ROOM COOLING SYSTEM

Abstract

The present disclosure relates to a user-installable room cooling system. This system is both energy and cost efficient and utilizes distributed heat exchangers to a liquid loop. An exemplary embodiment may be comprised of a heat to air transfer plate, a heat pump, a block of heat conductive material, a pump, a pipe interface, a temperature control system, an outside radiator or evaporation cooler, and will be filled at the highest point.

Description

BACKGROUND OF THE INVENTION

Conventional room air conditioning units use state change technology and dehumidify the air. This dehumidification can be problematic on very humid days as the units will overflow from water extracted from the air. This overflow can be as much as a liter, depending on the conditions of the day.

There is currently a need for more efficient and environmentally friendly air conditioning systems. These improved systems may be based on water or emulsion loops for the transport of exhaust heat to the outside of a building.

BRIEF SUMMARY OF THE INVENTION

The embodiments described herein provide for a user-installable room cooling system. This system will be cost efficient to produce, on a large or small scale, and will utilize little electricity compared to a conventional compression cycle air conditioning system currently available.

The disclosed invention may be run from line or low voltage DC, such as 48 volts. This system does not require a drain for condensation water, but may be utilized as a dehumidifier when a drain pipe is connected. Alternatively, the system can be adjusted to have a net zero effect on humidity.

These and other aspects of the disclosed subject matter, as well as additional novel features, will be apparent from the description provided herein. The intent of this summary is not to be a comprehensive description of the claimed subject matter, but rather to provide a short overview of some of the subject matter's functionality. Other systems, methods, features and advantages here provided will become apparent to one with skill in the art upon examination of the following FIGURES and detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention itself, as well as a preferred mode of use, further objectives, and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein:

FIG. 1 A system diagram of an embodiment of the current invention.

DETAILED DESCRIPTION OF THE INVENTION

The disclosed embodiments describe a cost and energy efficient room system. This system may utilize a flexible distributed air handler that can employ distributed heat exchangers to a liquid loop. The liquid loop may only require a singular loop, maintain low pressure in the loop, and achieve a higher efficiency when evaporation cooling tower technology is employed.

This disclosed system will work in efficiently insulated rooms with little heat loss. An exemplary embodiment may be comprised of a heat to air transfer plate 1, a heat pump 2, a block of heat conductive material 3, a pump 5, a pipe interface 6, a temperature control system 8, an outside radiator or evaporation cooler 7, and will be filled at the highest point.

The heat to air transfer plate 1 may have an attractive shape and have sufficient surface area to heat or cool the amount of air in the space. The heat pump 2 may be a Peltier or Magneto Caloric Element, and will act to transport the heat to or from the heat to air transfer plate 1.

The block of heat conductive material 3 may be any suitable material able to transfer heat surface to surface from the heat pump 2 to a liquid medium. This material may be composed of copper or aluminum, for example.

The pump 5 may be utilized to circulate a liquid, such as water, through the heat transfer block 3 and the external radiator 7. The pipe interface 6 may run from the heat transfer block 3 to an external radiator 7.

A temperature control system 8 may be used to protect the Peltier element and to manage optimal performance based on inside and outside temperatures. The temperature control system 8 may also handle freezing control.

When the disclosed system is cooling, condensation may form on the heat to air transfer plate 1. By the force of gravity, the condensation will run down the plate 1 into a collection area and drip into said collection area onto the block of heat conductive material 3 that transfers the heat from the heat pump 2 element to the liquid media. The system will deliberately, by its controls, run at an exhaust temperature of at least 100 degrees Celsius so that any water dripping onto the block of heat conductive material 3 will evaporate rather quickly. The evaporation of condensate provides a net zero result to the room's humidity.

The humidity can be controlled by lowering the exhaust temperature by way of the system control 8 electronics. This control may slow the evaporation process and increase the amount of condensation water in the collection area. A pump, which could in one embodiment be the same pump 5 used to circulate water or other liquid, will sense this increase in condensation and pump the excess water outside a building or into a specific condense water exhaust pipe, which can transport this water to a water evaporation cooling tower or other disposal.

The control unit 8 and power source may provide the 48 volt bus power for the heat pumps 2. The heat pumps 2 may be 300, 400, or 1000 watts for a single unit; however, different wattages could be employed and remain within the scope of this disclosure. The controller 8 manages pump, return, and forward water temperature as well as plate temperature dew point.

The present invention is well adapted to attain the ends and advantages mentioned as well as those that are inherent therein. The particular embodiments disclosed above are illustrative only, as the present invention may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teaching herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular illustrative embodiments disclosed above may be altered or modified and all such variations are considered within the scope and spirit of the present invention. Also, the terms in the claims have their plain, ordinary meaning unless otherwise explicitly and clearly defined by the patentee.

Claims

1. A distributed air handler system comprising: a heat to air transfer plate, said heat to air transfer plate acting to heat or cool surrounding air in a room;a heat pump, said heat pump thermally coupled to said heat to air transfer plate;a block of heat conductive material having at least a first surface and a second surface, wherein at least said first surface is thermally coupled to said heat pump and said at least said second surface is thermally coupled to a liquid medium, said block of heat conductive material transferring heat from said heat pump to said liquid medium;a pump, said pump circulating at least a portion of said liquid medium from a cooling device to said second surface such that said portion of said liquid medium contacts at least said second surface and wherein said pump returns said portion of said liquid medium back to said cooling device;a control system, said control system: managing an inside temperature said inside temperature the temperature inside said room; andmanaging said pump, said liquid medium temperature, and said heat to air transfer plate temperature.

2. The distributed air handler system of claim 1, wherein said heat to air transfer plate is of a sufficient area to heat or cool said room.

3. The distributed air handler system of claim 1, wherein said heat pump is selected from the group consisting of a Peltier and a Magneto Caloric Element.

4. The distributed air handler system of claim 1, wherein said block of heat conductive material is selected from the group consisting of copper and aluminum

5. The distributed air handler system of claim 1, wherein the distributed air handler system has only one said liquid loop.

6. The distributed air handler system of claim 5, wherein said liquid loop is low in pressure.

7. The distributed air handler system of claim 1, wherein the air handler system operates at a net zero result to said room's humidity.

8. The distributed air handler system of claim 7, wherein said block of heat conductive material operates at least 100 degrees Celsius.

9. The distributed air handler system of claim 1, additionally comprising a condensation collection area, said condensation collection area collecting condensate from at least said heat to air transfer plate until said condensate may be removed.

10. The distributed air handler system of claim 9, wherein said condensate removal is accomplished with a condensate removal pump.

11. The distributed air handler system of claim 9, wherein said condensate removal is accomplished with said pump.

12. The distributed air handler system of claim 1, wherein said liquid medium is water.

13. The distributed air handler system of claim 1, wherein said control system additional protects said heat pump and manages optimal performance based on the difference between said inside temperature and an outside temperature as well as freezing control, wherein said outside temperature is the temperature outside of said room.

14. The distributed air handler system of claim 1, wherein said cooling device is a radiator or an evaporation cooler