from a BAW resonator 832A and optionally an electrically parallel BAW resonator 832B.


The filter 800 further incudes a transformer 836 having a first coil 838 with a first center tap 840 and a second coil 842 having a second center tap 844. The existence of the taps 840 and 844 allow the coils 838 and 842 to be thought of as two separate inductors coupled to one another. The first impedance 822 couples the input node 802 to the first coil 838. The second impedance 824 couples the second coil 842 to the output node 804. The third impedance 830 couples the input node 802 to the first coil 838. The fourth impedance 832 couples the second coil 842 to the output node 804. The transformer 836 couples the first impedance 822 to the second impedance 824. The transformer 836 also couples the third impedance 830 to the fourth impedance 832.


A capacitor 846 may couple the first center tap 840 to ground 818. A capacitor 848 may couple the second center tap 844 to ground 818. As discussed above, there may be couplings between the windings on either side of the center taps 840, 844 as well as between the coils 838, 842. Collectively, these resonances provide desired notch frequencies.



FIG. 9 is similar but adds resonant circuits 900, 902 to form filter 800′. The resonant circuit 900 is electrically parallel to the first coil 838. The resonant circuit 902 is electrically parallel to the second coil 842. The resonant circuits 900, 902 may be formed by serial capacitors and an inductor to ground similar to the arrangement discussed in the filter 700 of FIG. 7 and thus may be considered LC circuits.


The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims
  • 1. A filter comprising: a first impedance path between an input node and an output node, the first impedance path comprising a first impedance and a second impedance serially connected to one another and defining a first node therebetween;a second impedance path between the input node and the output node, the second impedance path electrically parallel to the first impedance path, the second impedance path comprising a third impedance and a fourth impedance serially connected to one another and defining a second node therebetween, the first impedance path and the second impedance path comprising a reversed semilattice filter;a first inductor coupled the first node;a second inductor serially coupling the first inductor to the second node; anda resonant circuit associated with the first inductor and the second inductor, the resonant circuit configured to lower a common mode impedance for the filter at a predetermined notch frequency.
  • 2. The filter of claim 1, wherein the first inductor is inductively coupled to the second inductor.
  • 3. The filter of claim 1, wherein the resonant circuit comprises a capacitor coupled from a third node between the first inductor and the second inductor to ground.
  • 4. The filter of claim 3, wherein the first impedance comprises a resonator.
  • 5. The filter of claim 4, wherein the resonator comprises a bulk acoustic wave (BAW) resonator.
  • 6. The filter of claim 3, wherein the first impedance comprises a first resonator and a second resonator electrically parallel to the first resonator.
  • 7. The filter of claim 3, wherein the resonant circuit further comprises an LC circuit between the first node and the second node, the LC circuit electrically parallel to the first inductor and the second inductor.
  • 8. The filter of claim 7, wherein the LC circuit comprises: a second capacitor;a third capacitor serially coupled to the second capacitor between the first node and the second node with an LC node therebetween; anda third inductor coupling the LC node to ground.
  • 9. The filter of claim 1, wherein the resonant circuit comprises: a third inductor coupled to a third node between the first inductor and the second inductor;a first capacitor serially coupled to the third inductor and ground; anda second capacitor electrically in parallel to the third inductor and the first capacitor.
  • 10. A filter comprising: a transformer comprising a first coil having a first center tap and a second coil having a second center tap;a first impedance path comprising: a first impedance coupling an input node to the first coil; anda second impedance coupling the second coil to an output node;a second impedance path comprising: a third impedance coupling the input node to the first coil, the third impedance electrically parallel to the first impedance; anda fourth impedance coupling the second coil to the output node, the fourth impedance electrically parallel to the second impedance, wherein collectively, the first impedance path, the second impedance path, and the transformer comprise a reversed semilattice filter;the transformer coupling the first impedance to the second impedance;the transformer coupling the third impedance to the fourth impedance; anda resonant circuit associated with the first center tap, the resonant circuit configured to lower a common mode impedance for the filter at a predetermined notch frequency.
  • 11. The filter of claim 10, further comprising a second resonant circuit associated with the second center tap, the second resonant circuit configured to lower the common mode impedance for the filter at a second predetermined notch frequency.
  • 12. The filter of claim 10, wherein the resonant circuit comprises a capacitor coupling the first center tap to ground.
  • 13. The filter of claim 12, further comprising an LC circuit electrically parallel to the first coil.
