NSF Award
0131791
This Small Business Innovation Research Phase II Project will establish market demand for a novel electrically mediated leveling technology and position the technology for market launch via a joint venture. The specific Phase II objectives are: 1. Scale-up and demonstration of the electrically mediated process on eight inch wafers, 2. Development of a process library for feature sizes 1-5 down to 0.17 microns, and lower, and 3. Design of a "proof of concept" plating tool. Preliminary concept design of a plating tool incorporating the electrically mediated process will be performed by an outside firm. <br/> The sustainable competitive advantage associated with the project for leveling is cost. Minimal overplate will eliminate or minimize the need for chemical/mechanical planarization (CMP) by reducing the copper waste slurry compared to the state-of-the-art copper metallization processes. This in turn would eliminate the associated control, environmental, and cost issues.
