This application is the U.S. National Phase under 35 U.S.C. § 371 of International Application No. PCT/JP2014/051980, filed Jan. 29, 2014, which claims the benefit of Japanese Application No. 2013-205824, filed Sep. 30, 2013, the entire contents of each are hereby incorporated by reference.
The present invention relates to a rotary compressor that is used in an air conditioner or a refrigerating machine.
An acid material (carboxylic acid or the like produced due to degradation of lubricant oil or hydrochloric acid, hydrofluoric acid, or the like which is produced when halogen ions which are produced through chemical decomposition of molecules that make up a refrigerant react with water) inside refrigerant piping in an air conditioner, a refrigerating machine, or the like causes a copper surface of the refrigerant piping (copper piping) to become corroded and copper ions are eluted in the lubricant oil. The eluted copper ions are precipitated and adhered, in a plating manner, on a portion which becomes high in temperature, such as a sliding portion (which is made of steel or cast iron which has high ionization tendency with respect to copper) of a rotary compressor (copper plating phenomenon).
Progress of the copper plating phenomenon causes a gap in the sliding portion to become smaller and thus sliding friction of the rotary compressor to be increased. In addition, when the copper plating peels off, interposition of the copper plating on the sliding portion is caused and thus abnormal wear of the sliding portion may occur or an expansion valve or the like in a refrigerant circuit may become jammed.
In order to solve the above problems, in the related art, a refrigerating machine is disclosed, in which refrigerant is subjected to compression or expansion such that movement of heat is performed and the refrigerating machine is equipped with a zinc or zinc alloy component that removes infiltrated or produced copper ions in the refrigerant circuit (for example, see PTL 1).
PTL 1: JP-A-5-106941
However, according to a technology in the related art disclosed in PTL 1 above, the copper ions in the refrigerant react chemically with a surface of the zinc or zinc alloy component and then, copper is precipitated on the zinc surface. As a result, molten zinc reacts with the refrigerant (for example, R22 or R410A) and then, zinc halide (for example, zinc chloride) is produced. When a temperature of the surface of the zinc or zinc alloy component exceeds the dissolution temperature of the zinc chloride, the zinc chloride dissolves in the refrigerant circuit even though the dissolution of the zinc chloride depends on refrigerant temperature distribution in the refrigerant circuit. This results in problems in that adhesion of the zinc chloride occurs in the refrigerant circuit which has a refrigerant temperature lower than the dissolution temperature and the cycle is closed.
The present invention is performed by taking the above problems into account and has an object to achieve a rotary compressor in which copper ions in a refrigerant circuit can be removed without producing a reaction product such as zinc chloride.
In order to solve the above problems and to achieve the object, a rotary compressor of the present invention includes: a vertically-positioned airtight compressor housing having an upper section in which a discharge portion of a refrigerant is provided and a lower section in which an inlet unit of the refrigerant is provided and lubricant oil is stored; a compressing unit that is disposed in the lower section of the compressor housing and that compresses the refrigerant sucked in via the inlet unit and discharges the refrigerant from the discharge portion; a motor that is disposed in the upper section of the compressor housing and drives the compressing unit via a rotation shaft; and an accumulator that is attached to a side section of the compressor housing and is connected to the inlet unit of the refrigerant. Inside the accumulator and/or inside the compressor housing, silicon dioxide having a crystal structure which contains a vacancy with a diameter equal to or less than a diameter of a water molecule, or a composite which includes silicon dioxide having a crystal structure which contains a vacancy with a diameter equal to or less than the diameter of the water molecule is placed.
According to the present invention, copper ions are subjected to physisorption into a vacancy with a diameter equal to or less than a diameter of a water molecule, in a crystal structure of silicon dioxide. Hence, the effects that a reaction product such as zinc chloride is not produced, a refrigerant circuit is not closed by the reaction product, and lubricant oil is not decomposed by the reaction product are achieved.
Hereinafter, an example of a rotary compressor according to the present invention will be described in detail based on the drawings. The invention is not limited to the example.
As illustrated in
A stator 111 of the motor 11 is formed in a cylindrical shape and is shrink-fitted and fixed in the inner circumferential surface of the compressor housing 10. A rotor 112 of the motor 11 is disposed inside the cylindrical stator 111 and is shrink-fitted and fixed to the rotation shaft 15 that mechanically connects the motor 11 with the compressing unit 12.