  • 14. The filter of claim 13, wherein the LC circuit comprises: a first capacitor;a second capacitor serially positioned relative to the first capacitor with a node therebetween; andan inductor coupling the node to ground.
  • 15. The filter of claim 14, further comprising a second LC circuit electrically parallel to the second coil.
  • 16. The filter of claim 10, wherein the first coil comprises a first inductor and a second inductor, wherein the first inductor is inductively coupled to the second inductor.
  • 17. The filter of claim 10, wherein the first impedance comprises a resonator.
  • 18. The filter of claim 17, wherein the resonator is a bulk acoustic wave (BAW) resonator.
  • 19. A filter comprising: a first impedance path between an input node and an output node, the first impedance path comprising a first impedance and a second impedance serially connected to one another and defining a first node therebetween;a second impedance path between the input node and the output node, the second impedance path electrically parallel to the first impedance path, the second impedance path comprising a third impedance and a fourth impedance serially connected to one another and defining a second node therebetween, the first impedance path and the second impedance path comprising a reversed semilattice filter;a first inductor coupled the first node;a second inductor serially coupling the first inductor to the second node and defining a third node between the first inductor and the second inductor; anda capacitor coupling the third node to ground to lower a common mode impedance for the filter at a predetermined notch frequency.
US Referenced Citations (131)
Number Name Date Kind
3731230 Cerny, Jr. May 1973 A
3875533 Irwin et al. Apr 1975 A
4442434 Baekgaard Apr 1984 A
4577168 Hartmann Mar 1986 A
5291159 Vale Mar 1994 A
5821833 Lakin Oct 1998 A
6067391 Land May 2000 A
6670866 Ellaet et al. Dec 2003 B2
6714099 Hikita et al. Mar 2004 B2
6720844 Lakin Apr 2004 B1
6927649 Metzger et al. Aug 2005 B2
6927651 Larson et al. Aug 2005 B2
6975183 Aigner et al. Dec 2005 B2
7057478 Korden et al. Jun 2006 B2
7173504 Larson, III et al. Feb 2007 B2
7239067 Komuro et al. Jul 2007 B2
7321183 Ebuchi et al. Jan 2008 B2
7342351 Kubo et al. Mar 2008 B2
7367095 Larson, III et al. May 2008 B2
7391285 Larson, III et al. Jun 2008 B2
7436269 Wang et al. Oct 2008 B2
7515018 Handtmann et al. Apr 2009 B2
7804374 Brown et al. Sep 2010 B1
7825749 Thalhammer et al. Nov 2010 B2
7855618 Frank et al. Dec 2010 B2
7889024 Bradley et al. Feb 2011 B2
7898493 Rojas et al. Mar 2011 B1
7956705 Meister et al. Jun 2011 B2
7973620 Shirakawa et al. Jul 2011 B2
8130058 Cardona et al. Mar 2012 B2
8248185 Choy et al. Aug 2012 B2
8508315 Jamneala et al. Aug 2013 B2
8575820 Shirakawa et al. Nov 2013 B2
8576024 Erb et al. Nov 2013 B2
8923794 Aigner Dec 2014 B2
8981627 Sakuma et al. Mar 2015 B2
8991022 Satoh et al. Mar 2015 B2
9054671 Adkisson et al. Jun 2015 B2
9054674 Noue et al. Jun 2015 B2
9197189 Miyake Nov 2015 B2
9243316 Larson, III et al. Jan 2016 B2
9484883 Nishizawa et al. Nov 2016 B2
9698756 Khlat et al. Jul 2017 B2
9837984 Khlat et al. Dec 2017 B2
9847769 Khlat et al. Dec 2017 B2
9887686 Kuwahara Feb 2018 B2
9906206 Shih et al. Feb 2018 B2
9929716 Lee et al. Mar 2018 B2
10009001 Jiang et al. Jun 2018 B2
10141644 Khlat et al. Nov 2018 B2
11444642 Wang Sep 2022 B2
20020109564 Tsai et al. Aug 2002 A1
