Claims
- 1. A polymeric molding composition obtained by polymerizing a monomer mixture comprising from 50 to 83% of a vinylaromatic monomer, from 15 to 30% of an unsaturated dicarboxylic acid anhydride and from 2 to 20% of an unsaturated nitrile, all percentages being by weight, in the presence of from 2 to 30 parts by weight, based on the weight of the polymer composition, of a rubber having a glass transition temperature below 0.degree. C. which composition remains thermoformable after having been exposed to temperatures of 190.degree. C. for 30 minutes and thereafter Brabender compounded at 240.degree. C. for 2 minutes.
- 2. A composition according to claim 1 in which the monomer mixture comprises from 2 to 14% of the unsaturated nitrile and from 20 to 30% of the anhydride.
- 3. A composition according to claim 1 in which the unsaturated nitrile is acrylonitrile.
- 4. A polymeric molding composition obtained by polymerizing a monomer mixture comprising from 56-78% by weight of styrene, from 20 to 30% by weight of maleic anhydride and from 2 to 14% by weight of acrylonitrile in the presence of from 2 to 30% by weight, based on the composition weight of a rubber having a glass transition temperature below -30.degree. C. which composition remains thermoformable after having been exposed to temperatures of 220.degree. C. for an hour and thereafter Brabender compounded for 10 minutes at 240.degree. C.
- 5. A molded article having improved solvent resistance obtained by thermoforming a composition according to claim 1 and maintaining the article at an elevated temperature until such time that it is neither swelled nor dispersed by exposure to boiling methyl ethyl ketone.
- 6. A molded article having improved solvent resistance obtained by thermoforming a composition according to claim 4 and maintaining the article at an elevated temperature until such time that it is neither swelled nor dispersed by exposure to boiling methyl ethyl ketone.
Parent Case Info
This is a division of application Ser. No. 948,122, filed Oct. 2, 1978, now U.S. Pat. No. 4,223,096 application continuation-in-part of application Ser. No. 865,049, filed Dec. 27, 1977, now U.S. Pat. No. 4,197,376.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
3267061 |
Senior, Jr. et al. |
Aug 1966 |
|
3919354 |
Moore et al. |
Nov 1975 |
|
4108925 |
Lee, Jr. |
Aug 1978 |
|
4141934 |
Wingler et al. |
Feb 1979 |
|
Divisions (1)
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Number |
Date |
Country |
Parent |
948122 |
Oct 1978 |
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Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
865049 |
Dec 1977 |
|