Patent Application
20250019805
Embodiments described below relate to a rhenium-tungsten alloy wire, a method of manufacturing the same, and a medical needle.
A tungsten alloy (ReW) wire containing a predetermined amount of rhenium (Re) has improved electrical resistance properties and wear resistance as compared with a normal tungsten (W) wire. Tensile strength over a wide range of temperatures and ductility after recrystallization are also improved. Therefore, it is used for probe pins for semiconductor inspection, heaters for electron tubes, filament materials for vibration-resistant bulbs, thermocouples, filaments for fluorescent display tubes, medical needles, and the like.
The ReW wire becomes white silver with metallic luster after the surface mixture layer generated in a manufacturing step is removed by electropolishing or the like, but the surface becomes discolored to, for example, blue, yellow, red purple, or the like as the storage period becomes longer. When discoloration occurs, the electrical resistance of the probe pin may change. In a filament for a display tube, uniformity disappears in coating (electrodeposition surface treatment) of an oxide for emitting thermoelectrons. In a medical needle, quality deterioration and impurities such as a change in frictional force in a discolored portion and a risk of a discolored portion falling off become problems.
Because of this, the discolored portion cannot be used, and an additional treatment such as re-electrolysis is required. Further, the additional treatment causes a change in size of the wire to change the electrical resistance or strength, and therefore the wire becomes unusable and the yield decreases. Therefore, after the electrolysis step, for example, drying is sufficiently performed, and a wound wire spool is sealed and packed under reduced pressure, and stored in a state of being shielded from the external environment. However, in the ReW wire stored in the same manner, there are variations in the occurrence of discoloration.
The problem to be solved by the present embodiment is to provide a ReW wire that facilitates long-term storage by preventing discoloration.
In order to solve the above problem, a rhenium-tungsten alloy wire according to an embodiment is a wire made of a tungsten alloy containing rhenium, in which a ratio W/Re of an atomic concentration (atm %) of tungsten (W) to an atomic concentration (atm %) of rhenium (Re) according to XPS analysis is 2.5 or more in an arbitrary measurement area of a unit area having a diameter of 50 μm at a wire surface.
Hereinafter, a rhenium-tungsten alloy wire of an embodiment will be described with reference to the drawings. Hereinafter, the rhenium-tungsten alloy wire may be referred to as a ReW wire. Note that the drawings are schematic, and for example, the dimensional proportions of each part are not limited to those shown in the drawings.
A rhenium-tungsten alloy wire according to an embodiment is a wire made of a tungsten alloy containing rhenium, in which a ratio W/Re of an atomic concentration (atm %) of tungsten (W) to an atomic concentration (atm %) of rhenium (Re) determined by XPS analysis is 2.5 or more in an arbitrary measurement area of a unit area having a diameter of 50 μm at a wire surface.
Among rhenium oxides, Re2O5 is also referred to as dirhenium pentoxide, and is a blue compound. ReO3 is also referred to as rhenium trioxide, and is a red cubic crystal with metallic luster. Re2O7 is also referred to as dirhenium heptoxide, and is a yellow orthorhombic crystal (Non-Patent Literature 1: Saburo Nagakura and five others “Iwanami Dictionary of Physics and Chemistry, 5th Edition”, Iwanami Shoten, February 1998, p. 541). As described above, the rhenium oxide has a color, and the color changes depending on the type of oxide. As a result of intensive studies, it has been found that the discoloration of a ReW wire is caused by a rhenium oxide.
In B (non-discolored sample), more W-Metal and tungsten oxide were detected than in A (discolored sample), and in A, more rhenium oxide was detected than in B. The results of the ratio W/Re of the atomic concentration of tungsten (W) to the atomic concentration of rhenium (Re) by XPS semi-quantitative analysis of the same portion are shown in Table 1. In the discolored sample, the abundance ratio of rhenium is large, and thus rhenium oxide is easily formed. Table 1a shows the composition in the measurement range of each of the discolored sample (A) and the non-discolored sample (B). From Table 1a, it can be seen that the surface of the ReW wire is made of C, N, O, W, and Re. Therefore, it can be said that the surface of the ReW wire can contain C, N, O, W, and Re. The contents of C, N, and
O in the non-discolored sample (B) are approximately equal to the contents of C, N, and O in the discolored sample (A). In addition, the W content in the non-discolored sample (B) is larger than that in the discolored sample (A), and the Re content in the non-discolored sample (B) is smaller than that in the discolored sample (A).