20040100342 Nishihara et al. May 2004 A1
20040140869 Marksteiner et al. Jul 2004 A1
20040227590 Larson, III et al. Nov 2004 A1
20040263286 Unterberger Dec 2004 A1
20050057117 Nakatsuka et al. Mar 2005 A1
20050093648 Inoue May 2005 A1
20050206476 Ella et al. Sep 2005 A1
20060091978 Wang et al. May 2006 A1
20060232361 Wang et al. Oct 2006 A1
20080007369 Barber et al. Jan 2008 A1
20080169884 Matsumoto et al. Jul 2008 A1
20080272853 Heinze et al. Nov 2008 A1
20080297278 Handtmann et al. Dec 2008 A1
20090096549 Thalhammer et al. Apr 2009 A1
20090096550 Handtmann et al. Apr 2009 A1
20100277237 Sinha et al. Nov 2010 A1
20110115334 Konishi et al. May 2011 A1
20110121689 Grannen et al. May 2011 A1
20110180391 Larson, III et al. Jul 2011 A1
20110204995 Jamneala et al. Aug 2011 A1
20110210787 Lee et al. Sep 2011 A1
20120007696 Pang et al. Jan 2012 A1
20120187799 Nakahashi Jul 2012 A1
20120313725 Ueda et al. Dec 2012 A1
20130033150 Bardong et al. Feb 2013 A1
20130106248 Burak et al. May 2013 A1
20130113576 Inoue et al. May 2013 A1
20130193808 Feng et al. Aug 2013 A1
20140085020 Reinhardt et al. Mar 2014 A1
20140125203 Choy et al. May 2014 A1
20140132117 Larson, III May 2014 A1
20140145557 Tanaka May 2014 A1
20140167565 Iwamoto Jun 2014 A1
20150054387 Li Feb 2015 A1
20150222246 Nosaka Aug 2015 A1
20150280100 Burak et al. Oct 2015 A1
20150369153 Tsunooka et al. Dec 2015 A1
20160028364 Takeuchi Jan 2016 A1
20160056789 Otsubo et al. Feb 2016 A1
20160191012 Khlat et al. Jun 2016 A1
20160191014 Khlat et al. Jun 2016 A1
20160191016 Khlat et al. Jun 2016 A1
20160261235 Ortiz Sep 2016 A1
20160268998 Xu et al. Sep 2016 A1
20160308576 Khlat et al. Oct 2016 A1
20160359468 Taniguchi et al. Dec 2016 A1
20170093369 Khlat et al. Mar 2017 A1
20170093370 Khlat et al. Mar 2017 A1
20170141757 Schmidhammer May 2017 A1
20170201233 Khlat Jul 2017 A1
20170301992 Khlat et al. Oct 2017 A1
20170310302 Bauder et al. Oct 2017 A1
20170324159 Khlat Nov 2017 A1
20170338795 Nakagawa et al. Nov 2017 A1
20180013402 Kirkpatrick et al. Jan 2018 A1
20180041191 Park Feb 2018 A1
20180076793 Khlat et al. Mar 2018 A1
20180076794 Khlat et al. Mar 2018 A1
20180109236 Konoma Apr 2018 A1
20180109237 Wasilik et al. Apr 2018 A1
20180145658 Saji May 2018 A1
20180219530 Khlat et al. Aug 2018 A1
20180241418 Takamine et al. Aug 2018 A1
20180358947 Mateu et al. Dec 2018 A1
20190103851 Yusuf Apr 2019 A1
20190140618 Takamine May 2019 A1
20190181824 Timme et al. Jun 2019 A1
20190181835 Timme et al. Jun 2019 A1
20190199320 Morita et al. Jun 2019 A1
20190207583 Miura et al. Jul 2019 A1
20190222197 Saji Sep 2019 A1
20190288664 Saji Sep 2019 A1
20190305752 Sadhu et al. Oct 2019 A1
20210028755 Yusuf Jan 2021 A1
20210194459 Alavi et al. Jun 2021 A1
20210211116 Khlat Jul 2021 A1
20210218385 Yusuf et al. Jul 2021 A1
20210218386 Yusuf et al. Jul 2021 A1
20220069800 Han et al. Mar 2022 A1
Foreign Referenced Citations (15)
Number Date Country
101154934 Apr 2008 CN
104883153 Sep 2015 CN
205666806 Oct 2016 CN
111917392 Nov 2020 CN
102015107569 Nov 2015 DE
3018969 Sep 2015 FR
2002251190 Sep 2002 JP
2008085989 Apr 2008 JP
2011176744 Sep 2011 JP
2012257050 Dec 2012 JP
2017045749 Mar 2017 JP
2017103654 Jun 2017 JP
2018093388 Jun 2018 JP
2009132011 Oct 2009 WO
WO-2014061351 Apr 2014 WO
Non-Patent Literature Citations (83)
Entry
Office Action for Japanese Patent Application No. 2018181230, mailed Sep. 14, 2022, 9 pages.
