This application claims the priority under 35 U.S.C. § 119 of European Patent application no. 21213985.1, filed on 13 Dec. 2021, the contents of which are incorporated by reference herein.
The present specification relates to a Radio Frequency (RF) component and a method of making an RF component.
In many RF components, it is necessary to provide electromagnetic shielding between two elements, such as transmission lines or antennae, so as to mitigate against electromagnetic interference between the two components.
Aspects of the present disclosure are set out in the accompanying independent and dependent claims. Combinations of features from the dependent claims may be combined with features of the independent claims as appropriate and not merely as explicitly set out in the claims.
According to an aspect of the present disclosure, there is provided a Radio Frequency, “RF”, component comprising:
According to another aspect of the present disclosure, there is provided a method of making a Radio Frequency, “RF”, component, the method comprising forming:
The provision of a barrier comprising rows of electrically conductive shielding members comprising polyhedra can provide greater design flexibility in customising the shape and configuration of the barrier for electromagnetically shielding the first and second electrically conductive signal members from each other. The use of polyhedra can also improve the electromagnetic isolation provided between the first and second electrically conductive signal members, particularly in combination with the offset provided between the first and second rows of electrically conductive shielding members.
Each electrically conductive shielding member in each row may be elongate. This can further improve the isolation provided between the first and second electrically conductive signal members. For instance, the long dimension of each electrically conductive shielding member may be made greater than the gaps located between each electrically conductive shielding member in each row.
A longitudinal axis of each polyhedron in each row may be substantially parallel to the longitudinal axis of that row. This can maximise the laterally facing profile of each electrically conductive shielding member in each row, again improving the isolation provided between the first and second electrically conductive signal members.
The longitudinal axis of the first row may be substantially parallel to the longitudinal axis of the second row.
Each electrically conductive shielding member in each row may be the same shape and size. This can make the shielding provided by the barrier more uniform along the length of the rows.
The electrically conductive shielding members of the first row may be offset with respect to the electrically conductive shielding members of the second row such that a gap located between each electrically conductive shielding member of the first row is located opposite a middle of an electrically conductive shielding member of the second row. This can improve the isolation provided between the first and second electrically conductive signal members by increasing the path length for electromagnetic fields attempting to pass through the barrier.
Each electrically conductive shielding member in each row may be a rectangular cuboid. This can simplify the manufacturing process.
The electrically conductive shielding members of the rows of the barrier may collectively form a labyrinthine structure. This can improve the isolation provided between the first and second electrically conductive signal members by increasing the path length for electromagnetic fields attempting to pass through the barrier and by requiring the fields to navigate multiple (e.g. at least three, four, five or even more) turns within the barrier.
Each electrically conductive shielding member of the first row may comprise:
Each electrically conductive shielding member of the second row may comprise:
A distal end of each arm of each electrically conductive shielding member of the first row may be located within a region located between the arms of an electrically conductive shielding member of the second row. This can force electromagnetic fields attempting to pass through the barrier to navigate additional turns within the barrier.
A distal end of each arm of each electrically conductive shielding member of the second row may be located within a region located between the arms of an electrically conductive shielding member of the first row. This can force electromagnetic fields attempting to pass through the barrier to navigate additional turns within the barrier.
The barrier may comprise at least one further row of electrically conductive shielding members spaced apart along a longitudinal axis of that further row. Each electrically conductive shielding member in the or each further row may comprise a polyhedron.
The first electrically conductive signal member may comprise a transmission line.
The second electrically conductive signal member may comprise a transmission line.
The first electrically conductive signal member may comprise an antenna.
The second electrically conductive signal member may comprise an antenna.
According to a further aspect of the present disclosure, there is provided a semiconductor device comprising a package containing an RF component of the kind set out above.
For the purposes of the present disclosure, “Radio Frequency” (RF) refers to a frequency in the range 300 GHz≥f≥20 kHz.
Embodiments of this disclosure will be described hereinafter, by way of example only, with reference to the accompanying drawings in which like reference signs relate to like elements and in which:
Embodiments of this disclosure are described in the following with reference to the accompanying drawings.
In this example, the first and second electrically conductive signal members 2, 4 are transmission lines e.g. strip lines. However, it will be appreciated that the electrically conductive signal members 2, 4 could be other kinds of components, such as antennae.
The first and second electrically conductive signal members 2, 4 may be provided in a laminated structure such as a metallization stack including a plurality of dielectric layers and layers of patterned metal features. Electrically conductive side walls 12, 16 may be provided at either lateral side of the RF component 10. Similarly, upper and lower electrically conductive walls 18 may be provided above and below the first and second electrically conductive signal members 2, 4. Each electrically conductive signal member 2, 4 may be located within a respective dielectric region 6, 8. The dielectric regions 6, 8 may be enclosed by the electrically conductive side walls 12, 16 and the upper and lower electrically conductive walls 18. The electrically conductive features, including the electrically conductive signal members 2, 4, the electrically conductive side walls 12, 16, the upper and lower electrically conductive walls 18 (and the barrier 14 to be described below) may be formed as the patterned metal features of the metallisation stack.
