This invention relates to the self-aligned deposition of silica for increasing the conversion efficiency of dye-sensitized solar cells.
Silica, otherwise known as silicon dioxide, with chemical formula SiO2, is a common component of sand and other minerals. Silica has many useful properties, including excellent electrical insulating ability, high transparency to light, resistance to corrosion by many chemicals, mechanical strength and low thermal expansion rate.
Thin films of silica have been made by many methods, including evaporation, sputtering, chemical vapor deposition (CVD), atomic layer deposition (ALD), sol-gel techniques and wet chemical precipitation methods. These methods generally deposit the silica layers non-selectively on all exposed surfaces of a flat substrate.
In some applications silica is only wanted on certain areas of a flat substrate. In such cases, lithography and selective chemical etching might be used to remove silica from areas where it is not wanted. However, when surface is not planar, lithography is not applicable.
The present disclosure provides for self-aligned deposition of silica films on non-planar surfaces of substrates, such as particles utilized in solar cell applications. It overcomes the limitations of the previously-used patterning methods described above.
The source of the silica is one or more precursors in a fluid contacting the substrate. In some embodiments, the fluid is a gas or vapor phase, while in others the fluid may be a liquid.
The silica precursors may be molecules containing both silicon and oxygen, or they may be separate silicon- and oxygen-containing molecules. In some embodiments, the silica precursors are alkoxysilanols. Preferred alkoxysilanols include tris(tert-butoxy)silanol and tris(tert-pentoxy)silanol.
The invention exploits differences in the growth rate of silica on different substrates. In particular, silica films were found to grow on certain catalytically active substrates, such as aluminum, titanium, zirconium, hafnium and copper, as well as the oxides and nitrides of these metals. In contrast, under the same conditions, no silica was deposited on catalytically inactive materials, including silicon oxide itself, silicon nitride, carbon and many organic materials, such as dyes, polymers and plastics.
This discovery can be applied to making improved solar cells, particularly those of the dye-sensitized type. In this case, the catalytically active material in the solar cell is typically titanium dioxide, while the catalytically inactive material can be an absorbing dye, such as an organic dye, or a ruthenium complex, or an inorganic semiconductor.
Dye-sensitized solar cells have a structure shown schematically in
In certain embodiments, the back electrode 150 serves as the cathode while the transparent electrode 110 and nanoparticles 120 serve as the anode.
The above-described flow of photoelectrons takes place in areas on the particles that are covered by dye molecules. The exposed areas of the particle surfaces that are not covered by dye molecules allow direct contact between the electrolyte and the particles. Some of the photoelectrons in the particles recombine with electrons from the electrolyte at these exposed areas of the surfaces of the particles that are not covered by dye molecules. These photoelectrons that recombine on the exposed areas of the particles do not traverse the external circuit. They represent a loss from the potential output of the solar cell because they do not deliver any power to the external circuit.
In certain embodiments, this unwanted recombination rate may be reduced or eliminated by selectively coating a thin layer of SiO2 on the exposed areas of the particles where they are not covered by dye molecules. As shown in
There are a number of different particles that can be utilized for dye-sensitized solar cells. Exemplary particles include transparent semiconductors such as titanium dioxide (TiO2), zinc oxide (ZnO), tin dioxide (SnO2), nickel oxide (NiO) and the like. The surface of the particles can also be coated with a very thin layer (such as a monolayer or less) of a catalytically active insulator, such as aluminum oxide.
Suitable particles include surfaces that can selectively grow silica relative to the dye-surface. In certain embodiments, the particles have a surface that can catalytically grow silica. Preferably, the particles have a surface that can self-limit the growth of silica after a certain amount of silica has grown on the surface. Surfaces having a Lewis acid character can serve this purpose.
In certain embodiments, the particles may be replaced by other anode structures with high surface area, such as nanowires or nanotubes.
In certain embodiments, the particles may have an average particle size near 15 nanometers, such as 10 to 20 nanometers in diameter. In certain embodiments, the particles may be spherical, ellipsoidal, cylindrical, square, long or irregular in shape.
In certain embodiments, the particles can be deposited to form multilayers of particles, forming a film with thickness such as 10 or 25 or more micrometers.
There are numerous different ways to prepare suitable particles for use in dye-sensitized solar cells. For example, to produce titanium dioxide nanoparticles, methodologies described by Jeong et al., “A Convenient Route to High Area, Nanoparticulate TiO2 Photoelectrodes Suitable for High-Efficiency Energy Conversion in Dye-Sensitized Solar Cells,” in the journal Langmuir, volume 27, pp. 1996-1999 (2011) and its supporting information can be utilized. Commercial samples of titanium dioxide nanoparticles can be obtained from companies such as Dyesol (Queanbeyan, New South Wales, Australia).