Non-Final Office Action for U.S. Appl. No. 17/088,872, mailed Aug. 29, 2022, 8 pages.
Notice of Allowance for U.S. Appl. No. 17/152,110, mailed Sep. 21, 2022, 7 pages.
Non-Final Office Action for U.S. Appl. No. 14/757,587, mailed Sep. 13, 2016, 12 pages.
Notice of Allowance for U.S. Appl. No. 14/757,587, mailed Mar. 9, 2017, 8 pages.
Non-Final Office Action for U.S. Appl. No. 15/004,084, mailed Jun. 12, 2017, 9 pages.
Non-Final Office Action for U.S. Appl. No. 14/757,651, mailed Jun. 9, 2017, 11 pages.
Non-Final Office Action for U.S. Appl. No. 15/275,957, mailed Jun. 14, 2017, 9 pages.
Ex Parte Quayle Action for U.S. Appl. No. 15/347,452, mailed Jun. 15, 2017, 7 pages.
Final Office Action for U.S. Appl. No. 15/275,957, mailed Jan. 2, 2018, 7 pages.
Author Unknown, “Saw Filters—SAW Resonators: Surface Acoustic Wave SAW Components,” Product Specification, 2010, Token Electronics Industry Co., Ltd., 37 pages.
Fattinger, Gernot et al., “Miniaturization of BAW Devices and the Impact of Wafer Level Packaging Technology,” Joint UFFC, EFTF and PFM Symposium, Jul. 21-25, 2013, Prague, Czech Republic, IEEE, pp. 228-231.
Kwa, Tom, “Wafer-Level Packaged Accelerometer With Solderable SMT Terminals,” IEEE Sensors, Oct. 22-25, 2006, Daegu, South Korea, IEEE, pp. 1361-1364.
Lakin, K. M., “Coupled Resonator Filters,” 2002 IEEE Ultrasonics Symposium, Oct. 8-11, 2002, Munich, Germany, 8 pages.
López, Edén Corrales, “Analysis and Design of Bulk Acoustic Wave Filters Based on Acoustically Coupled Resonators,” PhD Thesis, Department of Telecommunications and Systems Engineering, Autonomous University of Barcelona, May 2011, 202 pages.
Potter, Bob R. et al., “Embedded Inductors Incorporated in the Design of SAW Module SMT Packaging,” Proceedings of the 2002 Ultrasonics Symposium, Oct. 8-11, 2002, IEEE, pp. 397-400.
Schneider, Robert, “High-Q AIN Contour Mode Resonators with Unattached, Voltage-Actuated Electrodes,” Thesis, Technical Report No. UCB/EECS-2015-247, Dec. 17, 2015, Electrical Engineering and Computer Sciences, University of California at Berkeley, http://www.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-247.html, Robert Anthony Schneider, 222 pages.
Shirakawa, A. A., et al., “Bulk Acoustic Wave-Coupled Resonator Filters: Concept, Design, and Application,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 21, No. 5, Sep. 2011, 9 pages.
Corrales, Eden, et al., “Design of Three-Pole Bulk Acoustic Wave Coupled Resonator Filters,” 38th European Microwave Conference, Oct. 2008, Amsterdam, Netherlands, EuMA, pp. 357-360.
De Paco, Pedro, et al., “Equivalent Circuit Modeling of Coupled Resonator Filters,” Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 55, Issue 9, Sep. 2008, IEEE, pp. 2030-2037.
Lakin, K. M., “Bulk Acoustic Wave Coupled Resonator Filters,” International Frequency Control Symposium, 2002, EEE, pp. 8-14.
Shirakawa, A. A., et al., “Bulk Acoustic Wave Coupled Resonator Filters Synthesis Methodology,” European Microwave Conference, Oct. 4-6, 2005, Paris, France, IEEE, 4 pages.
Tosic, Dejan, et al., “Symbolic analysis of immitance inverters,” 14th Telecommunications Forum, Nov. 21-23, 2006, Belgrade, Serbia, pp. 584-487.
Non-Final Office Action for U.S. Appl. No. 14/757,651, mailed May 8, 2018, 8 pages.
Notice of Allowance for U.S. Appl. No. 15/347,428, mailed Jul. 12, 2018, 9 pages.
Notice of Allowance for U.S. Appl. No. 15/490,381, mailed May 23, 2018, 8 pages.
Final Office Action for U.S. Appl. No. 14/757,651, mailed Sep. 19, 2018, 7 pages.
Non-Final Office Action for U.S. Appl. No. 15/701,759, mailed Oct. 4, 2018, 10 pages.
