NSF Award
0538736
This Small Business Innovation Research Phase I project will demonstrate the technical and economic feasibility of a novel electrochemical sensor based on the principles of microfluidics and alternating current voltammetry as a powerful tool to monitor the constituents of semiconductor and printed wiring board plating baths. Currently, these industries rely on technologies such as cyclic voltammetry stripping and pulsed cyclic galvanostatic analysis to monitor these species, but both methods have associated drawbacks, such as large required footprint, high operation costs, poor system reliability, reduced system availability, and issues with daily tool-to-tool process stability. The proposed technology is anticipated to circumvent these limitations by utilizing mini sampling probes to collect and electrochemically measure the concentration of plating bath constituents, which results in a highly-selective, cost efficient sensor that is applicable for on-line, real-time monitoring of plating bath composition. <br/><br/>In the semiconductor industry, it is critical to continually enhance technology in order to stay competitive. The proposed technology allows a high value enhancement to copper plating of semiconductors and printed wiring boards. The proposed technology will provide a highly-selective monitoring tool. This will allow semiconductor and printed wiring board manufacturers a higher level of bath control, which will result in a higher quality product and less waste associated with the actual semiconductors and PWBs.
