Scattered ray absorption grid

Information

  • Patent Grant
  • 6415017
  • Patent Number
    6,415,017
  • Date Filed
    Friday, September 28, 2001
    23 years ago
  • Date Issued
    Tuesday, July 2, 2002
    22 years ago
Abstract
A scattered ray absorption grid enhancing a scattered ray absorption property without increasing costs is provided. A grid portion of the scattered ray absorption grid is constituted by use of plate members obtained in such a manner that a powder containing tungsten 50% by weight or more is hardened with a binder so that the powder has a spatial filling rate of 40% or more.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a scattered ray absorption grid, more particularly to a scattered ray absorption grid having a plurality of plate members for constituting a grid formed by use of powders made of a radiation absorption material.




2. Description of the Related Art




A scattered ray absorption grid has been heretofore known, which is disposed between a subject for photography and a radiation detector and obtains radiation with a high S/N ratio by absorbing a scattered ray scattered by the subject for photography when an image is photographed by a radiographic imaging device.




This scattered ray absorption grid is constituted by arranging a plurality of plate members at intervals, which constitutes a grid portion. Each of the plate members for constituting a grid is formed by a slender and thin plate made of a material absorbing radiation. The scattered ray absorption grid absorbs radiation which is scattered by the subject for photography and travels obliquely, and effectively transmits only radiation from a radiation source which is made to be incident directly onto the radiation detector through the subject for photography. Thus, noise due to the detected scattered radiation mixed into an image of the subject for photography are reduced.




A high radiation absorption property is required for the plate members constituting the grid portion. In other words, a material having a high density must be used for the plate members, and generally a material obtained by processing lead to a thin plate shape is used.




SUMMARY OF THE INVENTION




As such a material for the plate members for constituting a grid having a high density, tantalum (Ta) and tungsten (w) are preferable from the viewpoint of the radiation absorption property, and it is known that tungsten (W) has a particularly excellent radiation absorption property.




However, tungsten has a high degree of hardness and an extremely high melting point, and is difficult to process. Accordingly, it is difficult to process tungsten to a slender and thin plate member for the grid, and said processing, if performed, would be quite high in cost.




The present invention was made in consideration of the foregoing circumstances. The object of the present invention is to provide a scattered ray absorption grid which is low in cost and has excellent scattered ray absorption property.




A scattered ray absorption grid of the present invention is composed of a grid portion constituted by use of plate members formed in such a manner that powders containing tungsten 50% by weight or more are hardened with binder so that the powders show a spatial filling rate of 40% or more, more preferably 60% or more. Alternatively, the scattered ray absorption grid of the present invention is composed of a grid portion constituted by use of plate members formed in such a manner that, grid materials formed by hardening powders containing tungsten 50% by weight or more with binder so that the powders show a spatial filling rate of 40% or more, more preferably 60% or more, are arranged on a substrate.




Furthermore, the foregoing powder containing tungsten 50% by weight or more means the one containing tungsten 50% by weight or more regardless of an existence state of tungsten such as tungsten compound including tungsten alloy, and tungsten mixture in which tungsten and other substances are physically mixed. Specifically, for example, even powder formed of only calcium tungstate CaWO


4


that is tungsten compound is included in the foregoing powder containing tungsten 50% by weight or more because this powder contains tungsten W 50% by weight or more. The foregoing powder containing tungsten 50% by weight or more includes powder formed of an alloy containing tungsten and other metals, for example, an alloy formed of tungsten W and lead Pb, if this powder contains tungsten 50% by weight or more. Furthermore, if powder formed of pure tungsten W and substance containing no tungsten contains tungsten 50% by weight or more, this powder is included in the foregoing powder containing tungsten 50% by weight or more, as a matter of course. In addition, if powder formed of tungsten compound, pure tungsten and substance containing no tungsten contains tungsten W 50% by weight or more, this powder is included in the foregoing powder containing tungsten 50% by weight or more.