The difference between the maximum value and the minimum value of the reflectance was 5% or less in the case of a white silver color (metallic color) without discoloration with respect to a visible light wavelength of 400 nm to 700 nm. On the other hand, the reflectance of the discolored portion changed to a spectrum having a peak with a difference from the minimum value of 5% or more in a wavelength portion corresponding to each color. As a result, the discolored portion is determined visually or by determining whether the difference between the maximum value and the minimum value of the reflectance in the wavelength of 400 nm to 700 nm of the reflection spectrum exceeds 5%.
As a factor that increases the abundance ratio of rhenium (Re) at the surface, there is a variation in material quality of the wires.
Since the sintering of Re-W proceeds by solid- phase diffusion, it may be impossible to diffuse and homogenize (to form a solid solution of) rhenium in the tungsten matrix, depending on the particle size distribution of each powder, the mixed state of the powders, or the molding/sintering conditions. As a result, a phase region in which the composition ratio of rhenium is locally high (a segregated phase of a o phase) is formed. When this is present at the surface, the abundance ratio of rhenium at the surface increases.
In addition, since the surface removal treatment of the ReW wire performed after the drawing step, for example, the electropolishing treatment, is insufficient, a layer having an unstable composition remains on the surface of the ReW wire, and there is a possibility that the abundance ratio of rhenium will increase.
In addition, when the surface treatment is performed by electropolishing, tungsten is preferentially dissolved depending on electrolysis conditions, and the abundance ratio of rhenium may increase.
The ReW wire of the embodiment is subjected to surface polishing, and subjected to semi-quantitative analysis by XPS analysis. For the surface polishing, for example, chemical polishing such as electropolishing may be performed. The XPS analysis is performed, for example, using Quantera SXM manufactured by ULVAC-PHI, Inc., in which an X-ray source is a single crystal spectroscopic A1kα ray, an X-ray output is 12.5 W, and an analysis range is @ 50 μm.
In the ReW wire of the embodiment, a ratio W/Re of an atomic concentration (atm %) of tungsten (W) to an atomic concentration (atm %) of rhenium (Re) by XPS analysis is 2.5 or more in an arbitrary measurement area. By setting the ratio W/Re of the atomic concentrations of tungsten and rhenium on the surface to 2.5 or more, rhenium oxide formation can be prevented. Further, when a probe pin or a medical needle is manufactured using the ReW wire of the embodiment as a material, discoloration is prevented, and manufacturing can be performed with a high yield. The value of the ratio W/Re can be adjusted by, for example, at least one of the particle size of the tungsten powder as a raw material, the particle size of the rhenium powder as a raw material, the sintering temperature during manufacturing, and the polishing speed of electropolishing, or a combination of two or more thereof.
The content of rhenium contained in the ReW wire of the embodiment is, for example, 2 wt % or more and less than 30 wt %. In addition, the content of rhenium contained in the ReW wire of the embodiment is preferably, for example, 10 wt % or more and 28 wt % or less. The rhenium content is a value analyzed by inductively coupled plasma-optical emission spectrometry (ICP-OES). Rhenium improves the elongation of tungsten at high temperatures and enhances the workability. The strength is also increased by solid solution strengthening.
When the rhenium content is less than 2 wt %, the effect is insufficient. For example, in a case where a ReW wire having a rhenium content of less than 2 wt % is used as a material for a probe pin, the amount of deformation of the probe pin increases with the frequency of use and failure in contact occurs to degrade the inspection accuracy of a semiconductor. When the rhenium content is 30 wt % or more, the limit of solid solubility with tungsten is exceeded, and thus it becomes impossible to diffuse and homogenize (to form a solid solution of) rhenium in the tungsten matrix. As a result, a phase region in which the composition ratio of rhenium is locally high (a segregated phase of a φ phase) may occur, and W/Re may be partially reduced. When such a portion appears at the surface, discoloration is likely to occur.