The compressing unit 12 includes a first compressing section 12S and a second compressing section 12T that is disposed in parallel with the first compressing section 12S and is stacked on the first compressing section 12S. As illustrated in
As illustrated in
The first and second vane grooves 128S and 128T are formed over the entire cylinder height of the first and second cylinders 121S and 121T in a radial direction from the first and second cylinder inner walls 123S and 123T. First and second vanes 127S and 127T, each of which has a plate shape, are slidably fit in the first and second vane grooves 128S and 128T.
As illustrated in
When the rotary compressor 1 is started, the first and second vanes 127S and 127T protrude from the inside of the first and second vane grooves 128S and 128T to the inside of the first and second operation chambers 130S and 130T due to bounces of the first and second vane springs and ends of the vanes come into contact with the outer circumferential surfaces of the first and second annular pistons 125S and 125T. This allows the first and second vanes 127S and 127T to partition the first and second operation chambers 130S and 130T into first and second inlet chambers 131S and 131T and first and second compression chambers 133S and 133T.
In addition, the refrigerant gas compressed in the compressor housing 10 is guided into the first and second cylinders 121S and 121T by communicating the deep portion of the first and second vane grooves 128S and 128T with the inside of the compressor housing 10 via an opening R illustrated in
The first and second inlet holes 135S and 135T which cause the first and second inlet chambers 131S and 131T to communicate with the outside are provided in the first and second cylinders 121S and 121T such that a refrigerant is sucked into the first and second inlet chambers 131S and 131T from the outside.
In addition, as illustrated in
A sub-bearing unit 161S is formed on the lower end plate 160S and a sub-shaft unit 151 of the rotation shaft 15 is rotatably supported in the sub-bearing unit 161S. A main-bearing unit 161T is formed on the upper end plate 160T and a main-shaft unit 153 of the rotation shaft 15 is rotatably supported in the main-bearing unit 161T.
The rotation shaft 15 includes a first eccentric portion 152S and a second eccentric portion 152T which are eccentric by a 180° phase shift from each other. The first eccentric portion 152S is rotatably fit in the first annular piston 125S of the first compressing unit 12S. The second eccentric portion 152T is rotatably fit in the second annular piston 125T of the second compressing unit 12T.
When the rotation shaft 15 rotates, the first and second annular pistons 125S and 125T make orbital motions inside the first and second cylinders 121S and 121T along the first and second cylinder inner walls 123S and 123T in a counterclockwise direction in
As illustrated in
The lower muffler chamber 180S is a single annular chamber. The lower muffler chamber 180S is a part of a communication path through which a discharge side of the first compressing unit 12S communicates with the inside of the upper muffler chamber 180T by passing through a refrigerant path 136 (refer to
As illustrated in
The first cylinder 121S, the lower end plate 160S, the lower muffler cover 170S, the second cylinder 121T, the upper end plate 160T, the upper muffler cover 170T, and the intermediate partition plate 140 are integrally fastened using a plurality of penetrating bolts 175 or the like. The outer circumferential portion of the upper end plate 160T of the compressing unit 12 which is integrally fastened using the penetrating bolts 175 or the like is firmly fixed to the compressor housing 10 through spot welding such that the compressing unit 12 is fixed to the compressor housing 10.
First and second through holes 101 and 102 are provided in the outer-side wall of the cylindrical compressor housing 10 at an interval in an axial direction in this order from a lower section thereof so as to communicate with first and second inlet pipes 104 and 105, respectively. In addition, outside the compressor housing 10, an accumulator 25 which is formed of a separate airtight cylindrical container is held by an accumulator holder 252 and an accumulator band 253.
A system connecting pipe 255 which is connected to an evaporator in a refrigeration cycle is connected at the center of the top portion of the accumulator 25. First and second low-pressure communication tubes 31S and 31T, each of which has one end extending toward the upward side inside the accumulator 25, and which have the other ends connected to the other end of each of the first and second inlet pipes 104 and 105, are connected to a bottom through hole 257 provided in the bottom of the accumulator 25.
The first and second low-pressure communication tubes 31S and 31T which guide a low pressure refrigerant in the refrigeration cycle to the first and second compressing units 12S and 12T via the accumulator 25 are connected to the first and second inlet holes 135S and 135T (refer to
A discharge pipe 107 as a discharge portion which is connected to the refrigeration cycle and discharges a high pressure refrigerant gas to a side of a condenser in the refrigeration cycle is connected to the top portion of the compressor housing 10. That is, the first and second outlets 190S and 190T are connected to the condenser in the refrigeration cycle.