In order to provide electromagnetic shielding of the first electrically conductive signal member 2 from the second electrically conductive signal member 4 (and vice versa), the example shown in
As can be seen from
The barrier 14 in this example is formed by a monolithic metallic block. Similarly, the sidewalls 12, 16 in this example are also provided as monolithic blocks. The use of a barrier 14 comprising a monolithic block may be seen as the ideal case for the purposes of providing electromagnetic shielding between the first electrically conductive signal member 2 and the second electrically conductive signal member 4. However, the provision of a monolithic barrier 14 and side walls 12, 16 of the kind shown in
Although more feasible from a manufacturing perspective, the barrier in the example of
Although the example in
The first and second electrically conductive signal members 2, 4 may be provided in a laminated structure such as a metallization stack including a plurality of dielectric layers and layers of patterned metal features. The metallization stack may be located on a substrate such as a printed circuit board (PCB) or on a semiconductor substrate such as on the surface of a semiconductor die.
Electrically conductive side walls 42, 46 may be provided at either lateral side of the RF component 10. Similarly, upper and lower electrically conductive walls may be provided above and below the first and second electrically conductive signal members 2, 4, as described above in relation to
As can be seen from
In order to provide electromagnetic shielding of the first electrically conductive signal member 2 from the second electrically conductive signal member 4 (and vice versa), the embodiment shown in
The barrier in this embodiment is formed by a plurality of electrically conductive shielding members 44A, 44B. Each electrically conductive shielding member comprises a polyhedron formed from an electrically conductive material (e.g. metal). Similarly, the sidewalls 12, 16 in this embodiment may also be provided as polyhedra formed from an electrically conductive material (e.g. metal), although this is not essential (e.g. vias of the kind shown in
In this embodiment, the barrier comprises a first row of electrically conductive shielding members 44A spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members 44B spaced apart along a longitudinal axis of the second row. In this embodiment, the electrically conductive shielding members 44A of the first row are offset (staggered) with respect to the electrically conductive shielding members 44B of the second row. This can prevent a direct line of sight between the first electrically conductive signal member 2 and the second electrically conductive signal member 4, thereby improving the electromagnetic shielding providing by the barrier. As shown by the arrow labelled “A” in
The use of polyhedra for the electrically conductive shielding members of the barrier has a number of advantages. The use of polyhedra is readily compatible with standard semiconductor manufacturing techniques, such as the formation of metallization stacks. Because of this, a high degree of flexibility is achieved in terms of choosing the shape and size of the electrically conductive shielding members, whereby the shielding provided by the barrier can be optimised.
Each electrically conductive shielding member in each row may be elongate (e.g. as shown in
Note that the arrangement shown in
To simplify the manufacturing process, each electrically conductive shielding member in each row 44A, 44B may be the same shape and size. It will be appreciated that at the ends of the barrier, one or more of the electrically conductive shielding members may need to be a different shape, owing to the offset nature of the arrangement of the electrically conductive shielding members in the barrier.
Various shapes for the electrically conductive shielding members 44A, 44B are envisaged. As noted above, each electrically conductive shielding member 44A, 44B comprises a polyhedron, which can simplify the manufacturing process as polyhedra in general are compatible with known metallization techniques in the semiconductor industry. For the purposes of this disclosure, a polyhedron may be considered to be a three-dimensional shape with flat polygonal faces, straight edges and sharp corners or vertices. Note that the vias 24A, 24B do not fall within this definition.
In the embodiment shown in
As will be described below, more complicated types of polyhedra are envisaged, for enhancing the isolation between the electrically conductive signal members 2, 4.
As described above, the first and second electrically conductive signal members 2, 4 in this embodiment may be provided in a laminated structure such as a metallization stack including a plurality of dielectric layers and layers of patterned metal features. The metallization stack may be located on a substrate such as a printed circuit board (PCB) or on a semiconductor substrate such as on the surface of a semiconductor die.
As described above, electrically conductive side walls 52, 56 may be provided at either lateral side of the RF component 10. Similarly, upper and lower electrically conductive walls may be provided above and below the first and second electrically conductive signal members 2, 4, as described above in relation to
As can be seen from
The barrier in this embodiment comprises a first row of electrically conductive shielding members 54A spaced apart along a longitudinal axis of the first row and a second row of electrically conductive shielding members 54B spaced apart along a longitudinal axis of the second row. Each electrically conductive shielding member 54A, 54B comprises a polyhedron.
