RF module, multi RF module including the RF module, and method of manufacturing the RF module

Abstract

A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

FIG. 1 is a cross-sectional view of an RF module according to an exemplary embodiment of the present invention;

FIG. 2 is a cross-sectional view of an RF module according to another exemplary embodiment of the present invention;

FIG. 3 is a cross-sectional view of an RF module according to another exemplary embodiment of the present invention;

FIGS. 4A through 4F illustrate a method of manufacturing the RF module of FIG. 1; and

FIGS. 5A through 5C illustrate a method of manufacturing the RF module of FIG. 2.

Claims

1. A radio frequency (RF) module comprising: a base substrate;a first element that is disposed on the base substrate and processes RF signals;a second element that is separated from and disposed over the first element and processes RF signals;a cap substrate coupled with the base substrate to encapsulate the first and second elements, the cap substrate comprising a plurality of through electrodes that electrically connect the first and second elements to the outside; anda bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

2. The RF module of claim 1, wherein each of the first and second elements comprises a band-pass filter.

3. The RF module of claim 2, wherein each of the first and second elements comprises at least one film bulk acoustic resonator (FBAR).

4. The RF module of claim 1, further comprising a third element that is disposed on the cap substrate, connected to the first and second elements by the through electrodes, and processes RF signals.

5. The RF module of claim 4, wherein the second element is separated from the lower surface of the cap substrate and supported by the bonding pad.

6. The RF module of claim 4, wherein each of the first and second elements comprises a band-pass filter.

7. The RF module of claim 4, wherein the third element comprises a phase shifter that separates the RF signals of the first and second elements from each other.

8. The RF module of claim 1, further comprising a third element that is disposed on the margin of the area that is encapsulated and joined by the cap substrate in the upper portion of the base substrate, connected to the first and second element, and processes RF signals.

9. The RF module of claim 8, wherein the second element is disposed on a lower surface of the cap substrate facing the base substrate.

10. The RF module of claim 8, wherein each of the first and second elements comprises a band-pad filter.

11. The RF module of claim 8, wherein the third element comprises a phase shifter which separates the RF signals of the first and second elements from each other.

12. A multi radio frequency (RF) module comprising: a plurality of RF modules which are disposed on a base substrate wherein, each of the RF modules comprises:a first element that is disposed on the base substrate and processes RF signals;a second element that is separated from and disposed over the first element and processes RF signals;a cap substrate that is bonded with the base substrate and encapsulates the first and second elements, and comprises a plurality of through electrodes that electrically connect the first and second elements to the outside; anda bonding pad that encapsulates and couples the base substrate and the cap substrate and electrically connects the first and second elements to be electrically connected to the through electrodes.

13. A method of manufacturing a radio frequency (RF) module, comprising: forming a first element capable of processing RF signals on a base substrate;forming a second element capable of processing RF signals on a middle substrate;bonding the base substrate and the middle substrate so that the first and second elements face each other;etching the middle substrate such that wiring of the first and second elements is exposed;forming on a cap substrate a third element capable of processing RF signals and a through electrode which electrically connects the first and second elements to the outside; andencapsulating and bonding the base substrate and the cap substrate so that the first and second elements are encapsulated.

14. A method of manufacturing a radio frequency (RF) module, comprising: forming on a base substrate first and third elements capable of processing RF signals;forming on a cap substrate a second element capable of processing RF signals and a through electrode which electrically connects the first and second elements to the outside;encapsulating the first and second elements by joining the base substrate and the cap substrate; andetching the cap substrate such that the third element is exposed to the outside.