Physical Sciences Inc. will demonstrate a selective anisotropic etching tool for silicon dioxide, using a hypothermal Flourine atom beam based upon its patented Fast Atom Sampler Test (FAST) technology. The energy range of the FAST source enables highly efficient, damage-free etching of SiO2. The anisotropic, low damage capability targeted is very relevant to the Semiconductor Industry Association roadmap, which defines neutral stream processing as a critical technology for etching sub 0.2 ªm features in silicon dioxide in the fabrication of ULSI devices.