As the tungsten compound, besides the foregoing calcium tungstate CaWO


4


, enumerated are, for example, iron tungstate FeWO


4


, lithium tungstate LiWO


4


, magnesium tungstate MgWO


4


, barium tungstate BaWO


4


, sodium tungstate Na


2


WO


4


, nickel tungstate NiWO


4


, lead tungstate PbWO


4


, tungsten boride W


2


B, WB and W


2


B


5


, tungsten carbide WC and W


2


C, tungsten oxide WO, W


2


O


3


, WO


2


and W


2


O


5


, tungsten sulfide WS


2


and WS


3


, tungsten silicide WSi


2


, WSi


3


and W


2


Si


3


and the like. As other metals forming the alloy together with the foregoing tungsten, enumerated are, for example, Co, Pt, Ni, Fe, Mo, Cr, Fe, Ti and the like in addition to the foregoing lead.




The foregoing binder should be an organic binder or a metal with a melting point less than the melting point of tungsten.




Furthermore, the binder, in the case that a body is formed by use of powder and the like as a main raw material, refers to a substance blended into the powder to maintain a shape of the body and to enhance the structural integrity thereof.




The aforementioned metal refers to those including alloys, and a metal showing a high density and an excellent radiation absorption property should be employed.




As the organic binder, for example, resin materials should be used so that particles constituting the powder are bound and the powder can maintain a stable shape.




It is not always necessary that the particles constituting the powder contain tungsten at a constant rate. Therefore, each of the particles can contain a different amount of tungsten as long as the powders as a whole contain a predetermined amount of tungsten.




A slender and thin plate extending in one direction should be used as the plate member for constituting a grid.




The inventor of the present invention made various investigations concerning the radiation absorption property of the plate member for constituting a grid, which was formed by hardening tungsten powder with a binder. As a result of these investigations, the inventor learned that a plate member for constituting a grid that shows an excellent radiation absorption property could be obtained when the amount of tungsten contained in the powder is set to 50% by weight or more and when a spatial filling rate in constituting the plate member by use of the powder is set to 40% or more, more preferably 60% or more. Based on this knowledge, the inventor arrived at the present invention.




According to the scattered ray absorption grid of the present invention, the grid portion is constituted by use of plate members formed by hardening powder made of tungsten, which is relatively low in cost and has an excellent radiation absorption property, with a binder, or alternatively the grid portion is constituted by use of plate members formed in such a manner that grid materials obtained by hardening the tungsten powders with the binder are arranged on a substrate. Therefore, the processing of the plate members for constituting a grid is very easy, and a productivity of the grid portion made of tungsten is enhanced. Accordingly, the scattered ray absorption grid can be obtained at low cost.




If an organic binder is used as the binder, it is possible to form the plate members for constituting a grid more easily, for example, by kneading the tungsten powders into a binder which was melted at a relatively low temperature and by molding the mixture of the tungsten powders and the binder. Accordingly, costs of the scattered ray absorption grid can be further reduced.




In the case where a metal having a melting point less than the melting point of tungsten is used as the binder, if lead which has an excellent radiation absorption property is, for example, used as the binder, the radiation absorption property of the plate members for constituting a grid obtained by hardening the tungsten powders with the binder can be further enhanced.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a drawing showing a schematic constitution of a scattered ray absorption grid of an embodiment of the present invention.





FIG. 2

is a drawing showing a schematic constitution of a plate member for constituting a grid of the scattered absorption grid of the first embodiment.





FIG. 3

is a drawing showing a state where the plate member for constituting a grid is molded in a molding machine.





FIG. 4

is a drawing showing a mold product molded.





FIG. 5

is a drawing showing a schematic constitution of a plate member for constituting a grid of the scattered ray absorption grid of a second embodiment of the present invention.





FIG. 6

is a drawing showing a schematic constitution of a plate member for constituting a grid of the scattered ray absorption grid of a third embodiment of the present invention.





FIG. 7

is a drawing showing a state where the plate member for constituting a grid is molded by a pushing-out machine.





FIG. 8

is a section view showing a schematic constitution of a first original sheet for a plate member of a fourth embodiment.





FIG. 9

is a perspective view showing a schematic constitution of a calendar roll used in a fifth embodiment.





