Patent Grant
8998457
Embodiments described herein relate generally to a self-ballasted lamp having light-emitting portions each using a semiconductor light-emitting element and lighting equipment using the self-ballasted lamp.
In a conventional self-ballasted lamp having light-emitting portions each using an LED chip as a semiconductor light-emitting element, a light-emitting module, on which the light-emitting portions are mounted, and a globe for covering the light-emitting module are attached to one end side of a metallic base body, a cap is attached to the other end side of the base body via an insulating member, and a lighting circuit for supplying power to the LED chips of the light-emitting portions to light the self-ballasted lamp is housed inside the insulating member.
A light-emitting module is generally structured so that light-emitting portions are mounted on one face of a flat substrate, and the other face of the substrate is brought into face-contact with the base body and thermally-conductively attached to the base body.
While the self-ballasted lamp is lit, heat mainly generated by the LED chips of the light-emitting portions is conducted from the flat substrate to the base body and radiated into the air from a surface, which is exposed to the outside the base body.
Additionally, as a light-emitting module, a self-ballasted lamp exists in which, a plurality of light-emitting portions are arranged on a surface of a three-dimensional substrate formed in a globe, the three-dimensional substrate being formed of a regular-pyramid-shaped or cubic substrate or formed by bending a substrate in a sphere shape.
However, when the three-dimensional substrate is used for the light-emitting module, almost the entire light-emitting module is arranged in an air layer having a low thermal conductivity and only a part, which is supported, of the light-emitting module is connected to the base body. Accordingly, compared with the light-emitting module in which the flat substrate is thermally-conductively brought into face-contact with the base body, it becomes more difficult to efficiently conduct heat, which is generated by the LED chips of the light-emitting portions when the self-ballasted lamp is lit, to the base body. Therefore, the temperature of each light-emitting portion arranged in the air layer easily rises, and the life of each LED chip is shortened. Additionally, in order to suppress the temperature rise of the LED chips, power to be input to the LED chips is required to be reduced and light output is required to be suppressed.
Particularly, when a small mini-krypton type self-ballasted lamp is used, a base body is small in dimensions and sufficient radiation performance is hardly obtained from the base body. Therefore, not only in the case of using the three-dimensional substrate of the light-emitting module but also in the case of using the flat substrate of the module, a problem arises that sufficient radiation performance cannot be obtained only by thermal conduction to the base body.
The present invention has been made in view of the above problems and aims to provide a self-ballasted lamp capable of improving radiation performance, and lighting equipment.
A self-ballasted lamp of each embodiment includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element; and a support portion projected at one end side of the base body, and the light-emitting portions are respectively disposed at least on a circumferential surface. A light-transmissive member is interposed between the light-emitting module and an inner face of a globe.
Next, Embodiment 1 will be described with reference to
In
The base body 12 is made of metal such as aluminum excellent in thermal conductivity, and is formed in a cylindrical shape the diameter of which increases toward one end side of the base body.
The light-emitting module 13 includes: a three-dimensional support portion 21; a substrate 22 which is arranged along a surface of the support portion 21; and light-emitting portions 23 which are mounted on the substrate 22.
The support portion 21 is made of metal such as aluminum excellent in thermal conductivity, and an attachment portion 25 is formed at the other end of the support portion 21, the attachment portion 25 having a circumferential portion to be engaged with an inner edge portion of one end opening of the base body 12 and being thermally-conductively attached to the base body 12. On one end face of the support portion 21, a flat attachment face 26 is formed, a plurality of, for example, five-flat attachment faces 27 are formed on the outer circumferential faces around a lamp axis of the support portion 21, and therefore the support portion 21 is formed in a three-dimensional shape in accordance with the shape of the globe 14. An inclined face 28 for preventing interference with an inner face of the globe 14 is formed between the attachment face 26 of one end side and one end side of the circumferential attachment face 27 of the support portion 21.
The substrate 22 is integrally formed of, for example, a lead frame and flexible substrate, as shown in the development view of
For the light-emitting portion 23, an SMD (Surface Mount Device) package with connection terminals 36 on which an LED chip 35 as a semiconductor light-emitting element is loaded is used. In the SMD package 36, the LED chip 35 emitting, for example, blue light is arranged in a package and sealed with a phosphor layer 37 made of, for example, silicone resin in which a yellow phosphor is mixed which is excited by a part of the blue light emitted from the LED chip 35 and radiates yellow light. Accordingly, a surface of the phosphor layer 37 serves as a light-emitting face 38, and white-based light is radiated from the light-emitting face 38. Terminals (not shown) to be connected by soldering to the substrate 22 are arranged on a back face of the SMD package 36.
The center substrate portion 30 of the substrate 22, on which the plurality of light-emitting portions 23 are mounted, is fixed, by, for example, adhesive, to the attachment face 26 constituting one end face of the support portion 21, so that each outside substrate portion 31 is fixed along each attachment face 27 on the circumferential face of the support portion 21. Thus, the three-dimensional light-emitting module 13 is formed.
The globe 14 is made of, for example, synthetic resin or glass having light-transmissivity and light-diffuseness in a dome shape so as to contain and cover the three-dimensional light-emitting module 13. An edge portion of the other end opening of the globe 14 is engaged with and fixed to the base body 12 by adhesive or the like.
The light-emitting module 13 and the globe 14 are formed so that a distance L between the light-emitting face 38 of each light-emitting portion 23 of the light-emitting module 13 and the inner face of the globe 14 is 2 mm or less.
