Wear-resistant, superabrasive compacts are utilized in a variety of mechanical applications. For example, polycrystalline diamond compacts (“PDCs”) are used in drilling tools (e.g., cutting elements, gage trimmers, etc.), machining equipment, bearing apparatuses, wire-drawing machinery, and in other mechanical apparatuses.
PDCs have found particular utility as superabrasive cutting elements in rotary drill bits, such as roller cone drill bits and fixed cutter drill bits. A PDC cutting element typically includes a superabrasive diamond layer that is also known as a diamond table. The diamond table is formed and bonded to a substrate using an ultra-high pressure, ultra-high temperature (“HPHT”) process. The substrate is often brazed or otherwise joined to an attachment member, such as a stud or a cylindrical backing. The substrate is typically made of tungsten or tungsten carbide.
A rotary drill bit typically includes a number of PDC cutting elements affixed to a drill bit body. A stud carrying the PDC may be used as a PDC cutting element when mounted to a bit body of a rotary drill bit by press-fitting, brazing, or otherwise securing the stud into a receptacle formed in the bit body. The PDC cutting element may also be brazed directly into a preformed pocket, socket, or other receptacle formed in the bit body.
Conventional PDCs are normally fabricated by placing a cemented carbide substrate into a container or cartridge with a volume of diamond crystals positioned on a surface of the cemented carbide substrate. A number of such cartridges may be loaded into a HPHT press. The substrates and volume of diamond crystals are then processed under HPHT conditions in the presence of a catalyst material that causes the diamond crystals to bond to one another to form a matrix of bonded diamond crystals defining a diamond table. The catalyst material is often a metal-solvent catalyst, such as cobalt, nickel, iron, or alloys thereof that is used for promoting intergrowth of the diamond crystals.
In one conventional approach, a constituent of the cemented carbide substrate, such as cobalt from a cobalt-cemented tungsten carbide substrate, liquefies and sweeps from a region adjacent to the volume of diamond crystals into interstitial regions between the diamond crystals during the HPHT process. The cobalt acts as a catalyst to promote intergrowth between the diamond crystals, which results in formation of bonded diamond crystals. Often, a solvent catalyst may be mixed with the diamond crystals prior to subjecting the diamond crystals and substrate to the HPHT process.
The solvent catalyst dissolves carbon from the diamond crystals or portions of the diamond crystals that graphitize due to the high temperature being used in the HPHT process. The solubility of the stable diamond phase in the solvent catalyst is lower than that of the metastable graphite under HPHT conditions. The undersaturated graphite tends to dissolve into solvent catalyst and the supersaturated diamond tends to deposit onto and/or between existing diamond crystals to form diamond-to-diamond bonds. Accordingly, diamond crystals become mutually bonded to form a matrix of polycrystalline diamond (“PCD”), with interstitial regions between the bonded diamond crystals being occupied by the solvent catalyst.
The presence of the solvent catalyst in the diamond table is believed to reduce the thermal stability of the diamond table at elevated temperatures. For example, some of the diamond crystals can undergo a chemical breakdown or back-conversion to graphite via interaction with the solvent catalyst. At extremely high temperatures, portions of diamond crystals may transform to carbon monoxide, carbon dioxide, graphite, or combinations thereof, thus, degrading the mechanical properties of the PDC.
One conventional approach for improving the thermal stability of PDCs is to at least partially remove the solvent catalyst from the PDC by acid leaching. However, removing the solvent catalyst from the PDC can be relatively time consuming for high-volume manufacturing.
Embodiments of the invention relate to a superabrasive compact and a rotary drill bit including a heat-absorbing material positioned therein that changes phase during use of the superabrasive compact to absorb heat, thereby limiting temperature excursions and enhancing the thermal stability of the superabrasive compact. In an embodiment, a superabrasive compact includes a superabrasive table bonded to a substrate. The substrate at least partially defines a cavity having a heat-absorbing material positioned therein. The heat-absorbing material has a phase-transition temperature less than about 1000° C.
In another embodiment, a superabrasive compact includes a substrate, a superabrasive table bonded to the substrate, and a heat-absorbing material positioned between the substrate and the superabrasive table. The heat-absorbing material has a phase-transition temperature less than about 1000° C.
In a further embodiment, a rotary drill bit includes a bit body configured to engage a subterranean formation and a plurality of cutting elements affixed to the bit body. At least one of the cutting elements may be configured as any of the superabrasive compacts disclosed herein.