FIG. 10

is a section view showing a schematic constitution of a second original sheet for a plate member.





FIG. 11

is a section view showing a schematic constitution of a third original sheet for a plate member of a sixth embodiment.





FIG. 12

is a perspective view showing a lamination block body.





FIG. 13

is a perspective view of a lamination cut body obtained by slicing the lamination block body.





FIG. 14

is a drawing showing a state where the lamination cut body is held by sandwiching the lamination cut body between a concave block and a convex block.





FIG. 15

is a drawing showing a scattered ray absorption grid of a sixth embodiment of the present invention.





FIG. 16

is a section view showing a schematic view of a fourth plate member for constituting a grid of a seventh embodiment.





FIG. 17

is a perspective view of a rectangular material for constituting a grid.





FIG. 18

is a perspective view of a rectangular block body for constituting a grid.





FIG. 19

is a perspective view of a scattered ray absorption grid of the seventh embodiment.





FIG. 20

is a section view showing a schematic constitution of a fifth original sheet for a plate member of an eighth embodiment.





FIG. 21

is a section view showing a schematic constitution of a sixth original sheet for a plate member of a ninth embodiment.





FIG. 22

is a perspective view showing a schematic constitution of a calendar roll used in a tenth embodiment.





FIG. 23

is a conceptional view showing difference between filling densities of tungsten.











DESCRIPTION OF THE PREFERRED EMBODIMENTS




Embodiments of a scattered ray absorption grid of the present invention will be described hereunder with reference to the accompanying drawings.





FIG. 1

is a drawing showing a schematic constitution of the scattered ray absorption grid common to first to tenth embodiments of the present invention.




<First Embodiment>





FIG. 2

is a section view showing a schematic constitution of one of plate members for constituting the scattered ray absorption grid of the first embodiment.




The scattered ray absorption grid


10


of the first embodiment is composed of a grid portion


14


(see

FIG. 1

) constituted by a plurality of plate members


13


, which are formed by hardening powder


11


containing tungsten 50% by weight with binder


12


so as to have a spatial filling rate of40%. Each of the plate members for constituting a grid is manufactured by the following manufacturing steps in which tungsten and a polymer resin that is an organic binder (binder) are thermally kneaded, injected into a mold, and then cooled.




First, 250 grams of thermoplastic polyurethane resin, which is an organic binder of pellet shape that has a melting point of 120° C., was mixed into 5 kg of tungsten powder which have an average particle diameter of 7μ and contains tungsten 50% by weight. The mixture was dried at 110° C. for three hours and dehydrated.




Next, as shown in

FIG. 3

, the mixture


29


made of the pellet-shaped polyurethane resin and the tungsten powder was placed in a hopper


21


of a molding machine


20


and heated to 180° C. in a barrel


22


of the molding machine


20


to be fluidized. Then, the mixture was kneaded by a rotation of a screw


23


.




Thereafter, the mixture made of the polyurethane resin and the tungsten powder that was fluidized in the barrel


22


was injected into a mold


24


for a grid.




Then, the mixture made of the polyurethane resin and the tungsten powder injected into the mold


24


for a grid was cooled, and a mold product


25


as shown in

FIG. 4

was taken out of the mold


24


for a grid. A spool


26


and a runner


27


were removed from the mold product


25


, and one of slender and thin plate-shaped plate members


13


for constituting a grid having a thickness of 0.1 mm, a width of 10 mm, and a length of 440 mm was obtained, in which the tungsten powders were hardened with the polyurethane resin so as to have a spatial filling rate of 40%.




Thereafter, the scattered ray absorption grid


10


was assembled using these plate members


13


, and a good scattered ray absorption property was obtained.




<Second Embodiment>





FIG. 5

is a sectional view showing a schematic constitution of one of the plate members of which the scattered ray absorption grid of a second embodiment of the present invention is constituted.

FIG. 1

shows a schematic constitution of the scattered ray absorption grid


30


of the second embodiment which is constituted by use of a plurality of plate members.




