NSF Award
0741024
This Small Business Innovation research Phase I project will demonstrate the feasibility of producing low k dielectrics with a nanoporous and nanolaminated structure. The project will demonstrate the feasibility of deposition of low-k porous silica and flourosilicate stacks, using atmospheric-pressure thermal plasma treatment of nanoscale silica powders to produce the film precursors.<br/><br/>Successful development of low k dielectrics will enable continued evolution of integrated circuits for higher performance. The deposition technology developed will permit processes that support both superior film performance and very high throughput.