In yet another embodiment, a rotary drill bit includes a bit body configured to engage a subterranean formation and a plurality of cutting elements affixed to the bit body. At least one of the cutting elements includes a substrate and a superabrasive table bonded to the substrate. A heat-absorbing material is positioned within the bit body at least proximate to the at least one cutting element. The heat-absorbing material having a phase-transition temperature less than about 1000° C. In some embodiments, the heat-absorbing mass is positioned between the substrate and the drilling body within a mounting recess sized to receive the substrate.
Features from any of the disclosed embodiments may be used in combination with one another, without limitation. In addition, other features and advantages of the present disclosure will become apparent to those of ordinary skill in the art through consideration of the following detailed description and the accompanying drawings.
The drawings illustrate several embodiments of the invention, wherein identical reference numerals refer to identical elements or features in different views or embodiments shown in the drawings.
Embodiments of the invention relate to a superabrasive compact and a rotary drill bit including a heat-absorbing material positioned therein that changes phase during use of the superabrasive compact to absorb heat, thereby limiting temperature excursions and enhancing the thermal stability of the superabrasive compact. For example, the heat-absorbing material may exhibit a phase-transition temperature (e.g., a state change) less than any of the other constituents of the superabrasive compact.
Referring to
The substrate 14 may be embodied as a cylindrical metallic substrate or other substrate geometry. In some embodiments, the substrate 14 is a cemented carbide substrate formed of a carbide material. For example, the substrate 14 may include, without limitation, cemented carbides, such as tungsten carbide, titanium carbide, chromium carbide, niobium carbide, tantalum carbide, vanadium carbide, or combinations thereof cemented with a metallic cementing constituent, such as iron, nickel, cobalt, or alloys thereof. In an embodiment, the substrate 14 comprises cobalt-cemented tungsten carbide.
Generally, a heat-absorbing material 22 (see
Referring to
In some embodiments, the heat-absorbing material 22 has a phase-transition temperature (e.g., a solid-to-liquid transition temperature (i.e., melting temperature) and/or a liquid-to-gas transition temperature (i.e., vaporization temperature)) within the range of typical operating temperatures of the superabrasive compact 10 when used as a cutting element on a rotary drill bit for drilling a subterranean formation. For example, representative operating temperatures for the superabrasive compact 10 include about 25° C. to 900° C., such as 200° C. to 500° C. or about 250° C. to about 450° C. The foregoing operating temperatures are representative of typical bulk temperatures for the superabrasive compact 10 during cutting operations. The temperature of the cutting tip, edge, or other cutting region of the superabrasive table 12 will be higher than the bulk temperature. The heat of fusion and/or heat of vaporization of the heat-absorbing material 22 enables the superabrasive compact 10 to absorb heat with a reduced increase in temperature due to the endothermic nature of the phase change. For example, the heat-absorbing material 22 melts and/or vaporizes during use of the superabrasive compact 10 to absorb heat that would have increased the temperature of the superabrasive table 12, thereby maintaining the temperature of the superabrasive table 12 at a lower temperature. Consequently, the temperature of the superabrasive table 12 may be maintained at lower temperature than if the heat-absorbing material 22 were absent. Such a configuration may help prevent thermal degradation of the superabrasive table 12.
The upper portion 26 may therefore be sufficiently thick to prevent cracking due to a change in volume of the heat-absorbing material 22 as the heat-absorbing material 22 changes from solid to liquid, or from liquid to gas. Portion 28 of the sides and bottom of the substrate 14 may have a thickness less than the thickness of the upper portion 26 inasmuch as the sides and bottom of the substrate 14 will typically be supported by the body of a drill bit or bearing ring.
Referring to
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In other embodiments, the superabrasive table 12 may be configured as an at least partially leached PCD table that is partially or completely infiltrated with any of the disclosed heat-absorbing materials. For example, an assembly including a layer of the heat-absorbing material may be disposed between the at least partially leached PCD table and a cemented carbide substrate. The assembly may be HPHT processed so that the heat-absorbing material infiltrates and occupies at least a portion of the pores or interstitial regions in the at least partially leached PCD table. A metallic cementing constituent from the cemented carbide substrate may partially infiltrate a region of the at least partially leached PCD table adjacent to the cemented carbide substrate, which bonds the infiltrated PCD table to the cemented carbide substrate. In another embodiment, the assembly includes the at least partially leached PCD table disposed between the layer of the heat-absorbing material and the cemented carbide substrate.
Referring to
The superabrasive compacts disclosed herein may also be utilized in applications other than cutting technology. For example, the disclosed superabrasive compacts embodiments may be used in wire dies, bearings, artificial joints, inserts, cutting elements, and heat sinks. Thus, any of the superabrasive compacts disclosed herein may be employed in an article of manufacture including at least one superabrasive element or superabrasive compact.