The scattered ray absorption grid


30


according to the second embodiment comprises a grid portion


36


(see

FIG. 1

) which is constituted by use of a plurality of plate members


35


. Each of the plate members


35


for constituting a grid is constituted by arranging, on a substrate


34


, a tungsten layer


33


formed by hardening a powder containing tungsten 50% by weight with a binder


32


so that the powder acquires a spatial filling rate of 40%. The plate member


35


is manufactured by the following manufacturing steps in which tungsten powder is dispersed in a solution obtained by allowing a polymer resin, which is an organic binder (binder), to dissolve into an organic solvent, and then this tungsten powder solution is coated on a polymer film to be a substrate and dried.




First, 150 grams of an unsaturated polyester resin (Byron 300 made by Toyobo Co. Ltd.), which is an organic binder, was added to 5 kg of tungsten powder, which have an average particle diameter of 7μ and contain tungsten 50% by weight.




Next, methyl ethyl ketone was added to the tungsten powder solution while agitating the tungsten powder solution by a propeller mixer, and an adjustment was made so that the solution had a viscosity of 20 poise.




Thereafter, the tungsten powder solution was coated on polyethylene A terephthalate (PET) resin of a film state having a thickness of 20μ, which is a substrate, and the tungsten powder solution coated on the PET resin substrate


34


was dried.




Then, each of the plate members


35


for constituting a grid was obtained in such a manner that on the first layer made of the film-shaped PET resin substrate


34


, the tungsten layer


33


that is a second layer material obtained by hardening tungsten powder with an unsaturated polyester resin so that the tungsten powder shows a spatial filling rate of 40% was laminated, thus obtaining a thin plane having a thickness of 0.1 mm. And, a slender plate member having a width of 10 mm and a length of 440 mm was cut out from said plane.




Thereafter, when the scattered ray absorption grid


30


was assembled by use of the plurality of plate members


35


for constituting a grid, a good scattered ray absorption property was obtained.




<Third Embodiment>





FIG. 6

is a sectional view showing a schematic constitution of one of the plate members for constituting a grid by which the scattered ray absorption grid of a third embodiment of the present invention is constituted.

FIG. 1

shows a schematic constitution of the scattered ray absorption grid


40


of the third embodiment which is constituted by use of a plurality of plate members.




The scattered ray absorption grid


40


according the third embodiment is composed of a grid portion


44


(see

FIG. 1

) constituted by use of a plurality of plate members


43


, which are formed by hardening tungsten powder


41


containing tungsten 60% by weight with a binder


42


so as to show a spatial filling rate of 50%. Each of the plate members


43


for constituting a grid is manufactured by the following manufacturing steps in which tungsten powder


41


and lead solder (an alloy with lead and tin as main constituents) which acts as a binder are thermally kneaded, and extruded through a thin rectangular slit, thus obtaining each of the plate members for constituting a grid.




First, 1700 grams of lead solder was mixed into 5 kg of tungsten powder. The tungsten powder have an average particle diameter of 7μ and contain tungsten 60% by weight; and the lead solder is particle-shaped binder having a melting point of 220


20


C. which is less than that of tungsten.




Next, as shown in

FIG. 7

, the mixture


59


described above was placed in a hopper


51


of an extrusion machine


50


and heated to 250° C. in a barrel


52


to be fluidized. Then, the mixture was kneaded by a screw


53


.




Thereafter, the mixture of the lead solder and the tungsten powders in the barrel


52


, which was fluidized, was continuously extruded onto a stainless steel plate


55


from a thin rectangular slit


54


having a width of about 0.1 mm.




The mixture


59


′ of the lead solder and the tungsten powder which had been extruded onto the stainless steel plate


55


was then cooled, and a slender plate material having a width of 10 mm and a length of 440 mm was cut out from a thin plane having a thickness of 0.1 mm. Thus, each of the plate members


43


for constituting a grid was obtained.




Thereafter, when the scattered ray absorption grid


40


was assembled by use of the plurality of plate members


43


for constituting a grid, a good scattered ray absorption property was obtained.




