Claims
- 1. A process for plating a substrate to form a composite plated coating on a surface thereof said process comprising contacting said surface of said substrate with a plating composition incorporating particulate matter insoluble with said plating composition to yield a composite plated coating on said surface with said particulate matter dispersed within said coating, said coating having a predetermined varied density of codeposited particulate matter from a first region along the surface of the substrate being plated to a second region thereof, said predetermined varied density of codeposited particulate matter between said first and second regions being achieved by continuously rotating said substrate during the plating process at a speed greater than that necessary to achieve a different varied density of codeposited particulate matter within said coating between said first and second regions.
- 2. The process according to claim 1 wherein said substrate is an open-end spinning rotor.
- 3. The process according to claim 1 wherein said substrate is an open-end combing roll.
- 4. The process according to claim 1 wherein said rotational speed is executed along a single axis of symmetry of said substrate.
- 5. The process according to claim 4 wherein said particulate matter are wear resistant particles.
- 6. The process according to claim 4 wherein said particulate matter are lubricating particles.
- 7. The process according to claim 4 wherein said plating is an electrolytic plating method.
- 8. The process according to claim 4 wherein said plating is an electroless plating method.
- 9. The process according to claim 1, further including selecting the speed of rotation of said substrate such that one of said regions is substantially free of said codeposited particulate matter.
- 10. The process of claim 1 wherein the selected speed of rotation of said substrate during the plating process is constant.
- 11. A process for plating a substrate to form a composite plated coating on a surface thereof said process comprising contacting said surface of said substrate with a plating composition incorporating particulate matter insoluble with said plating composition to yield a composite plated coating on said surface with said particulate matter dispersed within said coating, predetermining a varied density of codeposited particulate matter from a first region along the surface of the substrate being plated to a second region thereof, selecting a speed of rotation of said substrate for the plating process to achieve the predetermined varied density of codeposited particulate matter, and continuously rotating said substrate during the plating process at the selected speed to achieve the predetermined varied density of codeposited particulate matter within said coating between said first and second regions.
- 12. The process according to claim 11, further including selecting the speed of rotation of said substrate such that one of said regions is substantially free of said codeposited particulate matter.
- 13. The process of claim 11 wherein the selected speed of rotation of said substrate during the plating process is constant.
REFERENCE TO PRIOR APPLICATION
This application is a continuation-in-part of application Ser. No. 08/188,611 filed Jan. 24, 1994, now abandoned, which is a continuation-in-part of application Ser. No. 005,680 filed on Jan. 19, 1993, now abandoned.
US Referenced Citations (3)
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
188611 |
Jan 1994 |
|
Parent |
05680 |
Jan 1993 |
|