Patent Application
20070176843
This non-provisional application claims priority to provisional application Serial No. TBD, entitled “Embedded Radio with Antenna” filed TBD and incorporated herein by reference.
This invention relates generally to electronic devices requiring radio frequency (“RF”) communication capabilities, such as notebook or laptop computers, cell phones, personal digital assistants (“PDAs”), etc. More particularly, to a wireless RF system with one or more embedded antennas integrated between a front and a back surface or panel of the electronic device.
RF communication systems for portable electronic devices, such as laptop computers, cell phones, etc., have often prioritized device integration and packaging over RF performance and component costs. For example, in many notebook or laptop computers, the radio component of an RF communication system is located in the base of the computer, while the antenna is positioned in the computer cover in close proximity to the display panel. This configuration requires an RF cable or coax cable to interconnect the antenna with the radio module. The RF cable must, quite obviously, be routed between the base and cover section. As a result, significant RF losses may occur during the receipt and transmission of RF signals through the coax cable.
A further disadvantage noted with existing systems is the inability to integrate multiple antennas, operating over multiple frequency bands, into a single, compact communication device. Dual band, tri-band, and multi-band systems currently require multiple antennas remotely positioned with respect to the radio module.
In addition to performance degradation, the manufacturing and integration processes of many existing systems are not optimized to minimize complexity and costs. Specifically, component costs are increased by virtue of having separate and distinct manufacturing processes for the antennas, radio module, interconnects, etc. In addition to higher than necessary labor and material costs, this approach to manufacturing increases the cost and time required for integration of the RF system into the electronic device.
Hence there is a need for a wireless RF communication system to overcome one or more of the limitations disclosed above.
The embedded antenna system herein disclosed advances the art and overcomes problems articulated above by providing a RF communication system having an antenna and radio module integrated into a single printed circuit board (“PCB”).
In particular, and by way of example only, according to an embodiment, provided is an RF communication system including: a printed circuit board; a radio module incorporated into the printed circuit board; and at least one antenna embedded into the PCB and interconnected with the radio module; wherein the PCB, radio module and antenna are positioned between a front and a back surface of an electronic device.
In another embodiment, provided is an improved wireless RF communication system of the type in which a radio is embedded between a front and a back surface of an electronic device, the improvement including: a PCB; a radio module incorporated into the PCB; at least one antenna embedded into the PCB and interconnected to the radio module; and a microstrip transmission line integrated into the PCB to interconnect the antenna and the radio module.
In yet another embodiment, provided is a method of manufacturing an RF communication system for an electronic device, including: incorporating a radio module into a PCB; embedding at least one antenna into the PCB; interconnecting the antenna with the radio module; positioning the PCB, radio module, and antenna between a front and a back surface of the electronic device.
In still another embodiment, provided is a wireless RF communication device, comprising: a transmit/receive means for receiving and transmitting RF signals; an RF processing means, interconnected to the transmit/receive means, for processing the RF signals; and an interconnecting means for interconnecting the transmit/receive means and processing means, wherein the transmit/receive means and processing means are integrated into a single PCB positioned between a front and a back surface of an electronic device.
Before proceeding with the detailed description, it should be noted that the present teaching is by way of example, not by limitation. The concepts herein are not limited to use or application with one specific type of wireless RF communication system or RF system with embedded antenna. Thus, although the instrumentalities described herein are for the convenience of explanation, shown and described with respect to exemplary embodiments, the principles herein may be equally applied in other types of wireless RF systems with embedded antenna.
Disclosed is a wireless radio frequency (“RF”) system or communication system having one or more embedded antennas, and a method of manufacturing the same. As illustrated in
Still referring to
Cross-referencing for a moment
A radio module 202, of a type well known within the art, is positioned on and/or embedded within PCB 200. In particular, radio module 202 may include components and circuitry surface mounted onto PCB 200 or etched into the circuit board, or combinations thereof. Radio module 202 may be any of a type intended to process RF signals received and/or transmitted by an electronic device having communications capabilities.