<Fourth Embodiment>





FIG. 8

is a section view showing a schematic constitution of a first original sheet for a plate member, which constitutes a scattered ray absorption grid of a fourth embodiment of the present invention. A schematic constitution of the scattered ray absorption grid of the fourth embodiment of the present invention is shown in

FIG. 1

, which is constituted by use of the plate members for constituting a grid, which are cut out from the first original sheet for the plate member. Note that, the original sheet for the plate member means a material before being cut out from the original sheet to a predetermined shape as the plate member for constituting a grid.




While agitating solution with a propeller mixer, in which polyurethane resin of 130 g that is an organic polymer binder was added to powder of 5 kg formed of tungsten showing a purity of 99%, which has an average particle size of 5 μm, an adjustment was made so that tungsten powder solution shows a viscosity of 20 P by adding methyl ethyl ketone to this substance.




Thereafter, this tungsten powder solution was coated on a film-shaped PET resin substrate


51


having a thickness of 180 μm, which is made of polyethylene terephthalate (PET) resin and serves as a substrate. The tungsten powder solution coated on the PET resin substrate


51


was dried, thus forming a tungsten layer


52


of a thickness of 100 μm, which shows a spatial filling rate of 62%. Thus, the first original sheet


53


for the plate member was obtained (see FIG.


8


).




Thereafter, by cutting out a slender plate member from this first original sheet


53


for the plate member, which has a width of 10 mm and a length of 440 mm, a plate member


54


for constituting a grid was obtained (see FIG.


1


), and a scattered ray absorption grid


50


was assembled by use of many of the plate members


54


for constituting a grid. Thus, a good scattered ray absorption property was obtained.




<Fifth Embodiment>





FIG. 9

is a perspective view showing a schematic constitution of a calendar roll used for manufacturing a second original sheet for a plate member, which constitutes a scattered ray absorption grid of a fifth embodiment of the present invention.

FIG. 10

is a section view showing a schematic constitution of the second original sheet for the plate member. A schematic constitution of the scattered ray absorption grid of the fifth embodiment of the present invention is shown in

FIG. 1

, which is constituted by use of the plate members for constituting a grid, which are cut out from the second original sheet for the plate member.




As shown in

FIG. 9

, the first original sheet


53


for the plate member manufactured by the same steps as those in the fourth embodiment was allowed to pass through a calendar roll


65


comprising a thermal compression rolls


65


A and


65


B, whereby the first original sheet


53


for the plate member was thermally compressed at temperature of 70° C. and at pressure of 50 MPa. Thus, the second original sheet


63


for the plate member (see

FIG. 10

) was obtained, in which a tungsten layer


62


of a thickness of 90 μm showing a spatial filling rate of 70% was laminated on a PET resin substrate


61


.




Thereafter, a plate member


64


for constituting a grid was obtained by cutting out a slender plate member from the second original sheet


63


for the plate member, which has a width of 10 mm and a length of 440 mm. A scattered ray absorption grid


60


was assembled by use of many of the plate members


64


for constituting a grid. A good scattered ray absorption property was obtained.




<Sixth Embodiment>





FIG. 11

is a section view showing a schematic constitution of a third original sheet for a plate member, which constitutes a scattered ray absorption grid of a sixth embodiment of the present invention.

FIG. 12

is a perspective view showing a lamination block body formed by laminating the plurality of third original sheets for the plate member so as to be superposed upon another.

FIG. 13

is a perspective view showing a state where the lamination block body is sliced thus acquiring a lamination cut body.

FIG. 14

is a drawing showing a state where the lamination cut body is sandwiched between a convex block and a concave block, thus holding the lamination cut body therebetween.

FIG. 15

is a drawing showing the scattered ray absorption grid of the sixth embodiment of the present invention.




First, as shown in

FIG. 11

, a line-shaped adhering layer


64


made of polyester resin was coated by a thickness of 10 μm on the PET resin substrate


61


opposite to the tungsten layer


62


of the original sheet


63


for the plate member, which was obtained in the fifth embodiment. Thus, an original sheet


65


for a plate member was formed.




