SEALING METHOD FOR SERVER

Abstract

A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to China Application Serial Number 202011297196.7 filed Nov. 18, 2020, which is herein incorporated by reference in its entirety.

BACKGROUND

Field of Invention

The present invention relates to a sealing method for a server.

Description of Related Art

A two phase immersion cooling system is typically used to cool down and keep electronic systems (e.g. servers). The phase transition between the gas and liquid of the dielectric fluid inside the cooling system can improve the heat dissipation efficiency of the electronic systems that keep in thereof. This type of cooling system can also prevent the error of electronic systems that may be caused by the contact of air or dust.

To reduce the leakage of the dielectric fluid inside the cooling system, the case of thereof needs to provide gas tightness. However, the electronic systems have to pass through the case of the cooling system to make electronic connection and transfer data to the outside world. A general sealing method does not allow the case of a cooling system to achieve gas tightness and have an electronic connection at the same time.

Therefore, provision of a sealing method for a server to solve the above problems is a need that the industry urgently wants to accomplish.

SUMMARY

The invention provides a sealing method for a server, comprising: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, wherein the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

In another embodiment of the present disclosure, the sealing method for a server includes solidifying the first colloid after coating the first colloid and before filling the second colloid.

In another embodiment of the present disclosure, the frame includes a body, the body includes the inner surface and a first opening and a second opening respectively located on two sides of the body, wherein the filling the second colloid disconnects the first opening and the second opening.

In another embodiment of the present disclosure, an interspace is formed between the part of the component and the inner surface of the frame, and the filling the second colloid fills the interspace with the second colloid.

In another embodiment of the present disclosure, the frame further comprises a protruding edge, the protruding edge is connected to the body and extends outwardly from the first opening, the gap is formed between the protruding edge and the housing, the housing has a third opening, and the fixing the frame on the housing comprises: passing the component and the frame through the third opening to make the protruding edge cover the third opening; and fixing the housing and the protruding edge with a plurality of screws.

In another embodiment of the present disclosure, the sealing the gap between the frame and the housing comprises: using a sealing material to seal the gap.

In another embodiment of the present disclosure, the sealing method for a server further comprising: making a fixing element fix on a side surface of the protruding edge that is away from the housing and cover the protruding edge, wherein another gap is formed between the protruding edge and the fixing element.

In another embodiment of the present disclosure, the sealing method for a server further comprising: using a sealing material to seal the another gap.

In other embodiment, the coefficient of viscosity of the first colloid is greater than the coefficient of viscosity of the second colloid.

In another embodiment of the present disclosure, the component includes a circuit board and an input/output interface, the input/output interface is connected to the circuit board, wherein the surrounding the part of the component by the frame comprising: surrounding a part of the circuit board and a part of the input/output interface by the frame.

According to the above description, in the present disclosure, by coating the first colloid and the second colloid, the gap between the frame and the component can be filled, therefore forming a gas tightness wall between the two openings. The gas tightness wall can provide gas tightness while maintaining the connection of the component. Fixing the frame contain the gas tightness wall on the housing and filled the gap with fills material, maintaining the gas tightness of the housing and letting the components connect inside and outside of the housing.

In one of the embodiments of the present disclosure, the servers can be used in AI (Artificial Intelligence) calculations, edge computing, and also can serve as 5G servers, cloud servers or servers for the internet of vehicles.

It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:

FIG. 1 is a flowchart of the sealing method of a server, according to one embodiment of this invention.

FIG. 2A is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention.

FIG. 2B is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention.

FIG. 2C is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention.

FIG. 2D is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention.

FIG. 3 is a cross-sectional enlarged view of a sealing method of a server, according to one embodiment of this invention.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

Reference is made to FIG. 1. FIG. 1 is a flowchart of the sealing method of a server, according to one embodiment of this invention. The sealing method of a server M1 mainly contains step S101 to step S105.

