Claims
- 1. A perpendicular writer comprising a perpendicular writer pole comprising a nonmagnetic, electrically-conductive, corrosion-resistant seedlayer and a magnetic layer plated upon the seedlayer.
- 2. The perpendicular writer of claim 1 wherein the seedlayer is formed of a material selected from the group consisting of ruthenium, nickel-vanadium, and titanium-tungsten.
- 3. The perpendicular writer of claim 1 wherein the seedlayer has a thickness less than about 0.1 micrometers.
- 4. The perpendicular writer of claim 3 wherein the thickness of the seedlayer is greater than about 0.025 micrometers.
- 5. The perpendicular writer of claim 1 wherein a thickness of the perpendicular writer pole is in a range of about 0.1 micrometers to about 1 micrometer.
- 6. The perpendicular writer of claim 1 wherein a thickness of the perpendicular writer pole is in a range of about 0.1 micrometers to about 0.5 micrometers.
- 7. The perpendicular writer of claim 1 wherein a width-to-thickness aspect ratio of the perpendicular writer pole is in a range of about 0.95 to about 1.05.
- 8. The perpendicular writer of claim 1 wherein an easy axis magnetic coercivity of the magnetic layer is less than about 3 oersteds.
- 9. The perpendicular writer of claim 1 wherein an easy axis magnetic coercivity of the magnetic layer is less than about 1 oersted.
- 10. A perpendicular write head comprising:a main pole having a nonmagnetic, electrically conductive, corrosion-resistant seedlayer and a magnetic layer plated upon the seedlayer; a return pole, the return pole being separated from the main pole by a gap at an air bearing surface of the write head and coupled to the main pole opposite the air bearing surface; and conductive coils positioned at least in part between the main pole and the return pole.
- 11. The perpendicular write head of claim 10 wherein the seedlayer is formed of a material selected from the group consisting of ruthenium, nickel-vanadium, and titanium-tungsten.
- 12. The perpendicular write head of claim 10 wherein the seedlayer has a thickness less than about 0.1 micrometers.
- 13. The perpendicular write head of claim 12 wherein the thickness of the seedlayer is greater than about 0.025 micrometers.
- 14. The perpendicular write head of claim 10 wherein a thickness of the main pole is in a range of about 0.1 micrometers to about 1 micrometer.
- 15. The perpendicular write head of claim 10 wherein a thickness of the main pole is in a range of about 0.1 micrometers to about 0.5 micrometers.
- 16. The perpendicular write head of claim 10 wherein a width-to-thickness aspect ratio of the main pole is in a range of about 0.95 to about 1.05.
- 17. The perpendicular write head of claim 10 wherein an easy axis magnetic coercivity of the magnetic layer is less than about 3 oersteds.
- 18. The perpendicular write head of claim 10 wherein an easy axis magnetic coercivity of the magnetic layer is less than about 1 oersted.
- 19. In a perpendicular write head having a magnetic main pole and a magnetic return pole, wherein the main pole is formed of a seedlayer and a magnetic layer plated upon the seedlayer, and wherein the main pole is separated from the return pole by a gap at an air bearing surface of the write head and is in contact with the return pole opposite the air bearing surface, an improvement comprising forming the seedlayer of a nonmagnetic, electrically-conductive, corrosion-resistant material selected to reduce both an easy axis magnetic coercivity and a hard axis magnetic coercivity of the magnetic layer to less than about 3 oersteds.
- 20. The perpendicular write head of claim 19 wherein the seedlayer is formed of a material selected from the group consisting of ruthenium, nickel-vanadium, and titanium-tungsten.
Priority Claims (1)
Number |
Date |
Country |
Kind |
0207724 |
Apr 2002 |
GB |
|
CROSS-REFERENCE TO RELATED APPLICATION(S)
This application claims the priority benefit of provisional British patent application serial number 0207724.6 of Peter Kevin Mark McGeehin, Alison Mary Bell, and Alan Biggar Johnston, filed on Apr. 3, 2002, entitled “Ruthenium As Non-Magnetic Seedlayer for Electrodeposition”, and which is hereby incorporated by reference in its entirety.
US Referenced Citations (15)