9860186<br/> This Small Business Innovation Research Phase I will develop a whole wafer sensor for in situ measurements of temperature, emissivity and film stack properties, from a model-based analysis of thermal radiance images. Exploiting commercial infrared imaging hardware, the proposed compact system will provide high performance measurement capability from a single small infrared window with optical access to the wafer surface. Temperature monitoring has been identified as an important hurdle blocking future process enhancements in semiconductor manufacturing. Improved in situ diagnostics for substrate temperature, emissivity and film properties will incur many benefits inclunding improved quality and to optimize process process efficiency, reduced scrap and cost and reduced time parameters.