In addition to PCB 200 and radio module 202, wireless RF system 100 includes one or more antennas integrated into the system 100, of which antennas 204 and 206 are exemplary. Wireless RF system 100 may include a plurality of antennas, and may include one or more antennas having multiple antenna elements. Antennas 204 and 206 may be mounted to an external surface 208 of PCB 200, or alternatively the antennas 204, 206 may be etched into PCB 200. The antennas 204, 206 may be etched directly onto or into PCB 200 using etch common to radio module 202. In at least one embodiment, antennas 204 and 206 are deposited onto the surface 208 of PCB 200, using vapor or other metal deposition techniques. In yet another embodiment, sputtering is used. In each instance, however, antennas 204 and 206 are integrated with, and integral to, the PCB 200.
Interconnecting radio module 202 to antennas 204 and 206 are microstrip transmission lines 210 and 212 respectively. Microstrip transmission lines 210 and 212 may be etched into PCB 200 and may be manufactured using materials and techniques well known in the art for the manufacture of trace lines or electronic interconnects for PCBs. Received RF signals are transmitted from antennas 204 and 206, along transmission lines 210 and 212, to radio module 202. Similarly, outgoing RF signals are transmitted along lines 210 and 212, from radio module 202 to the antennas 204, 206 prior to transmission.
Antennas 204 and 206 may be tuned for their environment, which is to say tuned to the specific electronic device or specific model of electronic device in which the antennas 204, 206 are positioned (e.g. computer, cell phone, PDA). Further, antennas 204 and 206 may be tuned to match the microstrip transmission line (i.e. lines 210 and 212 respectively) interconnecting each antenna to the RF section (not shown) of radio module 202.
Considering now
As discussed in detail above, wireless RF system 302 includes: a PCB 310, a radio module 312 integrated into the PCB 310 by etching or other well known techniques, a microstrip transmission line 314 (which may also be etched) interconnecting radio module 312 and an antenna 316. The circuitry and components (e.g. a processor) for interfacing wireless RF system 302 with the remaining elements of PDA 300 have been omitted for simplicity and clarity of understanding.
Also shown in
With the inclusion of aperture 318 in wireless RF system 302, antenna 316 is not covered, blocked, partially obscured or otherwise electrically degraded by the material of front surface 304. It can be appreciated that the exposure of antenna 316 helps to ensure maximum efficiency in the receipt and transmission of RF signals when all or part of the front surface 304 is metallic. Even though the use of a plastic or other non-conductive material for front surface 304, to include those areas behind which is positioned antenna 316, may not significantly degrade the performance of antenna 316, aperture 318 may still be included to help ensure the desired RF characteristics are achieved.
In one embodiment, aperture 318 is covered with a plastic pane or “window” (not shown) which is electrically transparent. The pane or window may extend partially into the aperture 318, or may substantially fill the aperture completely. Regardless, the pane is structured and arranged such that the plastic material does not come into direct physical contact with antenna 316.
In
Referring now to
In at least one embodiment, as shown in
In
The sequence of events with regard to the integration of RF components, antennas/antenna elements, etc. may vary depending on the particular details of the wireless RF system and corresponding electronic device. Nonetheless, the RF and electrical components of the radio module are, at the necessary point in time, incorporated with the PCB (block 604) using etching, surface mounting, or other well known techniques. Likewise, the antenna pattern is defined and the antenna(s) are embedded into the PCB (block 606) using any number of techniques which may include etching, vapor deposition, etc. Also, the radio module and antenna are interconnected using a microstrip transmission line, block 608. As with the radio module and antenna, the transmission line or lines may be etched or otherwise integrated with the PCB.
Blocks 600 through 608 of
Significant benefits can be recognized through the use of the manufacturing process described above, and the corresponding wireless RF communication system. Component and system costs are reduced as process steps are combined and optimized, and components such as interconnects and cables are eliminated. The elimination of RF cables also serves to improve RF performance by reducing or minimizing system losses.
Changes may be made in the above methods, devices and structures without departing from the scope hereof. It should thus be noted that the matter contained in the above description and/or shown in the accompanying drawings should be interpreted as illustrative and not in a limiting sense. The following claims are intended to cover all generic and specific features described herein, as well as all statements of the scope of the present method, device and structure.