The polyhedra used for the electrically conductive shielding members 54A, 54B in this embodiment collectively form a labyrinthine structure which, as can be seen from the arrow labelled C in
Although various labyrinthine structures may be used, depending on the exact shape chosen for the electrically conductive shielding members 54A, 54B, in this embodiment, each electrically conductive shielding member 54A of the first row comprises a base portion having a first end and a second end, a first arm extending from the first end of the base towards the second row, and a second arm extending from the second end of the base towards the second row. Similarly, each electrically conductive shielding member of the second row comprises a base portion having a first end and a second end, a first arm extending from the first end of the base towards the first row, and a second arm extending from the second end of the base towards the first row. The polyhedra of the electrically conductive shielding members 54A, 54B are thus substantially “U” shaped.
To complete the labyrinthine structure of the present embodiment, the arms of the U-shaped electrically conductive shielding members 54A, 54B are interlocked, that is to say that a distal end of each arm of each electrically conductive shielding member 54A of the first row is located within a region located between the arms of an electrically conductive shielding member 54B of the second row (and vice versa). This interlocking of the arms of the electrically conductive shielding members 54A, 54B can, as demonstrated by the arrow labelled C in
In the embodiments described above in relation to
The provision of any additional rows of electrically conductive shielding members 54A, 54B in the barrier can further improve the isolation between the electrically conductive signal members 2, 4. For instance, the additional rows may be used to increase the path length for any electromagnetic fields attempting to pass through the barrier by introducing yet further turns that the electromagnetic fields must navigate.
In a first step 202, a first electrically conductive signal member 2 for conveying an RF signal is formed. The first electrically conductive signal member 2 may be of the kind described above in relation to
In a second step 204, a second electrically conductive signal member 4 for conveying an RF signal is formed. The second electrically conductive signal member 4 may be of the kind described above in relation to
In a third step 206, a barrier located between the first electrically conductive signal member and the second electrically conductive signal member is formed. The barrier is for electromagnetically shielding the first and second electrically conductive signal members from each other. The barrier may be of the kind described above in relation to
The steps 202, 204, 206 may include deposit and patterning a plurality of layers of electrically conductive material and deposit and patterning a plurality layers of dielectric on a surface. As described herein, the layers may build up to form a metallization stack. The surface upon which the stack is formed may, for example, be the surface of a substrate such as a printed circuit board (PCB) or the surface of a semiconductor substrate such as a semiconductor die. Although
Accordingly, there has been described a Radio Frequency, “RF”, component and a method of making the same. The component comprises a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also comprises a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier comprises a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member comprises a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.
Although particular embodiments of this disclosure have been described, it will be appreciated that many modifications/additions and/or substitutions may be made within the scope of the claims.
Number | Date | Country | Kind |
---|---|---|---|
21213985 | Dec 2021 | EP | regional |
Number | Name | Date | Kind |
---|---|---|---|
4658334 | McSparran | Apr 1987 | A |
5150088 | Mrga et al. | Sep 1992 | A |
5384555 | Wilson et al. | Jan 1995 | A |
6157546 | Petty | Dec 2000 | A |
6974724 | Hyvoenen et al. | Dec 2005 | B2 |
7352328 | Moon et al. | Apr 2008 | B2 |
7637776 | McNutt | Dec 2009 | B2 |
9788466 | Chen | Oct 2017 | B2 |
9899341 | Hashemi et al. | Feb 2018 | B2 |
10206317 | Liukkonen | Feb 2019 | B2 |
10464306 | MacDonald | Nov 2019 | B2 |
10608345 | Kirino et al. | Mar 2020 | B2 |
10714430 | Murtuza et al. | Jul 2020 | B2 |
20050245001 | Hyvonen et al. | Nov 2005 | A1 |
20090091507 | Chung et al. | Apr 2009 | A1 |
20130050031 | Zhu et al. | Feb 2013 | A1 |
20150327357 | Khan | Nov 2015 | A1 |
20180277489 | Han | Sep 2018 | A1 |
20200176884 | Kirino et al. | Jun 2020 | A1 |
20200185802 | Vilenskiy et al. | Jun 2020 | A1 |
Number | Date | Country |
---|---|---|
101036262 | Dec 2015 | CN |
113013642 | Jun 2021 | CN |
Entry |
---|
Elwi, T., “Printed Microwave Metamaterial-Antenna Circuitries on Nickel Oxide Polymerized Palm Fiber Substrates”, Scientific Reports, Article No. 2174, Feb. 18, 2019. |
Number | Date | Country | |
---|---|---|---|
20230189492 A1 | Jun 2023 | US |