In step S101, frame 110 surrounds a part 122 of a component 120. Reference is made to FIG. 2A. FIG. 2A is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention. As shown in FIG. 2A, body 112 of the frame 110 has an inner surface 112a, a first opening 112b and a second opening 112c. The first opening 112b and the second opening 112c are connected. In some embodiments, the first opening 112b and the second opening 112c have a square shape, but the present disclosure is not limited by this. In some embodiments, the material of the frame 110 is Acrylic, but the present disclosure is not limited by this. Component 120 passes through the first opening 112b and the second opening 112c simultaneously, and a part 122 of the component 120 located between the first opening 112b and the second opening 112c. In some embodiments, the component 120 includes a circuit board 124 and an input/output interface 126, and the circuit board 124 is connected to the input/output interface 126. A part 122 of the component 120 includes a part of the circuit board 124 and a part of the input/output interface 126. In the previous embodiment, the circuit board 124 passes through the second open 112c, the input/output interface 126 passes through the first opening 112b, and connect between the first opening 112b and the second opening 112c.

In step S102, the first colloid 130 is coated on the part 122 of the component 120 and the inner surface 122a of the frame 110. Reference is made to FIG. 2B. FIG. 2B is a cross-sectional view of one of the stages of a sealing method M1 of a server, according to one embodiment of this invention. As shown in FIG. 2B, the part 122 of the component 120 does not have to be a gas tightness surface. The material of the frame 110 does not require gas tightness. Step S102 coating the first colloid 130 on the part of the component 120 and the inner surface 112a of the body 112 uniformly forms a gas tightness film on these parts to achieve an early stage of gas tightness on the part 122 of the component 120 and the inner surface 112a of the body 112.

In step S103, the second colloid 140 filled between the part 122 of the component 120 and the inner surface 112a of the frame 110 and covered the first colloid 130. Reference is made to FIG. 2C. FIG. 2C is a cross-sectional view of one of the stages of a sealing method of a server, according to one embodiment of this invention. As shown in FIG. 2C, the second colloid 140 is coated on the first colloid 130. The second colloid 140 is filled in a gap 112d between the part 122 of the component and the inner surface 112a of the body 112 (as shown in FIG. 2B). The filling of the second colloid 140 disconnects the first opening 112b and the second opening 112c, thus achieving gas tightness. The first colloid 130 and the second colloid 140 have different coefficients of viscosity. In some embodiments, the coefficient of viscosity of the first colloid 130 is greater than the coefficient of viscosity of the second colloid 140, but the present disclosure is not limited by this.

In some embodiments, step S103 includes step S103a: the filling of the second colloid 140 is performed after the first colloid 130 has solidified fully. After the first colloid 130 is fully solidified, the second colloid 140 not only fills the first opening 112b, the second opening 112c and the gap 122d between the part 122 of the component, but also fills the slits formed on the first colloid 130 after solidification.

In some embodiments, step S103 includes step S103b: the second colloid 140 fully filled the gap 112d. Reference is made to FIG. 2C. While filling the second colloid 140, the first opening 112b, the second opening 112c, and the gap 112d between the part 122 of the component 120 are filled. Frame 110 and component 120 formed a solid gas tightness wall structure 100. The gas tightness wall structure 100 can prevent the gas exchange on its two sides.

In step S104, the frame 110 is fixed on a housing 200. Reference is made to FIG. 2D. FIG. 2D is a cross-sectional view of one of the stages of a sealing method of a server M1, according to one embodiment of this invention. The housing 200 has a third opening 202. The frame 110 and the component 120 can pass through the third opening 202 and are fixed to the housing 200.

In some embodiments, step S104 include step S104a: passing the frame 110 and the component 120 through the third opening 202 and covering the third opening 202, then fixing a protruding edge 114 of the frame 110 on the housing 200. In some embodiments, with reference to FIG. 2C and FIG. 2D, the frame 110 has a protruding edge 114. The protruding edge 114 connected to the body 112, and extends outwardly from the first opening 112b. The protruding edge 114 covers the third opening 202. In some embodiments, the protruding edge 114 fully covers the third opening 202, but the present disclosure is not limited by this. In some embodiments, the protruding edge 114 and the housing 200 can be fixed by multiple screws 220.