The embodiments of superabrasive compacts disclosed herein may be used in any apparatus or structure in which at least one conventional superabrasive compact is typically used. In one embodiment, a rotor and a stator, assembled to form a thrust-bearing apparatus, may each include one or more superabrasive compacts configured according to any of the embodiments disclosed herein and may be operably assembled to a downhole drilling assembly. U.S. Pat. Nos. 4,410,054; 4,560,014; 5,364,192; 5,368,398; and 5,480,233, the disclosure of each of which is incorporated herein, in its entirety, by this reference, disclose subterranean drilling systems within which bearing apparatuses utilizing superabrasive compacts disclosed herein may be incorporated. The embodiments of superabrasive compacts disclosed herein may also form all or part of heat sinks, wire dies, bearing elements, cutting elements, cutting inserts (e.g., on a roller-cone-type drill bit), machining inserts, or any other article of manufacture as known in the art. Other examples of articles of manufacture that may use any of the superabrasive compacts disclosed herein are disclosed in U.S. Pat. Nos. 4,811,801; 4,268,276; 4,468,138; 4,738,322; 4,913,247; 5,016,718; 5,092,687; 5,120,327; 5,135,061; 5,154,245; 5,180,022; 5,460,233; 5,544,713; and 6,793,681, the disclosure of each of which is incorporated herein, in its entirety, by this reference.
Referring to
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Referring generally to the foregoing embodiments of
Examples of suitable heat-absorbing materials include, but are not limited to, salts, hydroxides, nitrates, silicates, metals, alloys, semiconductors, and any combination of the foregoing heat-absorbing materials. For example, the heat-absorbing material may be selected from zinc chloride; potassium chloride; a mixture of 31.9 weight % zinc chloride and 68.1 weight % potassium chloride (melting point of 235° C./heat of fusion of 198 J/g); sodium nitrate (melting point of 310° C./heat of fusion of 173 J/g); lead (melting point of 327.5° C./heat of fusion of 23.02 J/g) or a lead alloy; potassium nitrate (melting point of 330° C./heat of fusion of 266 J/g); zinc (melting point of 419.5° C./heat of fusion of 112 J/g) or a zinc alloy; a solution of 38.5 weight % magnesium chloride and 61.5 weight % sodium chloride (melting point of 435° C./heat of fusion of 328 J/g); aluminum (melting point of 660° C./heat of fusion of 396.9 J/g) or an aluminum alloy; sodium chloride (melting point of 800° C./heat of fusion of 480 J/g); and any combination of the foregoing heat-absorbing materials. Other materials having a melting temperature below a peak operating temperature of the superabrasive compact 10 and a high heat of fusion may also be used. For example, the heat-absorbing material may be chosen based on having a melting temperature or range within the typical operating temperature range for a superabrasive compact and a relatively high heat of fusion. A more detailed list of suitable heat-absorbing materials for use in the embodiments disclosed herein is listed below in Tables I and II below along with some of their physical properties, such as melting temperature (Tm.p.), boiling temperature (Tb.p.), density, heat of fusion (ΔHf), and heat of vaporization (ΔHv).
The amount of temperature decrease achieved by the heat-absorbing material may be approximated using the equation:
where ΔT is the reduction in temperature, MHA is the mass of the heat-absorbing material, LHA is the heat of fusion (or heat of vaporization) of the heat-absorbing material, m is the mass of the superabrasive compact and c is the specific heat of the superabrasive compact 10. This equation assumes that the superabrasive compact and surrounding material in thermal contact therewith can be approximated by a mass m and that the superabrasive compact is perfectly insulated. It is apparent from this equation that an appropriate mass of heat-absorbing material having a large heat of fusion can significantly reduce the temperature of the superabrasive compact 10 for a given thermal input and thereby may prevent or postpone catastrophic failure of the superabrasive table 12 due to elevated temperature damage.
While various aspects and embodiments have been disclosed herein, other aspects and embodiments are contemplated. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting. Additionally, the words “including,” “having,” and variants thereof (e.g., “includes” and “has”) as used herein, including the claims, shall be opened ended and have the same meaning as the word “comprising” and variants thereof (e.g., “comprise” and “comprises”).
This application is a continuation of U.S. patent application Ser. No. 13/102,383 filed on 6 May 2011, which claims priority to U.S. Provisional Application No. 61/333,309 filed on 11 May 2010. The disclosure of each of the foregoing applications is incorporated herein, in its entirety, by this reference.
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Number | Date | Country | |
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61333309 | May 2010 | US |
Number | Date | Country | |
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Parent | 13102383 | May 2011 | US |
Child | 14989185 | US |