When a probe pin or a medical needle is manufactured using a ReW wire having a rhenium content of 2 wt % or more and less than 30 wt % as a material, discoloration can be prevented and manufacturing can be performed with high yield, and the mechanical properties (strength and wear resistance) of the manufactured probe pin or medical needle can be ensured. The rhenium content is preferably, for example, 10 wt % or more and 28 wt % or less.
The ReW wire of the embodiment may contain potassium (K) as a dopant in an amount of 30 wtppm or more and 90 wtppm or less. The potassium content is a value analyzed by inductively coupled plasma-optical emission spectrometry (ICP-OES). Incorporation of potassium improves tensile strength and creep strength at high temperatures due to the doping effect. When the potassium content is less than 30 wtppm, the doping effect becomes insufficient.
When the potassium content exceeds 90 wtppm, the workability may decrease to cause a large decrease in the yield. When potassium is contained as a dopant in an amount of 30 wtppm or more and 90 wtppm or less, for example, thin wires for a thermocouple or for an electron tube heater made of the ReW wire of the embodiment can be manufactured with high yield while ensuring high-temperature properties (prevention of wire breakage and deformation during high-temperature use).
The ReW wire of the embodiment has, for example, a diameter of 0.1 mm or more and 1.00 mm or less.
The ReW wire of such an embodiment prevents surface discoloration and greatly contributes to long-term storage and improvement in yield. In addition, the ReW wire of the embodiment can be applied to a medical needle. The present embodiment can also be applied to a ReW wire for a thermocouple or a probe pin.
Next, a method of manufacturing the ReW wire according to the embodiment will be described. The manufacturing method is not particularly limited, and examples thereof include the following methods.
A tungsten powder and a rhenium powder are mixed so that the rhenium content is 2 wt % or more and less than 30 wt %. The mixing method is not particularly limited, but a method of mixing by forming the powders into a slurry using water or an alcohol-based solution is particularly preferable because powders with good dispersibility can be obtained. In addition, in order to ensure the homogeneity of the powder lots, it is more preferable to dry the above-described slurry and then collectively stir the same powder lots in a dry state.
The rhenium powder to be mixed preferably has an average particle size of less than 8 μm. The particle size distribution preferably has an SD value of less than 11 μm.
The tungsten powder is a pure tungsten powder excluding inevitable impurities or a doped tungsten powder containing potassium (K) in an amount in consideration of the yield up to the wire material. The tungsten powder preferably has an average particle size of less than 16 μm. The particle size distribution preferably has an SD value of less than 13 μm.
When the average particle size of the rhenium powder is 8 μm or more, when the SD value of the rhenium powder is 11 μm or more, when the average particle size of the tungsten powder is 16 μm or more, or when the SD value of the tungsten powder is 13 μm or more, a diffusion distance of rhenium atoms or tungsten atoms for diffusing and homogenizing (forming a solid solution of) rhenium in the tungsten matrix increases, and a o phase is easily formed.
The ratio of the average particle size of the rhenium powder to the average particle size of the tungsten powder (Re average particle size/W average particle size) is preferably 0.4 or more and 2.0 or less. When the ratio of the average particle size of the rhenium powder to the average particle size of the tungsten powder is less than 0.4 or more than 2.0, the diffusion distance of the rhenium atoms to the center of the tungsten particles or the diffusion distance of the tungsten atoms to the center of the rhenium particles increases, and a o phase may be easily generated.
Subsequently, the mixed powder is placed in a predetermined mold and press-molded. The pressing pressure at this time is preferably 150 MPa or more. The molded body may be subjected to a presintering treatment at 1,200 to 1400° C. in a hydrogen furnace in order to facilitate handling. The obtained molded body is sintered in a hydrogen atmosphere, an inert gas atmosphere such as argon, or under vacuum. The sintering temperature is preferably 2,500° C. or higher. When the sintering temperature is lower than 2,500° C., diffusion of rhenium atoms and tungsten atoms does not sufficiently proceed during sintering. The upper limit of the sintering temperature is 3,400° C. (the melting point of tungsten is 3,422° C. or lower).