In some embodiments, step S104 include step S104b: the frame 110 fixed on the housing 200 through a fixing element 210. Reference is made to FIG. 2D. In some embodiments, the fixing element 210 is disposed on a side of the protruding edge 114 that is away from the housing 200. The fixing element 210, the protruding edge 114 and the housing 200 are fixed through screws 220, to achieve the purpose of fixing the frame 110 on the housing 200.

In step S105, the interspace 240 between the frame 110 and the housing 200 is sealed. Reference is made to FIG. 3. FIG. 3 is a cross-sectional enlarged view of a sealing method of a server, according to one embodiment of this invention. As shown in FIG. 3, the interspace 240 is located between the housing 200 and the protruding edge 114. Using filling material 230 to fill and seal the interspace 240. More specifically, in some embodiments, screws 220 are used to fix the housing 200 and the frame 110, and the filling material 230 can be an elastic O-ring or gasket, but the present disclosure is not limited by this.

In some embodiments, step S105 include S105a: using filling material 230 to fill and seal interspace 240, 242. As shown in FIG. 3, the two interspaces 240, 242 located between the housing 200 and the protruding edge 114 and between the fixing element and the protruding edge 114, respectively. Using the filling material 230 sealing the interspace 240, 242 respectively, to achieve the gas tightness of the two sides the housing 200.

It should be noted that, in some embodiments, step S104 and step S105 is finished simultaneously, but the present disclosure is not limited by this. For example, before using the screws 220 to fix the housing 200 and the protruding edge 144 of the frame 110, the filling material 230 is filled in the interspace 240 first, then the housing 200 and the protruding edge 114 is being fixed by the screws 220. After fixing the screws 220, step S104 fixing the frame 110 on the housing 200 and step S105 sealing the interspace 240 between the frame 110 and the housing 200 are finished simultaneously.

From the above description of the embodiments of the present disclosure, it can be clearly seen that, in the present disclosure of a sealing method for a server, by coating the first colloid and the second colloid, the gap between the frame and the component can be filled, therefore forming a gas tightness wall between the two openings. The gas tightness wall can provide gas tightness while maintaining the connection of the component. Fixing the frame contains the gas tightness wall on the housing and fills the gap with filling material, maintaining the gas tightness of the housing and letting the components connect inside and outside of the housing.

Although the present invention has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims.

Claims

1. A sealing method for a server, comprising: surrounding a part of a component by a frame;coating a first colloid on the part of the component and an inner surface of the frame;filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, wherein the first colloid and the second colloid have different coefficients of viscosity;fixing the frame on a housing; andsealing a gap between the frame and the housing.

2. The method of claim 1, further comprising solidifying the first colloid after the coating the first colloid and before the filling the second colloid.

3. The method of claim 1, wherein the frame include a body, the body includes the inner surface and a first opening and a second opening respectively located on two sides of the body, wherein the filling the second colloid disconnects the first opening and the second opening.

4. The method of claim 3, wherein an interspace is formed between the part of the component and the inner surface of the frame, and the filling the second colloid fills the interspace with the second colloid.

5. The method of claim 3, wherein the frame further comprises a protruding edge, the protruding edge is connected to the body and extends outwardly from the first opening, the gap is formed between the protruding edge and the housing, the housing has a third opening, and the fixing the frame on the housing comprises: passing the component and the frame through the third opening to make the protruding edge cover the third opening; andfixing the housing and the protruding edge with a plurality of screws.

6. The method of claim 5, wherein the sealing the gap between the frame and the housing comprises: using a sealing material to seal the gap.

7. The method of claim 5, further comprising: making a fixing element fix on a side surface of the protruding edge that is away from the housing and cover the protruding edge, wherein another gap is formed between the protruding edge and the fixing element.

8. The method of claim 7, further comprising: using a sealing material to seal the another gap.

9. The method of claim 1, wherein the coefficient of viscosity of the first colloid is greater than the coefficient of viscosity of the second colloid.

10. The method of claim 1, wherein the component include a circuit board and a input/output interface, the input/output interface is connected to the circuit board, wherein the surrounding the part of the component by the frame comprising: surrounding a part of the circuit board and a part of the input/output interface by the frame.