Next, a description is made about preferred embodiments to carry out the present invention with reference to the accompanying drawings.
A screen printing plate of an embodiment of the present invention includes through-hole patterns which are of a polygonal shape each having as an apex the point with which a squeegee first comes in contact and whose width in the length direction of the squeegee gradually increases from the apex up to the maximum of the width of the through-hole pattern when the squeegee is slid to discharge ink so as to perform printing. Accordingly, it is possible to restrain ink from oozing out under the through-hole patterns at printing and form minute through-holes in a stable manner even in a large area.
In the present embodiment, a description is given below of the mechanism of restraining ink from oozing out under the through-hole patterns 2 by forming the through-hole patterns 2 in such a shape and arrangement that the point with which the squeegee 3 first comes in contact at printing is the apex.
On the other hand, assume that there are formed the through-hole patterns 2 whose apexes first come in contact with the squeegee 3 in the printing direction, as shown in
Furthermore, assume that the through-hole patterns 2 are of a shape such as a circle or an ellipse having no apex as shown in
The above-described effect of the screen printing plate of the present embodiment is particularly useful if the diameter of the through-hole pattern 2 is less than 300 μm, namely, if the length of the side of a minimum square including the through-hole pattern 2 is less than 300 μm. Furthermore, the minimum diameter of the through-hole pattern 2 depends on the wire diameter of the mesh 1 for use in the screen printing plate. It is thus theoretically possible to reduce the diameter of the through-hole pattern 2 as the wire diameter of the mesh 1 is reduced. The finest mesh 1 currently available is one obtained by weaving a wire rod having a wire diameter of about 10 μm at a density of 840 pieces per inch. As shown in
As shown in
In the present embodiment, the through-hole patterns 2 are preferably of a shape so that one or more corners other than the one including the apex with which the squeegee 3 first comes in contact are formed into a curved line, and are particularly preferably of a shape so that all the corners other than the one including the apex with which the squeegee 3 first comes in contact are formed into a curved line. Since with this particular preference the through-hole patterns 2 have the corners, one corner including the apex with which the squeegee 3 first comes in contact and the other ones being formed into a curved line, the ink on the outside of the through-hole patterns 2 easily smoothly flows along the curved line, thereby making it possible to further restrain the ink from oozing out under the through-hole patterns 2. Since the corners of printed through-hole patterns are formed into a curved line, the surface tension at the edge of the through-holes is equalized, thereby making it possible to restrain the occurrence of feathering caused by the fluidity of ink. Note that although examples of the curved line in this case include a circle, an ellipse, a parabola, or the like, the curved lines are not particularly limited so long as they are projected to the outside.
Note, however, that the surface of the ink discharged from the screen printing plate becomes even due to gravity, and at the same time, a small amount of feathering is caused to occur because of the principle of the screen printing method. Therefore, the through-hole patterns of the screen printing plate of the present invention do not strictly match the shapes of the through-holes to be formed.
In the present embodiment, the through-hole patterns 2 can be formed by publicly known methods. For example, it is possible to apply photolithography to the mesh 1 having a photosensitive emulsion coated thereon so as to form the through-hole patterns 2.
A thick film having through-holes of the present embodiment is formed by performing printing with the screen printing plate of the invention. Specifically, after ink is applied to the screen printing plate arranged on a print member, the squeegee 3 is slid in the printing direction on the screen printing plate having the ink applied thereon as shown in
In the present embodiment, ink used for forming a thick film having through-holes is not particularly restricted, and publicly known materials containing resin components, fillers, and solvents are available. In order to form through-holes, each having a diameter of 300 μm or less, it is particularly preferable to use ink which does not easily flow at printing and drying. Specifically, examples of the ink include one which has a viscosity of 100 Pa·s or more under the temperature condition to perform printing and a solid volume ratio of 25% or more of the ink.
In the present embodiment, an insulation material is used to form a thick film having through-holes to thereby obtain an insulation film having the through-holes.
Note that a film thickness of a thick film having through-holes is determined by the formula, (thickness of mesh×opening ratio+thickness of emulsion)×solid volume ratio of ink. Accordingly, it is possible to form a thick film having a predetermined film thickness by adjusting the respective parameters as needed.
An interlayer wiring structure of the present embodiment can be formed by laminating the thick film (interlayer insulation film) having through-holes of the invention with plural electrodes with a predetermined arrangement and electrically connecting upper and lower electrodes of the interlayer insulation film to each other via the through-holes. Accordingly, it is possible to greatly reduce the manufacturing steps and obtain a miniaturized multilayer wiring structure. In order to have the upper and the lower electrodes of the interlayer insulation film electrically connected to each other, it is preferable to fill in the through-holes with a conductive layer. At this time, it is further preferable to form upper electrodes at the upper portions of the interlayer insulation film and fill in the through-holes with the conductive layer by the screen printing method. It is thus possible to use the same apparatus and simplify the manufacturing process.