Any dye that is suitable for use in a dye-sensitized solar cell can be used in the manufacture of a silica self-aligned solar cell. Organic dyes such as are known and used in the solar cell arts will be apparent to those of skill in the art. Many different dyes can be utilized, such as the ones shown in the formulas below. The dye preferably does not catalyze the deposition of silica. Purely organic dyes are preferred, because they do not contain any metal that could act as a Lewis acid catalyst.
Different silica precursors can be utilized that allow selective, self-limited, and/or catalytic growth of silica over the particles described above. Suitable silica precursors include alkoxysilanol, alkoxysilanediol, and derivatives thereof. In certain embodiments, suitable silica precursors include tris(tert-alkoxy)silanols, such as tris(tert-butoxy)silanol and tris(tert-pentoxy)silanol. Another useful class of silica precursors include bis(tert-alkoxy)silanediols, such as bis(tert-butoxy)silanediol.
In certain embodiments, the silica deposition process can exhibit a self-limiting behavior, so that after a certain amount of growth, exposure to additional precursor vapor does not result in a thicker silica layer. For many applications, a silica layer of 1 or 2 nm may be sufficient to reduce the loss of photo-generated electrons through recombination reactions. It should be noted that this is entirely at variance with conventional chemical vapor deposition processes, in which the thickness of the deposited layer continues to increase with increasing reaction time. Accordingly, certain embodiments of the invention can provide well-controlled thicknesses of silica without any careful regulation of time of exposure or amount of vapor pressure. Furthermore, use of self-limited deposition reactions results in a uniform thickness of silica being deposited throughout a layer of nanoparticles. A uniform thickness of silica on all particles is highly desirable, because too thick a silica layer might cover the dye molecules and inhibit the desired transfer of electrons from the electrolyte to the dye. On the other hand, too thin a silica layer would not inhibit the undesired recombination reaction.
Further, in certain embodiments, silica coatings that are uniform, smooth, conformal and continuous over the entire exposed surface of catalytically active particles can be obtained. Even multi-layers of particles can be coated uniformly with silica by diffusion of the precursor vapor from outside the multilayer structure.
In certain embodiments, the selective deposition process can be carried out in an apparatus shown schematically in
Other modifications and alternative embodiments will become readily apparent to one of ordinary skill in the art in light of the non-limiting examples that follow.
In order to demonstrate some suitable particle materials that can allow selective, self-limited, catalytic growth of silica, various different flat substrates formed of different materials were utilized.
Test substrates were prepared of the following materials: aluminum metal (Al), amorphous aluminum oxide (Al2O3) deposited by atomic layer deposition (ALD) from trimethylaluminum and water at a substrate temperature of 200° C., and the anatase phase of titanium dioxide (TiO2) deposited by ALD from titanium isopropoxide and water at a substrate temperature of 225° C. Substrates of zirconium dioxide and hafnium dioxide were prepared by ALD from tetrakis(ethylmethylamido)zirconium and tetrakis(ethylmethylamido)hafnium, respectively, reacting with water vapor at 250° C. Copper oxide, CuxO, was prepared by oxidation of copper metal in ambient air. Substrates of silicon nitride (Si3N4) were prepared by plasma-activated chemical vapor deposition from silane and ammonia at 300° C., and silicon dioxide (SiO2) by oxidation of a silicon wafer at 800° C. in air. Additional substrates were prepared of silicon with hydrogen-terminated surface (SiHx) by etching the SiO2 layer from a silicon wafer with hydrogen fluoride solution in water.
Referring to
Silica deposition was carried out by the following steps: (1) substrates 60 were placed in the furnace 70, valve 50 was closed and valve 80 was opened to evacuate the air from the furnace, down to the base pressure of the vacuum pump 90, around 0.01 Torr. After a sufficient time, about 15 minutes, the temperature of the furnace reached a stable value, set at values between 120° C. and 190° C. in a series of experiments. (2) Valve 80 was closed to isolate the substrates from the vacuum pump 90. (3) Valve 50 was opened for periods from 1 to 5 seconds and then closed, after which time the pressure of tris(tert-butoxy)silanol vapor in furnace 70 increased to a value around 1 Torr. (4) After an additional reaction time, between 5 seconds and 5 minutes, valve 80 was opened so that the vacuum pump removed unreacted tris(tert-butoxy)silanol vapor along with vapors of reaction byproducts. (5) In some experiments, the furnace temperature was increased to 350° C. for a period of one half hour, in order to anneal and densify the films. (6) Furnace 70 was turned off and cooled down to nearly room temperature, air was admitted to the furnace (through a valve not shown), and the samples were removed for testing. As will be recognized, the dose size, pressure, and other process parameters are dependent on the reactor size and therefore are to be adjusted accordingly for a given reactor and other process conditions.