Next, as shown in

FIG. 12

, the foregoing original sheet


65


for the plate member and a resin spacer


65


′ having the same shape as that of the original sheet


65


and a different thickness from that of the original sheet


65


were alternately superposed upon another in plural number. A lamination body formed in such a manner was kept in atmosphere at temperature of 90° C. and at pressure of 20 MPa for 50 minutes, and then cooled, thus forming a lamination block body


66


.




Next, as shown in

FIG. 13

, this lamination block body


66


is sliced by use of a band saw to a width of 5 mm, and a cross section of the lamination block body


66


cut by the band saw was polished. Thus, a lamination cut body


67


was obtained.




Next, as shown in

FIG. 14

, this lamination cut body


67


was sandwiched between a semicylindrical convex block


68


made of aluminum and a concave block


68


′ having a shape obtained by transferring the semicylindrical shape thereto, and kept in atmosphere of temperature of 90° C. for 50 minutes, followed by cooling. Then, the lamination cut body


67


was taken out therefrom.




Thus, a scattered ray absorption grid


69


having a radius of curvature of 1.8 m in which a center of curvature of an arc-shaped curved surface converges on the straight line L


1


as shown in

FIG. 15

was obtained, and this scattered ray absorption grid


69


showed a good scattered ray absorption property.




<Seventh Embodiment>





FIG. 16

is a section view showing a schematic constitution of a fourth plate member for constituting a grid, which constitutes a scattered ray absorption grid of a seventh embodiment of the present invention.

FIG. 17

is a perspective view of a rectangular material for constituting a grid obtained by cutting the fourth plate member for constituting a grid.

FIG. 18

is a perspective view of a rectangular block body for constituting a grid, which is formed by arranging the rectangular materials for constituting a grid and adhering them to each other.

FIG. 19

is a perspective view of the scattered ray absorption grid of the seventh embodiment of the present invention, which is formed by adhering a top plate and a lower plate to the rectangular block body for constituting a grid.




First, as shown in

FIG. 16

, line-shaped polyester resin was coated on the PET resin substrate


51


opposite to the tungsten layer


52


of the first original sheet


53


for the plate member manufactured by the same steps as those in the fourth embodiment, thus laminating a line-shaped polyester resin adhering layer


71


of a thickness of 40 μm thereon. Thus, a fourth original sheet


72


for a plate member was prepared.




This fourth original sheet


72


for the plate member was cut to be a rectangular shape having a width of 5 mm, thus obtaining a rectangular material


73


for constituting a grid as shown in FIG.


17


. The rectangular material


73


for constituting a grid and a resin spacer


73


′ having the same shape as that of the material


73


and a different thickness from that of the material


73


were alternately arranged and sequentially adhered to each other so that directions of rectangular surfaces of the materials


73


having a width of 5 mm converge on the straight line L


2


apart from the materials


73


by 1.8 m as shown in FIG.


18


. Thus, a rectangular block body


74


for constituting a grid was formed. Note that, when the rectangular material


73


and the resin spacer


73


′ were adhered, each rectangular material


73


and each resin spacer


73


′ were made to be inclined so as to converge on the line L


2


by allowing an adhering layer of a thickness of 40 μm to flow, and fixedly adhere to each other.




Next, a top plate


75


and a lower plate


76


which have a thickness of 0.3 mm were adhered respectively to a converging side and a diverging side of the rectangular material


73


for constituting a grid which constitutes the foregoing rectangular block body


74


for constituting a grid.




Thus, a scattered ray absorption grid


70


as shown in

FIG. 19

was obtained, in which each of the rectangular materials


73


is arranged so as to converge toward the line L


2


apart therefrom by 1.8 m. This scattered ray absorption grid


70


showed a good scattered ray absorption property.




<Eighth Embodiment>





FIG. 20

is a section view showing a schematic constitution of a fifth original sheet for a plate member, which constitutes a scattered ray absorption grid of an eighth embodiment of the present invention. In

FIG. 1

, shown is a schematic constitution of the scattered ray absorption grid of the eighth embodiment of the present invention, which is constituted by use of plate members for constituting a grid, which are cut out from the fifth original sheet for the plate member.




