SBIR Phase II: Graphene Conductive Inks for Flexible Printed Electronics

Information

  • NSF Award
  • 1152700
Owner
  • Award Id
    1152700
  • Award Effective Date
    4/1/2012 - 12 years ago
  • Award Expiration Date
    3/31/2014 - 10 years ago
  • Award Amount
    $ 598,567.00
  • Award Instrument
    Standard Grant

SBIR Phase II: Graphene Conductive Inks for Flexible Printed Electronics

This Small Business Innovation Research (SBIR) Phase II project aims to develop high-performance graphene-based conductive inks for printed electronics to meet its stringent cost, flexibility, and conductivity requirements. Components printed with existing conductive inks are challenged by repeated flexing cycles that can break conductive paths. In this project, a graphene filler technology and a novel formulation will be used to achieve the combination of electrical, mechanical, and environmental durability properties specified for the flexible printed electronics at a price point that enables high-volume applications. <br/><br/>The broader/commercial impact of this project will be the availability of a conductive ink that meets performance requirements of next-generation printed electronics. The printed electronics market is growing across multiple sectors driven by applications including radio-frequency identification (RFID) tags for tracking inventory, smart packaging for anti-theft and anti-tampering purposes, smart cards and printed displays. Conductive inks are a critical component in printed electronics, and limitations of existing conductive inks have curtailed market growth. The new graphene-based conductive inks are expected to demonstrate flexibility and mechanical robustness that improves lifetime and performance of printed electronics, while providing significant cost advantage over silver-based inks currently widely used in printed electronics industry.

  • Program Officer
    Rajesh Mehta
  • Min Amd Letter Date
    3/29/2012 - 12 years ago
  • Max Amd Letter Date
    2/21/2014 - 10 years ago
  • ARRA Amount

Institutions

  • Name
    Vorbeck Materials Corp
  • City
    Jessup
  • State
    MD
  • Country
    United States
  • Address
    8306 Patuxent Range Road
  • Postal Code
    207948609
  • Phone Number
    3014979000

Investigators

  • First Name
    Christy
  • Last Name
    Martin
  • Email Address
    christy.martin@vorbeck.com
  • Start Date
    3/29/2012 12:00:00 AM
  • End Date
    08/29/2013
  • First Name
    Dan
  • Last Name
    Scheffer
  • Email Address
    dan.scheffer@vorbeck.com
  • Start Date
    8/29/2013 12:00:00 AM