Notice of Allowance for U.S. Appl. No. 15/727,117, mailed Mar. 13, 2019, 9 pages.
Non-Final Office Action for U.S. Appl. No. 15/586,374, mailed Feb. 26, 2019, 16 pages.
Notice of Allowance for U.S. Appl. No. 15/720,706, mailed Mar. 15, 2019, 9 pages.
Non-Final Office Action for U.S. Appl. No. 15/697,658, mailed May 1, 2019, 13 pages.
Larson, John, et al., “Characterization of Reversed c-axis AIN Thin Films,” International Ultrasonics Symposium Proceedings, 2010, IEEE, pp. 1054-1059.
Notice of Allowance for U.S. Appl. No. 15/586,374, mailed Oct. 4, 2019, 7 pages.
Notice of Allowance for U.S. Appl. No. 15/644,922, mailed Oct. 21, 2019, 10 pages.
Final Office Action for U.S. Appl. No. 15/697,658, mailed Oct. 22, 2019, 9 pages.
Non-Final Office Action for U.S. Appl. No. 15/883,933, mailed Oct. 25, 2019, 19 pages.
Non-Final Office Action for U.S. Appl. No. 16/003,417, mailed Apr. 3, 2020, 9 pages.
Capilla, Jose et al., “High-Acoustic-Impedence Tantalum Oxide Layers for Insulating Acoustic Reflectors,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 59, No. 3, Mar. 2012, IEEE, pp. 366-372.
Fattinger, Gernot et al., “Single-to-balanced Filters for Mobile Phones using Coupled Resonator BAW Technology,” 2004 IEEE International Ultrasonics, Ferroelectrics, and Frequency Control Joint 50th Anniversary Conference, Aug. 23-27, 2004, IEEE, pp. 416-419.
Lakin, K. M. et al., “High Performance Stacked Crystal Filters for GPS and Wide Bandwidth Applications,” 2001 IEEE Ultrasonics Symposium, Oct. 7-10, 2001, IEEE, pp. 833-838.
Roy, Ambarish et al., “Spurious Modes Suppression in Stacked Crystal Filter,” 2010 IEEE Long Island Systems, Applications and Technology Conference, May 7, 2010, 6 pages.
Non-Final Office Action for U.S. Appl. No. 16/290,175, mailed Apr. 14, 2020, 29 pages.
Ibrahim, A. et al., “Compact Size Microstrip Coupled Resonator Band Pass Filter Loaded with Lumped Capacitors,” 2013 Second International Japan-Egypt Conference on Electronics, Communications and Computers (JEC-ECC), Dec. 17-19, 2013, Egypt, IEEE, 4 pages.
Tsai, H. et al., “Tunable Filter by FBAR Using Coupling Capacitors,” Proceedings of the 2018 Asia-Pacific Microwave Conference (APMC), Nov. 6-9, 2018, Kyoto, Japan, IEICE, pp. 609-611.
Zhu, L et al., “Adjustable Bandwidth Filter Design Based on Interdigital Capacitors,” IEEE Microwave and Wireless Components Letters, vol. 18, No. 1, Jan. 2008, IEEE, pp. 16-18.
Non-Final Office Action for U.S. Appl. No. 16/283,044, mailed Nov. 12, 2020, 9 pages.
Notice of Allowance for U.S. Appl. No. 15/697,658, mailed Nov. 17, 2020, 7 pages.
Final Office Action for U.S. Appl. No. 15/883,933, mailed Oct. 23, 2020, 15 pages.
Advisory Action for U.S. Appl. No. 15/883,933, mailed Dec. 31, 2020, 3 pages.
Notice of Allowance and Examiner-Initiated Interview Summary for U.S. Appl. No. 16/003,417, mailed Aug. 5, 2020, 9 pages.
Final Office Action for U.S. Appl. No. 16/290,175, mailed Sep. 17, 2020, 13 pages.
Non-Final Office Action for U.S. Appl. No. 16/290,175, mailed Jan. 6, 2021, 14 pages.
Aigner, R. et al., “3G—4G—5G: How BAW Filter Technology Enables a Connected World,” 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (Transducers & Eurosensors XXXIII), Jun. 23-27, 2019, Berlin, Germany, IEEE, pp. 523-526.
Kreuzer, S. et al., “Full band 41 filter with high Wi-Fi rejection—design and manufacturing challenges,” IEEE International Ultrasonics Symposium (IUS), Oct. 21-24, 2015, Taipei, Taiwan, IEEE, 4 pages.
