Sensys Instruments Corp. will develop innovative acoustic sensor and model-based multivariable control technology to measure and control wafer temperature and film thickness in Physical Vapor Deposition (PVD) processes, a key technology used in semiconductor device wafer fabrication. There are currently no commercially available sensors that can provide real-time measurements of wafer temperature and thickness in PVD processes. This project will create an integrated package of sensor hardware, signal processing software and control software, adapted for PVD equipment.