The relative density of the sintered body (relative density (%) to the true density=[sintered body density/true density]×100%) is preferably 90% or more. In addition, in one sintered body, for example, the ratio of the density of the lowest portion, such as the lower end, in electric sintering to the average density of the entire sintered body is preferably 0.98 or more. The variation in the rhenium content can be reduced by setting the relative density of the sintered body to 90% or more and setting the ratio of the density of the lowest portion to the average density of the entire sintered body to 0.98 or more.
The sintered body obtained in the main sintering step is subjected to first swaging (SW) processing. The first swaging processing is preferably performed at a heating temperature of 1,300 to 1,600° C. The reduction rate of the cross-sectional area (area reduction rate) at which processing is performed by a single heat treatment (single heating) is preferably 5 to 15%.
Instead of the first swaging processing, rolling processing may be performed. The rolling processing is preferably performed at a heating temperature of 1,200 to 1,600° C. The area reduction rate in single heating is preferably 40 to 75%. As a rolling mill, a two-way roller rolling mill, a four-way roller rolling mill, a die roll rolling mill, or the like can be used. The rolling processing can greatly enhance the manufacturing efficiency. The first swaging (SW) processing and the rolling processing may be combined.
The sintered body (ReW rod) after completion of the first swaging processing, the rolling process, or the combined processing of the first swaging processing and the rolling processing is subjected to second swaging (SW) processing. The second swaging processing is preferably performed at a heating temperature of 1,200 to 1,500° C. The area reduction rate in single heat (single heating) is preferably about 5 to 20%.
Subsequently, the ReW rod after completion of the second swaging step is subjected to a recrystallization treatment. The recrystallization treatment can be performed at a treatment temperature in a range of 1,800 to 2,600° C. in a hydrogen atmosphere, in an inert gas atmosphere such as argon, or under vacuum using, for example, a high-frequency heating apparatus.
The ReW rod after completion of the recrystallization treatment is subjected to third swaging processing. The third swaging processing is preferably performed at a heating temperature of 1,200 to 1,500° C.
The area reduction rate in single heating is preferably about 10 to 30%. The third swaging processing is performed until the ReW rod has a diameter allowing drawing processing (preferably, a diameter of 2 to 4 mm).
In order to enable smooth drawing (DW) processing, the ReW rod after completion of the third swaging processing is subjected to a treatment of applying a lubricant to the surface, and the lubricant is dried. In the drawing processing, application of a lubricant, drying of the lubricant, a treatment of heating to a temperature that allows processing, and a treatment of drawing using a drawing die are repeated. It is desirable to use a carbon (C)-based lubricant excellent in heat resistance as the lubricant.
The processing temperature is set according to the wire diameter to be obtained by the drawing processing. The processing temperature is preferably, for example, 1,100° C. or lower. The area reduction rate per die is preferably 10 to 358. If necessary, an annealing step or a surface polishing step (for example, an electrolysis step) may be added under known conditions during the drawing step.
The ReW wire after completion of the drawing step is subjected to polishing processing. As the polishing processing, for example, there is a method of electrochemically polishing (electropolishing) in an aqueous sodium hydroxide solution at a concentration of 3 to 15 wt %. The area reduction rate in the polishing processing is preferably 10 to 25%. When the area reduction rate is less than 10%, protrusions and recesses on the material surface generated in the swaging step or the drawing step and the mixture adhering to the protrusions and recesses on the material surface may not be able to be removed. When the surface removal amount is insufficient, the mixture layer remains locally, and thus the abundance ratio of rhenium may increase. When the area reduction rate exceeds 25%, the material yield deteriorates.
In the case of electropolishing, the polishing speed is preferably 0.5 to 3.0 μm/sec. When the polishing speed is slower than 0.5 μm/sec, tungsten at the surface may be preferentially dissolved to increase the abundance ratio of rhenium at the surface. When the polishing speed exceeds 3.0 μm/sec, the amount of electrolysis per unit time increases, leading to rapid electrolysis, and correction of the cross-sectional shape of the ReW wire may become insufficient.
The ReW wire after completion of the polishing processing may be subjected to, for example, a drying step. The drying step is performed by, for example, a vacuum dryer whose internal temperature is set within a range of 50 to 80° C. The drying time is, for example, 1 hour or more. Thereafter, a predetermined shipping inspection is performed. When the ReW wire after vacuum drying is stored, for example, moisture adsorption can be prevented by housing the ReW wire in a moisture-proof storage having a relative humidity of 5% or less. For example, the ReW wire is housed and stored in the moisture-proof storage except when property or quantity inspection or the like is performed.