While agitating solution obtained by adding polyurethane resin of 130 g to powder of 5 kg formed of tungsten carbide WC having an average particle size of 4 μm with a propeller mixer, methyl ethyl ketone was added to this substance, and a viscosity of the tungsten carbide powder solution was adjusted so as to be 20 P. The tungsten carbide is tungsten compound having a purity of 99%, and the polyurethane resin is an organic high polymer binder.




Thereafter, this tungsten carbide powder solution was coated on a film-shaped PET resin substrate


81


made of polyethylene terephthalate (PET) resin. The PET resin substrate


81


is a substrate having a thickness of 180 μm. The tungsten carbide powder solution coated on this PET resin substrate


81


was dried, thus forming a tungsten carbide layer


82


which has a spatial filling rate of 60% and a thickness of 150 μm. Thus, the fifth original sheet


83


for the plate member as shown in

FIG. 20

was obtained.




Thereafter, a slender plate material having a width of 10 mm and a thickness of 440 mm was cut out from the fifth original sheet


83


for the plate member, whereby a plate member


84


for constituting a grid was obtained. A scattered ray absorption grid


80


was assembled by use of many of the plate members


84


, and a good scattered ray absorption property was obtained.




<Ninth Embodiment>





FIG. 21

is a section view showing a schematic constitution of a sixth original sheet for a plate member which constitutes a scattered ray absorption grid of a ninth embodiment of the present invention. Furthermore, in

FIG. 1

, shown is the scattered ray absorption grid of the ninth embodiment of the present invention, which is constituted by use of plate members for constituting a grid cut out from the sixth original sheet for the plate member.




While agitating tungsten powder solution obtained by adding polyurethane resin of 80 g to powder with a propeller mixer, methyl ethyl ketone was added to this solution. The tungsten powder solution was prepared in such a manner that polyurethane resin, as an organic high polymer binder, of 80 g was added to powder obtained by mixing powder of 3.5 kg formed of tungsten having an average particle size of 5 μm and a purity of 99% with powder of 1.5 kg formed of tungsten having an average particle size of 1.5 μm and a purity of 99%. By the addition of the methyl ethyl ketone to the above tungsten powder solution, its viscosity was adjusted so as to be 20 P.




Thereafter, this tungsten powder solution was coated on a film-shaped PET resin substrate


91


having a thickness of 180 μm, which is made of polyethylene terephthalate (PET) resin and serves as a substrate. The tungsten powder solution coated on the PET resin substrate


51


was dried, thus forming a tungsten layer


92


of a thickness of 100 μm, which shows a spatial filling rate of 66%. Thus, the sixth original sheet


93


for the plate member was obtained (see FIG.


21


).




Then, a slender plate material having a width of 10 mm and a thickness of 440 mm was cut out from the sixth original sheet


93


for the plate member, whereby a plate member


94


for constituting a grid was obtained. A scattered ray absorption grid


90


(see

FIG. 1

) was assembled by use of many of the plate members


94


, and a good scattered ray absorption property was obtained.




<Tenth Embodiment>





FIG. 22

is a perspective view showing a schematic constitution of a calendar roll used for manufacturing a seventh original sheet for a plate member, which constitutes a scattered ray absorption grid of a tenth embodiment of the present invention.

FIG. 23

is a conceptional view showing a state where a filling density of tungsten in the seventh original sheet for the plate member is increased. A schematic constitution of the scattered ray absorption grid of the tenth embodiment of the present invention is shown in

FIG. 1

, which is constituted by use of the plate members for constituting a grid, which are cut out from the seventh original sheet for the plate member.




