SBIR Phase I: Fabrication of Conformal Antennas for Airborne SatCom Using Kinetic Metallization

Information

  • NSF Award
  • 0539253
Owner
  • Award Id
    0539253
  • Award Effective Date
    1/1/2006 - 18 years ago
  • Award Expiration Date
    6/30/2006 - 18 years ago
  • Award Amount
    $ 99,946.00
  • Award Instrument
    Standard Grant

SBIR Phase I: Fabrication of Conformal Antennas for Airborne SatCom Using Kinetic Metallization

This SBIR Phase I proposal will demonstrate a complete approach for net shape or in situ fabrication of multi-layer conformal antennas suitable for airborne satellite communications (SatCom). To satisfy future SatCom requirements for high performance aircraft, broadband apertures for C-band uplink/downlink must be integrated conformal to the aircraft body. Multi-layer micro-strip antenna arrays are a pathway to meeting this need if fabrication methods can be devised to produce robust, multi-layer conductor and<br/>dielectric structures in doubly-curved topologies. Traditional planar antenna structures and materials do not yield gracefully into complex shapes. A viable manufacturing approach must be devised to allow conformal antenna structures to be directly fabricated in the desired net shape. The company has developed and patented a room temperature and pressure, high velocity metal powder coating process known as Kinetic Metallization (KM) that can be employed to prepare ground planes, micro-strip antenna elements, and feed networks on a variety of moldable dielectric substrates in arbitrary 3D geometries. <br/><br/>This will facilitate the design space necessary for devising a new class of broadband conformal airborne SatCom apertures. The broader success for this effort will be a low-cost approach to fabricating arbitrary micro-strip or array antenna configurations for a wide range of frequency bands (UHF through SHF), creating an affordable option for many military and commercial satellite link applications. The low-cost commercialization potential derives from the ability to perform direct pattern printing of low loss conductors on proven dielectric substrates at room temperature and pressure, in a mass assembly facility without the overhead of hazardous materials or processes.

  • Program Officer
    Muralidharan S. Nair
  • Min Amd Letter Date
    11/2/2005 - 19 years ago
  • Max Amd Letter Date
    11/2/2005 - 19 years ago
  • ARRA Amount

Institutions

  • Name
    INNOVATIVE TECHNOLOGY, INC.
  • City
    Santa Barbara
  • State
    CA
  • Country
    United States
  • Address
    1501 Cook Pl
  • Postal Code
    931173123
  • Phone Number
    8055718384

Investigators

  • First Name
    Ralph
  • Last Name
    Tapphorn
  • Email Address
    rtapphorn@inovati.com
  • Start Date
    11/2/2005 12:00:00 AM

FOA Information

  • Name
    Industrial Technology
  • Code
    308000

Program Element

  • Text
    SMALL BUSINESS PHASE I
  • Code
    5371

Program Reference

  • Text
    ADVANCED COMP RESEARCH PROGRAM
  • Code
    4080
  • Text
    HIGH PERFORMANCE COMPUTING SYSTEMS
  • Code
    9215
  • Text
    HIGH PERFORMANCE COMPUTING & COMM