Patent Application
20160020833
(a) Field of the Invention
The present invention relates to a ring setting type NFC (Near Field Communication) ring device, and more particularly to a ring setting type NFC ring device in which a circuit board component is mounted on a slightly cambered surface of a ring setting, and is then encapsulated using a room temperature-solidifiable and waterproof resin adhesive.
(b) Description of the Prior Art
Near Field Communication (abbreviated to NFC), is a short range wireless communication technology. Moreover, NFC is a non-contact recognition and intercommunication technology which can implement short range wireless communication between portable devices, consumer electronic products, PCs (personal computers), and smart controlled appliances.
Commonly seen NFC short range wireless communication rings are normally made from metal for aesthetic appearances. In addition, decorated plastic rubber is used to enable an NFC circuit and an antenna coil or PCB (Printed Circuit Board) to be disposed between the plastic rubber and the curved ring surface, thereby enabling the NFC component to penetrate the plastic rubber and transmit a wireless signal via a NFC communication mode. Moreover, the above-mentioned NFC short range wireless communication rings have poor waterproofing, and because of the excessively curvature, the effectiveness of the NFC circuit containing the antenna to receive and transmit information is poor.
Hence, in light of the aforementioned shortcomings, and pursuing the spirit of excellence in research and development, the inventors of the present invention have found a way to improve the aforementioned shortcomings, and thus propose a ring setting type NFC ring device of the present invention, which further provides an aesthetic appearance and convenience of use.
A primary objective of the present invention lies in mounting a NFC circuit board component on a slightly cambered surface of a ring setting of a ring made from hard material, which is then encapsulated using a room temperature-solidifiable and waterproof resin adhesive. And a wide space is further hollowed out from the soft PCB (printed circuit board) of the NFC circuit board component to the inner edge of the ring to provide a placement slot for disposing NFC circuit related capacitance electronics or related parts therein, thereby strengthening the application function of the ring, as well as achieving the requirement for an aesthetic appearance.
To enable a further understanding of said objectives and the technological methods of the invention herein, a brief description of the drawings is provided below followed by a detailed description of the preferred embodiments.
Regarding the detailed content and structural means of the present invention, please refer to the description of the diagrams as follows:
Referring to
As for the NFC circuit board component 020, if the ring 010 is made from metal material, then a repeater plate needs to be disposed below the NFC circuit board component 020 to provide a function that prevents the metal from interfering with an antenna receiving and transmitting information. A wide space is further hollowed out from the soft PCB (printed circuit board) of the NFC circuit board component 020 to the inner edge of the ring 010 to provide a placement slot 013 for disposing NFC circuit related capacitance electronics or related parts 040 therein, and the room temperature-solidifiable and waterproof resin adhesive 030 is used to encapsulate the NFC circuit board component 020, thereby not only improving the frequently seen shortcomings of NFC ring devices, but also achieving the objectives of waterproofing the ring and providing an aesthetic design.
In conclusion, the design of the ring setting type NFC ring device of the present invention is certainly provided with innovativeness and advancement, and the use of technology is undoubtedly new and original. The effectiveness of the present invention successfully fulfills the design objectives, and clearly provides reasonable advancement. Accordingly, a new patent application is proposed herein.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.