Lubricant oil is sealed in the compressor housing 10 substantially to the elevation of the second cylinder 121T. In addition, the lubricant oil is sucked up from a lubricating pipe 16 attached to the lower end portion of the rotation shaft 15, using a pump blade (not illustrated) which is inserted into the lower section of the rotation shaft 15. The lubricant oil circulates through the compressing unit 12, sliding components are lubricated, and the lubricant oil seals a fine gap in the compressing unit 12.
Next, a characteristic configuration of the rotary compressor of the example will be described with reference to
Further, the silicon dioxide 27 having the crystal structure which contains the vacancy with the diameter equal to or less than the diameter of the water molecule, or the composite 27 that includes the silicon dioxide having the crystal structure which contains the vacancy with the diameter equal to or less than the diameter of the water molecule may be placed on and may coat an inner wall surface of the accumulator 25 and/or an inner wall surface of the compressor housing 10.
It is known that eluted copper ions become trapped (adsorbed) into the silicon dioxide. However, the surface contact area acquired only by the silicon dioxide is small and thus, the effect of trapping the copper ions is small. Therefore, the composite 27 that includes the silicon dioxide is placed inside the accumulator 25 and/or inside the compressor housing 10. This causes the eluted copper ions in the lubricant oil to be trapped and thus, it is possible to prevent the sliding portion of the compressing unit 12 from being plated with copper.
Crystalline synthetic zeolites {trade name: molecular sieve: general formula=M2/nO.Al2O3.xSiO2.yH2O (M: metallic cation and n: valence)} which are used as a desiccant that removes water in the refrigeration cycle include the silicon dioxide. However, the synthetic zeolites are the desiccant and thus have large vacancies that are suitable for trapping water. Therefore, when a great amount of water is present in the refrigeration cycle, water is trapped before the copper ions are trapped and it is not possible for the synthetic zeolites to achieve an effect of sufficiently preventing copper plating.
The diameter of the water molecule is about 0.38 nm and a molecular diameter of a copper ion is about 0.128 nm. Therefore, the size (diameter) of the vacancy of the composite 27 including the silicon dioxide is set to a size (for example, 0.3 nm or less) so that water is not trapped. In this manner, it is possible for only the copper ions to be trapped in the vacancy and it is possible to prevent the sliding portion of the compressing unit 12 from being plated with copper.
Particularly, when the silicon dioxide 27 having the crystal structure which contains a vacancy of 0.3 nm or less, or the composite 27 that includes the silicon dioxide having the crystal structure which contains a vacancy of 0.3 nm or less is placed inside the accumulator 25, it is possible to trap copper ions in the refrigerant which has not yet flowed into the compressing unit 12 of the rotary compressor 1 and it is highly effective to prevent the copper plating.
Number | Date | Country | Kind |
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2013-205824 | Sep 2013 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2014/051980 | 1/29/2014 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2015/045432 | 4/2/2015 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5806336 | Sunaga et al. | Sep 1998 | A |
Number | Date | Country |
---|---|---|
1012352 | Oct 2000 | BE |
101265909 | Sep 2008 | CN |
103032331 | Apr 2013 | CN |
H05-106941 | Apr 1993 | JP |
H09-187646 | Jul 1997 | JP |
2001-271774 | Oct 2001 | JP |
2001271774 | Oct 2001 | JP |
2013-011226 | Jan 2013 | JP |
Entry |
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International Search Report dated Apr. 15, 2014, received in related International Application No. PCT/JP2014/051980, filed Jan. 29, 2014 (translation is provided). |
First Office Action dated Aug. 26, 2016, issued in corresponding Chinese Patent Application No. 201480031639.4 with English language translation. |
Extended European Search Report dated Apr. 5, 2017 issued in European Patent Applicatoin No. 14849925.4. |
R. E. Kauffman, “Determine the Mechanism for Copper Plating and Methods for its Elimination from HVAC Systems,” ASHRAE Transactions, Jul. 1, 2008, pp. 360-374. |
Australian Office Action dated Jan. 25, 2017 issued in Australian Patent Application No. 2014325843. |
Number | Date | Country | |
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20160131135 A1 | May 2016 | US |