Volatier, A. et al., “Technology enhancements for high performance BAW duplexer,” IEEE International Ultrasonics Symposium (IUS), Jul. 21-25, 2013, Prague, Czech Republic, IEEE, pp. 761-764.
Non-Final Office Action for U.S. Appl. No. 16/740,667, mailed Mar. 4, 2021, 10 pages.
Non-Final Office Action for U.S. Appl. No. 16/776,738, mailed Mar. 4, 2021, 7 pages.
Non-Final Office Action for U.S. Appl. No. 16/806,166, mailed Mar. 18, 2021, 6 pages.
Larson, John, et al., “Characterization of Reversed c-axis AIN Thin Films,” IEEE International Ultrasonics Symposium, San Diego, California, 2010, pp. 1054-1059.
Non-Final Office Action for U.S. Appl. No. 16/358,823, mailed Apr. 5, 2021, 12 pages.
Non-Final Office Action for U.S. Appl. No. 15/883,933, mailed Mar. 29, 2021, 11 pages.
Zverev, A., “Figure 8.25,” Hanbook of Filter Synthesis, 1967, John Wiley & Sons, 4 pages.
Zverev, A., “The Synthesis of Intermediate Bandpass Filters,” Hanbook of Filter Synthesis, 1967, John Wiley & Sons, pp. 483-488.
Notice of Allowance for U.S. Appl. No. 16/290,175, mailed Jun. 14, 2021, 7 pages.
Corrected Notice of Allowability for U.S. Appl. No. 16/290,175, mailed Jun. 23, 2021, 4 pages.
Notice of Allowance for U.S. Appl. No. 16/740,667, mailed Jun. 11, 2021, 7 pages.
Notice of Allowance for U.S. Appl. No. 16/776,738, mailed Jun. 11, 2021, 7 pages.
Notice of Allowance for U.S. Appl. No. 16/806,166, mailed Jun. 18, 2021, 7 pages.
Moreira, M. et al., “Aluminum scandium nitride thin-film bulk acoustic resonators for wide band applications,” Vacuum, vol. 86, Issue 1, Jul. 2011, Elsevier Ltd., 4 pages.
Notice of Allowance and Examiner-Initiated Interview Summary for U.S. Appl. No. 16/722,125, mailed Jun. 24, 2022, 10 pages.
Non-Final Office Action for U.S. Appl. No. 17/152,110, mailed May 27, 2022, 6 pages.
Extended European Search Report for European Patent Application No. 22150239.6, mailed Jun. 9, 2022, 10 pages.
Decision to Grant for Japanese Patent Application No. 2018181230, mailed Apr. 13, 2023, 5 pages.
Reason for Rejection for Japanese Patent Application No. 2019058733, mailed Mar. 2, 2023, 14 pages.
Notice of Preliminary Rejection for Korean Patent Application No. 1020180116185, mailed Dec. 23, 2023, 10 pages.
Notice of Allowance for U.S. Appl. No. 17/088,872, mailed Dec. 14, 2022, 7 pages.
Notice of Preliminary Rejection for Korean Patent Application No. 1020190035987, mailed Mar. 26, 2024, 9 pages.
Akoustis, “The Latest In WiFi 7 Filter Technology: A10655 And A10665,” Akoustis Blog, Sep. 29, 2022, available online: [URL: https://akoustis.com/the-latest-in-wifi-7-filter-technology-a10655-and-a10665/? utm_source=everythingRF], 5 pages.
Hetting, C., “Akoustis: 'XBAW™M' filters critical for full utilization of 5 GHz & 6 GHz Wi-Fi bands,” Wi-Fi Now Golbal, May 6, 2022, available online: [URL: https://wifinowglobal.com/news-and-blog/akoustis-xbaw-filters-critical-for-full-utilization-of-5-ghz-6-ghz-wi-fi-bands/?mc_cid=af353ad165&mc_eid=2c2%E2%80%A6], 4 pages.
Iborra, E. et al., “Piezoelectric and Electroacoustic Properties of V-Doped and Ta-Doped AIN Thin Films,” 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC), Jul. 21-25, 2013, Prague, Czech Republic, IEEE, pp. 262-265.
Decision on Registration for Korean Patent Application No. 1020180116185, mailed Jul. 12, 2024, 2 pages.
First Office Action for Chinese Patent Application No. 201910229019.6, mailed Aug. 1, 2024, 13 pages.
Related Publications (1)
Number Date Country
20230246633 A1 Aug 2023 US