The thickness of any silica deposited on the substrates was measured by several techniques, including Rutherford backscattering spectroscopy (RBS), spectroscopic ellipsometry (SE), transmission electron microscopy (TEM) and low-angle X-ray reflectance (XRR). The absence of silica on some of the substrates was confirmed by X-ray photoelectron spectroscopy (XPS). The silica thickness increased when the precursor valve 50 was opened for times up to about 5 seconds, which was a convenient way to adjust the pressure of the silanol above the substrate. Longer valve-opening times gave higher final pressures of the silanol. The thickness of the silica was not increased further by increased times of exposure to the silanol vapor after closing valve 50 and before opening valve 80. These results show that the catalytic reaction is self-limited after a few seconds. The saturated thicknesses are recorded in Table 1 and plotted in
As shown,
It should be noted that previous experiments had shown that surfaces freshly exposed to vapors of highly reactive trimethylaluminum would catalyze deposition of silica layers to thicknesses of between 2 nm and 12 nm. It was understood that the catalytic activity of such surfaces was generated by the presence of this highly reactive material, and was not a property of the underlying substrate. Therefore it was a surprising discovery that a few ordinary surfaces have high catalytic activity for the deposition of silica even in the absence of any activation by trimethylaluminum.
Dye-sensitized solar cells were prepared according to conventional procedures up through the loading of the dye. The starting substrate is flat glass coated commercially with electrically conductive fluorine-doped tin oxide (FTO), obtained from Pilkington North America, Toledo, Ohio. Their FTO product, TEC 15, has a sheet resistance of about 15 ohms per square. The FTO was cleaned by sonication in a detergent solution for ½ hour, followed by thorough washing with distilled water. The FTO was then coated with a thin TiO2 layer by heating it at 70° C. for ½ hour in a 40 mM solution of TiCl4, followed by washing with water and then ethanol. Nanocrystalline TiO2 paste (TiO2 nanoparticles with an average size 18 nm, DSL 18NR-T, from Dyesol) was then printed on the plate with a doctor blade, and dried at 25° C. for 2 hours. In order to attach the TiO2 particles together more firmly, the plate was annealed in flowing air for 15 minutes at 375° C., then 15 minutes at 450° C., and finally for 15 minutes at 500° C. In order to scatter light more efficiently into the solar cell, a layer of larger TiO2 particles was then applied by doctor blade (TiO2 nanoparticles with 400 nm average diameter, WER4-0, from Dyesol) and annealed under the same conditions as the first TiO2 nanoparticle layer. The resulting TiO2 nanoparticle layer has a transparent layer of 18 nm diameter nanoparticles 13 micrometers thick on the FTO, with a scattering layer of 400 nm diameter nanoparticles 6 micrometers thick on top of the transparent layer. Thus these structures are thousands of particles deep. This structure was heated in a 40 mM solution of TiCl4 at 70° C. for ½ hour, followed by heating at 500° C. for ½. These test structures were heated to 150° C. and treated with tris(tert-butoxy)silanol vapor for 5 minutes.
The silica content of these treated TiO2 nanoparticle layers was measured by EDX on a cleaved cross section in a scanning electron microscope. The results, summarized in
Additional samples of multilayers of TiO2 nanoparticles were prepared. Next, organic dye molecules were adsorbed onto the TiO2 multilayers from a 0.3 mM solution for 1 day, after which the plates were rinsed and dried under a nitrogen gas atmosphere. The dye, whose chemical formula is shown in
Illuminated current-voltage curves are shown in
It is recognized, of course, that those skilled in the art may make various modifications and additions to the processes of the invention without departing from the spirit and scope of the present contribution to the art. Accordingly, it is to be understood that the protection sought to be afforded hereby should be deemed to extend to the subject matter of the claims and all equivalents thereof fairly within the scope of the invention.
This application claims priority to U.S. Provisional Patent Application No. 61/562,265 filed Nov. 21, 2011 which is hereby incorporated by reference in its entirety.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2012/065781 | 11/19/2012 | WO | 00 | 5/8/2014 |
Number | Date | Country | |
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61562265 | Nov 2011 | US |