As shown in

FIG. 22

, the sixth original sheet


93


for the plate member manufactured by the same steps as those in the ninth embodiment was allowed to pass through a calendar roll


65


comprising a thermal compression rolls


65


A and


65


B, whereby the original sheet


93


was thermally compressed at temperature of 70° C. and at pressure of 50 MPa. Thus, the seventh original sheet


96


for the plate member, which has a tungsten layer


95


of a thickness of 92 μm showing a spatial filling rate of 72%, was obtained. As shown in

FIG. 23

, in the seventh original sheet


96


for the plate member, small particles S that are powders formed of tungsten having an average particle size of 1.5 μm enter between large particles B that are powders formed of tungsten having an average particle size of 5 μm, and the small particles S fill spatially between the large particles B effectively. Accordingly, it is possible to further increase the filling density of the tungsten in the tungsten layer


95


of the seventh original sheet


96


for the plate member compared to the tungsten layer


92


of the sixth original sheet


93


for the plate member.




Thereafter, a plate member


97


for constituting a grid was obtained by cutting out a slender plate member from the seventh original sheet


96


for the plate member, which has a width of 10 mm and a length of 440 mm. A scattered ray absorption grid


98


was assembled by use of many of the plate members


97


. A good scattered ray absorption property was obtained.




In each of the foregoing embodiments, though the content of the tungsten in the powder and the spatial filling rate of the powder in the plate member formed by said powder are shown by numerical values, the content and the spatial filling rate are not limited to this range. When the scattered ray absorption grid is constituted either by use of the plate members for constituting a grid obtained by hardening the powder containing tungsten 50% by weight or more with the binder so that the powders show the spatial filling rate of 40% or more, or by use of the plate members obtained in such a manner that the powder containing tungsten 50% by weight or more are hardened with the binder so that the powders show the spatial filling rate of 40% or more, a good scattered ray absorption property is obtained similarly to the foregoing embodiments.




Furthermore, the spacer filled between the plate members for constituting a grid (


13


,


35


,


43


,


54


,


64


,


84


,


94


and


97


in FIG.


1


), which constitute the scattered ray absorption grid in the foregoing embodiments, should be the one which shows lessened X-ray absorption. For example, aluminum, wood, paper, cloth, resin, unwoven fabric and foaming resin can be used as the foregoing spacer.




According to the present invention as described above, the processing of the plate members for constituting a grid is very easy by using tungsten powder which has an excellent radiation absorption property, and productivity of the grid portion made of tungsten is enhanced. Accordingly, a scattered ray absorption grid which is relatively low in cost and shows an excellent scattered ray absorption property can be obtained.



Claims
  • 1. A scattered ray absorption grid comprising:a grid portion constituted by use of plate members formed in such a manner that a powder containing tungsten 50% by weight or more are hardened with a binder so that the powder has a spatial filling rate of 40% or more.
  • 2. The scattered ray absorption grid according to claim 1, wherein said binder is organic binder.
  • 3. The scattered ray absorption grid according to claim 2, wherein said organic binder is thermoplastic polyurethane resin.
  • 4. The scattered ray absorption grid according to claim 1, wherein said binder is a metal with a melting point less than the melting point of tungsten.
  • 5. The scattered ray absorption grid according to claim 4, wherein said metal is lead solder made of an alloy containing tin and lead as its main components.
  • 6. A scattered ray absorption grid comprising;a grid portion constituted by use of plate members for constituting a grid formed in such a manner that, grid materials formed by hardening a powder containing tungsten 50% by weight or more with a binder so that the powder has a spatial filling rate of 40% or more is coated on a substrate.
  • 7. The scattered ray absorption grid according to claim 6, wherein said binder is organic binder.
  • 8. The scattered ray absorption grid according to claim 7, wherein said organic binder is a polymer resin.
  • 9. The scattered ray absorption grid according to claim 8, wherein said polymer resin is unsaturated polyester resin.
  • 10. The scattered ray absorption grid according to claim 6, wherein said binder is a metal with a melting point less than the melting point of tungsten.
  • 11. The scattered ray absorption grid according to one of claims 1 to 4, wherein said spatial filling rate is equal to 60% or more.
Priority Claims (1)
Number Date Country Kind
2000-297009 Sep 2000 JP
US Referenced Citations (4)
Number Name Date Kind
4362807 Sato Dec 1982 A
5384817 Crowther et al. Jan 1995 A
5418833 Logan May 1995 A
6018566 Eberhard et al. Jan 2000 A