Claims
- 1. A flexible thermally-conductive epoxy adhesive composition comprising a combination of the following components:
- (a) a polymer mixture comprising
- (i) at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45 when cured with a stoichiometric amount of diethylene triamine ("DETA") and being selected from the group consisting of the trifunctional novolac epoxy of cardanol, the difunctional epoxy of cardanol, and mixtures thereof and
- (ii) a substantially stoichiometric amount of a latent epoxy resin curing agent selected from the group consisting of an aliphatic dihydrazide optionally further comprising an accelerator, a polyamine adduct of epoxy resin, and epoxy-amine adducts wherein said latent epoxy resin curing agent has long aliphatic moieties in its structure, has two or more active hydrogen atoms per molecule, is a solid, and has a melting point or softening point between about 60.degree. and 150.degree. C.; and
- (b) a thermally-conductive filler,
- wherein said flexible thermally-conductive epoxy adhesive composition is rheologically stable at room temperature and, upon cure, exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).
- 2. The flexible thermally-conductive epoxy adhesive composition of claim 1 wherein said at least one thermally-conductive filler is selected from the group consisting of aluminum nitride, aluminum oxide, boron nitride, and silicon carbide.
- 3. The flexible thermally-conductive epoxy adhesive composition of claim 2 wherein said at least one thermally-conductive filler comprises aluminum oxide.
- 4. The flexible thermally-conductive epoxy adhesive composition of claim 1 wherein said at least one thermally-conductive filler is present at a concentration ranging from about 35 to 75 vol % of said flexible thermally-conductive epoxy adhesive composition.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation-in-part application Ser. No. 08/504,168 filed Jul. 19, 1995 now abandoned.
The present application is related to applications having Ser. Nos. 08/504,002, U.S. Pat. 5,575,956, and 08/504,105 now abandoned, both filed on even date herewith and Respectively entitled "Room-Temperature Stable, One-Component, Electrically-Conductive, Flexible Epoxy Adhesives"and "Room-Temperature Stable, One-Component, Flexible Epoxy Adhesives".
US Referenced Citations (7)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0459614 |
Dec 1991 |
EPX |
0561048 |
Sep 1993 |
EPX |
0590975 |
Apr 1994 |
EPX |
Non-Patent Literature Citations (2)
Entry |
Lee et al. "Handbook of Epoxy Resins", McGraw-Hill Book Co., New York, pp. 5/32, 10/18, 16/11 (Reissue 1982). |
Morrison & Boyd, "Organic Chemistry", Allyn and Bacon, Inc., Boston, p. 31, (1979). |
Continuations (1)
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Number |
Date |
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Parent |
504168 |
Jul 1995 |
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