The ReW wire is wound around a spool for shipping while, for example, shipping inspection is performed. In the ReW wire after completion of the shipping inspection, for example, the outermost surface wound around the spool for shipping is covered with a protective paper, and the protective paper is fixed with a rubber band or the like. Thereafter, for example, the ReW wire is housed in an aluminum bag or the like, and the aluminum bag is subjected to a degassing treatment, and then sealed.
A probe pin or a medical needle having a predetermined wire diameter and necessary properties (such as strength and hardness) is obtained by performing a necessary step under a known condition using an appropriate amount of the ReW wire obtained in the above-described steps.
A doped tungsten powder containing potassium (K) in an amount of 50 wtppm to 80 wtppm in the final wire material and having an average particle size of 13 μm and an SD value of 12 μm and a rhenium powder having an average particle size of 6 μm and an SD value of 7 μm were formed into a slurry using an alcohol-based solution and mixed so that the proportion of rhenium is 10 wt %. The obtained slurry was dried to form a raw material powder.
The mixed powder of the raw materials was press-molded to obtain a molded body. The molded body was subjected to a presintering treatment at 1,300° C. in a hydrogen furnace. The molded body was sintered at 3,000° C. in a hydrogen atmosphere to obtain a sintered body. The sintered body was subjected to first swaging processing at a heating temperature of 1,400° C. and a reduction rate of a cross-sectional area processed by a single heat treatment of 14%. The sintered body which was subjected to the first swaging processing was subjected to second swaging processing at a heating temperature of 1,300° C. and a reduction rate of a cross-sectional area processed by a single heat treatment of 15%.
The ReW rod after completion of the second swaging processing was subjected to a recrystallization treatment at a treatment temperature of 2,400° C. in a hydrogen atmosphere. After the recrystallization treatment, third swaging processing was performed at a heating temperature of 1,300° C. and a reduction rate of the cross-sectional area processed by a single heat treatment of 13% to obtain a rod having a diameter of 2.5 mm.
A lubricant was applied to the surface of the rod which was subjected to the third swaging processing, and dried. The obtained rod was subjected to drawing processing. The drawing processing was performed at 1,000° C. so that the reduction rate of the cross-sectional area in single drawing processing was 10% to 35%. In the drawing processing, an annealing step was performed at 1,300° C.
The ReW wire after completion of the drawing processing was subjected to electropolishing in an aqueous sodium hydroxide solution at a concentration of 8 wt %. The electropolishing step was performed at a reduction rate of the cross-sectional area in the electropolishing step of 15 to 20% and a polishing speed of 2.2 μm/sec. The obtained ReW wire had a wire diameter of 0.8 mm.
ReW after the electropolishing was subjected to a drying step for 2 hours by a vacuum dryer having an internal temperature of 70° C. The obtained ReW wire was wound around a spool for shipping of 100 m/spool, and the outermost surface was covered with a protective paper, and the protective paper was fixed with a rubber band. The spool for shipping around which the ReW wire was wound was housed in an aluminum bag together with a desiccant containing silica gel, and the inside of the aluminum bag was subjected to a degassing treatment and sealed.
Three spools similar thereto were manufactured, and the samples of the three spools were stored for 8 months by placing the samples side by side on a table having a height of 1 m provided in a room at a humidity of 60% or less and a room temperature of 30° C. or lower. After a lapse of 8 months, whether discoloration occurred was checked by the above-described method (the difference between the maximum value and the minimum value of the reflectance in the wavelength of 400 nm to 700 nm of the reflection spectrum described with reference to
A ReW wire was manufactured in the same manner as in Example 1 except that the tungsten powder as a raw material was not doped with potassium, the ratio of rhenium was 26 wt %, the wire diameter of the final ReW wire was 0.15 mm, and the ReW wire was wound around a spool for shipping of 500 m/spool and housed in an aluminum bag together with a desiccant by a packing method similar to that in Example 1. As in Example 1, three identical spools were manufactured, and stored for 8 months, and after a lapse of 8 months, whether discoloration occurred was checked in the same manner as in Example 1.
