Securement arrangement for slanted type card edge connector

Information

  • Patent Grant
  • 6168464
  • Patent Number
    6,168,464
  • Date Filed
    Tuesday, April 25, 2000
    24 years ago
  • Date Issued
    Tuesday, January 2, 2001
    23 years ago
Abstract
A slanted type card edge connector (10) includes an insulative housing (12) defining a central slot (14) for receiving a module therein. Two rows of contacts (18, 19) are provided by two sides of the central slot (14) with tails (20) extending horizontally out of the front surface (22) and the rear surface (24) of the housing (12). The housing (12) includes three securement sections (30) respectively essentially positioned on two opposite ends and the middle portion. A pair of mounting pads (46) and a positioning holdown (38) are provided with each securement section (30) wherein one mounting pad (46) extends horizontally and forward out of the front surface (22) of the housing (12) and the other mounting pad (46) extends horizontally and rearward out of the rear surface (24) of the housing (12) while the holdown (38) extending downward, thus resulting in a condition that the positioning holdown (38) is generally positioned between the corresponding front side mounting pad (46) and rear side mounting pads (46) and substantially keeps the same distance with regard to such two mounting pads (46). Therefore, such pair of mounting pads (46) cooperating with the center holdown (38) can provide a counterbalance with each other for efficiently resisting severe unusual insertion or withdrawal of the card with regard to the connector (10).
Description




BACKGROUND OF THE INVENTION




1. Field of The Invention




The invention relates to slanted type card edge connectors, and particularly to the slanted type connector having surface mount type contact tails and the corresponding securement device for mounting to the mother board.




2. The Related Art




The copending Ser. No. 08/910,376 filed Aug. 13, 1997 discloses a 25-degree slanted type DIMM (Dual In-line Memory Module) card edge connector with two rows of SMT (Surface Mount Technology) type contacts by two sides, wherein three solder pads are disposed on the front side cooperating with three post for securing the connector on the mother board. Anyhow, one concern has been raised whether the securement is sufficient to resist the bending moment, which is generated by insertion or withdrawal of the module or card with regard to the connector, imposed on rear side portions of the connector with the mother board. In such practice, apparently no reliable securement device is provided on the rear side of the connector to resist the bending moment imposed thereon.




Therefore, an object of the invention is to provide a slanted type card edge connector with the securement device on both front and rear sides for not only efficiently resisting the bending moment imposed thereabout, but also for reliably protecting the horizontally ex tending SMT type contact tails during delivery.




SUMMARY OF THE INVENTION




According to an aspect of the invention, a slanted type card edge connector includes an insulative housing defining a central slot for receiving a module or a card therein. Two rows of contacts are provided by two sides of the central slot with solder tails extending horizontally out of the front surface and the rear surface of the housing. The housing includes three securement sections respectively essentially positioned on two opposite ends and the middle portion. A pair of mounting pads and a positioning holdown are provided with each securement section wherein one mounting pad extends horizontally and forward out of the front surface of the housing and the other mounting ad extends horizontally and rearward out of the rear surface of the housing while the holdown extending downward, thus resulting in a condition that the positioning holdown is generally positioned between the corresponding front side mounting pad and rear side mounting pads and substantially keeps the same distance with regard to such two mounting pads. Therefore, such pair of mounting pads cooperating with the center holdown can provide a counterbalance with each other for efficiently resisting severe unusual insertion or withdrawal of the card with regard to the connector.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a front perspective view of a presently preferred embodiment of a slanted type DIMM connector according to the invention.





FIG. 2

is a rear perspective view of the slanted type DIMM connector of FIG.


1


.





FIG. 3

is a bottom perspective view of the slanted type DIMM connector of FIG.


1


.





FIG. 4

is a partial enlarged bottom perspective view of the slanted type DIMM connector of FIG.


1


.





FIG. 5

is a partial enlarged bottom perspective view of the slanted type DIMM connector of

FIG. 1

wherein the holdown and the mounting pads are disassembled therefrom.





FIG. 6

is a cross-sectional view of the slanted type DIMM connector of

FIG. 1

along line


6





6


.





FIG. 7

is a partial enlarged cross-sectional view of the slanted type DIMM connector of

FIG. 1

along line


6





6


.





FIG. 8

is a partial enlarged cross-sectional view of the slanted type DIMM connector of

FIG. 1

along line


8





8


.





FIG. 9

is a partial enlarged cross-sectional view of the slanted type DIMM connector of

FIG. 1

along line


9





9


.





FIG. 10

is a plan view of a mother board on which the connector of

FIG. 1

is adapted to be seated.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




References will now be in detail to the preferred embodiments of the invention. While the present invention has been described in with reference to the specific embodiments, the description is illustrative of the invention and is not to be construed as limiting the invention. Various modifications to the present invention can be made to the preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by appended claims.




It will be noted here that for a better understanding, most of like components are designated by like reference numerals throughout the various figures in the embodiments. Attention is directed to FIGS.