An image display apparatus of the present embodiment can be formed by laminating image display elements on an active matrix substrate in which transistor elements are provided in a lattice shape, where transistors and pixel electrodes are electrically connected to each other via the through-holes through the thick film (interlayer insulation film). Accordingly, it is possible to obtain a slim and lightweight image display apparatus with an easy manufacturing process. Note that a liquid crystal display element, an electrophoretic display element, and an organic EL (electroluminescence) element can be used as the image display element. Accordingly, it is possible to obtain a flat-panel type or flexible image display apparatus, which can reduce the burden on a viewer's eyes.
There was employed, as the screen printing plate, one in which the square through-hole patterns 2, 200 μm on a side, were arranged in a matrix form at intervals of 400 μm (see
After being printed with the screen printing plate and a thick film paste in the printing direction as shown in
As a result of the evaluation of the obtained thick film with a length measuring microscope, it was found that through-holes substantially in the shape of a square were formed on the entire surface of the thick film. Note that a side of the formed through-holes was 160 μm on average.
Except that the screen printing plate as shown in
As a result of the evaluation of the obtained thick film with a length measuring microscope, it was found that amorphous through-holes as shown in
Except that the through-hole patterns 2 of the screen printing plate as shown in
On the entire surface of the obtained thick film, there were formed through-holes having a shape substantially the same as that of the through-hole patterns. The formed through-holes were 160 μm long×160 μm wide on average.
Except that the through-hole patterns 2 of the screen printing plate as shown in
Through-holes were formed on the entire surface of the obtained thick film. The formed through-holes were caused to slightly shrink in the printing direction, and they were 160 μm long×150 μm wide on average.
As compared with Example 2, it is found that although the areas of the through-hole patterns on the screen printing plate of Example 2 are smaller than those of Comparative Example 2, the through-holes formed in Example 2 are larger in size than those formed in Comparative Example 2.
As shown in
After being printed with the screen printing plate and an insulating paste in the printing direction as shown in
The obtained insulation film was examined under a microscope to evaluate the number of through-holes formed without being filled in each of the pattern units. Table 1 shows the evaluation results.
As apparent from Table 1, in order to form the through-holes in a stable manner, it is required for the through-hole patterns to have a diameter of 300 μm or more in the case of Comparative Example 3 and that of 150 μm or more in the case of Example 3.
Nano-silver ink was formed on a polycarbonate substrate by an ink jet method and then dried to form gate electrodes. Next, a gate insulation film was formed by applying thermal polymerization polyimide thereto by a spin coating method and thermal-treating it at 190° C. The formed gate insulation film had a relative permittivity of 3.6 and a film thickness of 0.4 μm. Ultraviolet rays were applied to the areas, on which source/drain electrodes will be formed via a photomask, to modify the surface of the areas. In addition, nano-silver ink was formed on the areas by the ink jet method and then dried to form the source/drain electrodes. Next, an organic semiconductor material expressed by the structural formula
was dissolved in xylene to form ink. The resulting ink was formed into a film by the ink jet method to form an organic semiconductor layer, thereby obtaining organic transistors. The organic transistors thus obtained had a channel length of 5 μm and a channel width of 2 mm.
There was employed, as the screen printing plate, one in which the through-hole patterns 2 similar to those of
After being printed with the screen printing plate as shown in
In addition, a silver paste made of Ag particles, an acryl resin, and a solvent was formed on the interlayer insulation film by the screen printing method and then dried to fill in the through-holes of the interlayer insulation film with conductive layers and form pixel electrodes electrically connected to low-level organic transistors, thereby obtaining an active matrix substrate in which transistor elements are arranged in a lattice shape.
Next, 20 parts by weight of titanium oxide, 1 part by weight of acid polymer, 2 parts by weight of silicon polymer graft carbon black MX3-GRX-001 (manufactured by Nippon Shokubai Co., Ltd.), 77 parts by weight of silicon oil KF96L-1cs (manufacture by Shin-Etsu Chemical Co., Ltd.) were mixed together and then dispersed for one hour with ultrasonic waves to obtain a dispersion liquid with black and white particles. Microcapsules were made from the dispersion liquid by a gelatin/acacia gum complex coacervation method. At this time, the average particle diameter of the microcapsules was about 60 μm. The dispersion liquid prepared by dispersing the microcapsules thus obtained in a urethane resin solution was spread on a film substrate with a transparent electrode film by a wire blade method, thereby forming a uniform microcapsule sheet. Consequently an electrophoretic display element was obtained.
The electrophoretic display element thus obtained was bonded to the active matrix substrate to obtain the image display as shown in
The present invention is not limited to the specifically disclosed embodiments, and variations and modifications may be made without departing from the scope of the present invention.
The present application is based on Japanese Priority Patent Application No. 2006-195980, filed on Jul. 18, 2006, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | Kind |
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2006-195980 | Jul 2006 | JP | national |