A ReW wire was manufactured by performing steps similar to those in Example 1 up to the drawing processing step using raw material powders similar to those in Example 1. The obtained Rew wire was subjected to an electropolishing step at a polishing speed of 0.4 μm/sec to obtain a ReW wire having a wire diameter of 0.8 mm. The obtained ReW wire was wound around a spool for shipping of 100 m/spool, and the outermost surface was covered with a protective paper, and the protective paper was fixed with a rubber band. The spool for shipping around which the ReW wire was wound was housed in an aluminum bag together with a desiccant containing silica gel, and the inside of the aluminum bag was subjected to a degassing treatment and sealed. Three identical spools were manufactured, and stored for 8 months, and after a lapse of 8 months, whether discoloration occurred was checked in the same manner as in Example 1.
A ReW wire was manufactured by performing steps similar to those in Example 2 up to the drawing processing step using raw material powders similar to those in Example 2. The obtained ReW wire was subjected to an electropolishing step at a polishing speed of 0.4 μm/sec to obtain a ReW wire having a wire diameter of 0.15 mm. The obtained ReW wire was wound around a spool for shipping of 500 m/spool and packed in the same manner as in Comparative Example 1. Three identical spools were manufactured, and stored for 8 months, and after a lapse of 8 months, whether discoloration occurred was checked in the same manner as in Example 1.
Table 2 shows the measurement results of each of the rhenium content, the potassium content, and W/Re. The analysis of the rhenium content and the potassium content was performed by inductively coupled plasma-optical emission spectrometry (ICP-OES). The lower detection limit of potassium is 5 wtppm, and a case where the analytical value is less than 5 wtppm without addition is indicated by “−”. W/Re was determined by XPS analysis. In the XPS analysis, Quantera SXM manufactured by ULVAC-PHI, Inc. is used, and an X-ray source is a single crystal spectroscopic 10 A1Kα ray, an X-ray output is 12.5 W, and an analysis range is φ 50 μm.
As can be seen from Table 2, the ReW wire according to the embodiment can prevent discoloration even in long-term storage, and can greatly improve the yield in medical needle processing. In the ReW wires of Comparative Example 1 and Comparative Example 2, since the electropolishing speed was slow, the abundance ratio of rhenium at the surface was large, and W/Re was less than 2.5.
While some embodiments of the present invention have been illustrated above, these embodiments have been presented as examples, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, changes, and the like can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and their equivalents. In addition, the above-described embodiments can be implemented in combination with each other.
Hereinafter, the inventions of the embodiments will be additionally described.
<1>. A rhenium-tungsten alloy wire which is a comprising a tungsten alloy containing rhenium, wherein a ratio W/Re of an atomic concentration (atm %) of tungsten (W) to an atomic concentration (atm %) of rhenium (Re) according to XPS analysis is 2.5 or more in an arbitrary measurement area of a unit area having a diameter of 50 μm at a wire surface.
<2>. The rhenium-tungsten alloy wire according to <1>, wherein a rhenium content is 2 wt % or more and less than 30 wt %.
<3>. The rhenium-tungsten alloy wire according to <1>, wherein the rhenium content is 10 wt % or more and 28 wt % or less.
<4>. The rhenium-tungsten alloy wire according to any one of <1> to <3>, wherein a potassium (K) content is 30 wtppm or more and 90 wtppm or less.
<5>. The rhenium-tungsten alloy wire according to any one of <1> to <4>, which has a diameter of 0.1 mm or more and 1.00 mm or less.
<6>. The rhenium-tungsten alloy wire according to any one of <1> to <5>, which is used for a wire material of a medical needle.
<7>. A method of manufacturing the rhenium-tungsten alloy wire according to any one of <1> to <6>.
<8>. A medical needle comprising the rhenium-tungsten alloy wire according to any one of <1> to <6>.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the invention. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the invention. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-055239 | Mar 2022 | JP | national |
This application is a Continuation Application of PCT Application No.PCT/JP2023/013103, filed Mar. 30, 2023 and based upon and claiming the benefit of priority from Japanese Patent Application No. 2022-055239, filed Mar. 30, 2022, the entire contents of all of which are incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2023/013103 | Mar 2023 | WO |
| Child | 18902266 | US |