1


-


5


wherein a 25-degree slanted type DIMM connector


10


includes an insulative housing


12


defining a central slot


14


for receiving a card therein. Two rows of cavities


16


,


17


(also

FIG. 6

) are disposed by two sides of the central slot


14


for receiving a corresponding number of contacts


18


,


19


therein. Each contact


18


,


19


includes a SMT type solder tail


20


extending out of the front/rear surface


22


/


24


for mounting to the corresponding trace


101


of the mother board


100


(

FIG. 10

) on which the connector


10


is seated.




A pair of tower


26


are provided at two ends of the housing


12


for respectively receiving a pair of ejectors


28


therein, which perform a ejection or locking function with regard to the card.




The housing


12


further includes three securement sections


30


positioned respective near two opposite tower


26


and the middle portion of the housing


12


. Each securement section


30


has a front face


32


and a rear face


34


which are respectively coplanar with the front surface


22


and the rear surface


24


. Also referring to FIGS.


6


-


10


, each securement section


30


includes a center aperture


36


extending upward from the bottom surface


37


in a front-to-end direction for receiving a metal holdown


38


therein. The holdown


38


includes a base


41


with barbs


42


thereof for interferential engagement within the aperture


36


, and a pair of resilient legs


40


for receipt within the corresponding hole


102


in the mother board


100


. Each securement section


30


further includes a pair of apertures


44


extending upward from the bottom surface


37


and by two sides of the center aperture


36


for respectively receiving therein a pair of mounting pads


46


wherein each mounting pad


46


includes a vertical retaining section


48


with barbs


49


thereon for interferential engagement within the corresponding aperture


44


, and a horizontal solder section


50


for soldering unto the corresponding trace


104


on the mother board


100


.




It can be seen that the solder sections


50


of each pair of mounting pads


46


extend respectively out of the front surface


22


and the rear surface


24


and essentially spaced from the legs


40


of the holdown


38


with substantially an equal distance, thus providing a counterbalance with each other for efficiently resisting any forces, impact or bending moment imposed either on the front side or on the rear side of the housing


12


.




Additionally, different from the aforementioned copending application which discloses three enlarged mounting sections on two opposite ends and the middle portion along the housing


12


, the securement sections


30


of the housing


12


of the invention keep the same contour dimensions with the main portions of the housing


12


wherein the front face


32


and the rear face


34


of the securement sections


30


are coplanar with the front surface


22


and the rear surface


24


of the housing


12


. Under this condition, the outward extending solder sections


50


of the mounting pad


46


should outward protrude not only out of the corresponding front/rear surface


22


,


24


, but also further out of the imaginary boundary line formed by the tips of the contact solder tails


20


along the same row for preventing damage due to any impact along the lengthwise direction.




While the present invention has been described with reference to specific embodiments, the description is illustrative of the invention and is not to be construed as limiting the invention. Various modifications to the present invention can be made to the preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.




Therefore, person of ordinary skill in this field are to understand that all such equivalent structures are to be included within the scope of the following claims.



Claims
  • 1. A combination of a connector and a mother board, said connector including an elongated insulative housing defining two rows of contacts with solder tails extending out of a front surface and rear surface of the housing, respectively, at least a securement section provided about one end of the housing and including a pair of mounting pads with a corresponding pair of respective horizontally extending solder sections protruding out of the front surface and the rear surface, respectively, and a vertically extending hold down having legs positioned in alignment with and between said pair of solder sections under a condition that a first distance between the hold down leg to one solder section is generally equal to that between the hold down leg to the other solder section, said mother board including a pair of aligned solder traces and a hole corresponding to the solder sections and the holdown wherein a second distance between the hole and one solder trace is generally equal to that between said hole and the other solder trace.
  • 2. The combination as defined in claim 1, wherein said first distance is equal to said second distance.
  • 3. A connector assembly comprising:an elongated insulative housing defining at least a side surface along a lengthwise direction of the housing; a plurality of contacts positioned within the housing, each of said contacts including an SMT type solder tail horizontally extending out of said side surface in a transverse direction of the housing; a pair of mounting pads disposed at two opposite ends of the housing with a row of the solder tails of said contacts positioned therebetween, each of said pair of mounting pads including a horizontally extending solder section extending out of said side surface in said transverse direction; wherein the solder sections of the mounting pads extend outwardly and transversely beyond tips of the solder tails of the contact therebewteen for protection of the solder tails during shipping and handling; wherein said connector further includes a pair of ejectors at said two opposite ends, and said ejectors extend in a non-vertical direction toward said side surface.
  • 4. The connector as defined in claim 3, wherein said mounting pads are made of metal adapted to be soldered to a mother board in an SMT process.
  • 5. The connector as defined in claim 3, wherein said housing defines a central slot exposed to an exterior through said side surface.
  • 6. The connector as defined in claim 3, wherein a third pair of mounting pads are positioned around a middle portion of the housing and extends in said transverse direction.
Parent Case Info

(This is a continuation application of the application Ser. No. 09/016,144 filed Jan. 30, 1998 now U.S. Pat. No. 6,086,416.)

US Referenced Citations (2)
Number Name Date Kind
5297966 Brennian, Jr. et al. Mar 1994
5387115 Kozel et al. Feb 1995
Continuations (1)
Number Date Country
Parent 09/016144 Jan 1998 US
Child 09/558246 US