The light-transmissive member 15 is made of, for example, transparent resin such as transparent silicone resin, and a gap between a surface of the light-emitting module 13 and the inner face of the globe 14 is filled with the light-transmissive member 15 so that almost no air layer exists therebetween.
The cover 16 is made of, for example, an insulating material such as PBT resin, formed in a cylindrical shape the diameter of which increases toward one end side of the base body, and one end side of the cover 16 is fitted in the base body 12, and the other end side thereof is projected from the base body 12.
The cap 17 is, for example, an E17 type cap connectable to a socket for general illuminating bulbs, and has a shell 41 which is engaged with, caulked by and fixed to the other end of the cover 16 projecting from the base body 12; insulating portion 42 provided at the other end side of the shell 41; and an eyelet 43 provided at a top portion of the insulating portion 42.
The lighting circuit 18 is, for example, a circuit for supplying constant current to the LED chips 35 of the light-emitting module 13 and has a circuit substrate on which a plurality of circuit elements constituting the circuit are mounted, and the circuit substrate is housed and fixed in the cover 16. The shell 41 and eyelet 43 of the cap 17 are electrically connected to an input side of the lighting circuit 18 by electric wires. The connection portion 33 of the substrate 22 of the light-emitting module 13 is connected to an output side of the lighting circuit 18.
When the self-ballasted lamp 11 is energized by attaching the cap 17 to the socket 53 of the lighting equipment 51, the lighting circuit 18 operates, power is supplied to the LED chip 35 of each light-emitting portion 23 of the light-emitting module 13, the LED chip 35 emits light, and light radiated from the light-emitting face 38 of each light-emitting portion 23 is diffused and radiated through the light-transmissive member 15 and the globe 14.
A part of heat, which is generated from the LED chip 35 of each light-emitting portion 23 of the light-emitting module 13 when the self-ballasted lamp 11 is lit, is conducted to the substrate 22, the support portion 21 and the base body 12 in this order and radiated into the air from an outer surface of the base body 12.
Another part of the heat generated from the LED chip 35 of each light-emitting portion 23 of the light-emitting module 13 is directly conducted from the light-emitting portion 23 to the light-transmissive member 15, and is conducted from the light-emitting portion 23 to the substrate 22 and the support portion 21. The heat is then conducted from surfaces of the substrate 22 and support portion 21 to the light-transmissive member 15 and further conducted from the light-transmissive member 15 to the globe 14, and radiated from an outer face of the globe 14 into the air. Here, since no air layer having a low thermal conductivity exists between each light-emitting portion 23 and the globe 14, the heat is efficiently conducted from each light-emitting portion 23 to the globe 14.
According to the self-ballasted lamp 11 of the embodiment, since the light-transmissive member 15 having light-transmissivity is filled between the three-dimensional light-emitting module 13 and the inner face of the globe 14, when the self-ballasted lamp 11 is lit, the heat generated from the LED chips 35 is efficiently conducted to the globe 14 and can be efficiently radiated from the outer face of the globe 14, and radiation performance can be improved with use of the three-dimensional light-emitting module 13.
Thus, even in the case where a mini-krypton type small-sized self-ballasted lamp 11 is used, and the base body 12 is small in dimensions and sufficient radiation performance is hard to obtain from the base body 12, radiation performance can sufficiently be secured from the globe 14 and light output can be improved by increasing power to be input to the LED chips 35.
Since the three-dimensional light-emitting module 13 is used in which the light-emitting portions 23 are respectively arranged on the surfaces of the three-dimensional support portion 21, a surface area of the light-emitting module 13 can be made large, heat can be efficiently conducted from the light-emitting module 13 to the light-transmissive member 15 and the radiation performance can be further improved.
Since the distance L between the light-emitting portion 23 of the light-emitting module 13 and the inner face of the globe 14 is 2 mm or less, the heat generated from the LED chips 35 when the self-ballasted lamp 11 is lit can be further efficiently conducted to the globe 14 and the radiation performance can be further improved. Moreover, if the distance L between the light-emitting portion 23 of the light-emitting module 13 and the inner face of the globe 14 is thus 2 mm or less, compared with a distance L larger than 2 mm, the thermal conductivity from the light-emitting portions 23 to the globe 14 can be further improved. Additionally, as long as the light-emitting module 13 can be arranged in the globe 14 by, for example, elastically deforming the globe 14 in assembling the self-ballasted lamp 11, part of the light-emitting portions 23 of the light-emitting module 13 may come into contact with the inner face of the globe 14, that is, the distance L may be 0 mm.
Moreover, the light-emitting portions 23 may be respectively fixed to the surfaces of the support portion 21 via individual wiring substrates without use of the substrate 22. Additionally, the light-emitting portions 23 may be directly attached to the outer circumferential faces of the support portion 21, respectively. Additionally, it is permitted that, a housing space is formed inside the support portion 21 and the lighting circuit 18 is housed in the housing space for downsizing the lamp.
Next, Embodiment 2 will be described with reference to
In
The base body 12 is made of metal such as aluminum excellent in thermal conductivity and is formed in a cylindrical shape the diameter of which increases toward one end side of the base body. A cylindrical partitioning wall portion 63 having a closed top end is projected at the center of one end face of the base body 12, and a housing space 64, which is opened to the other end side of the base body 12 and houses the lighting circuit 18, is formed inside the partitioning wall portion 63. At a circumferential portion of one end face portion of the base body 12, an attachment portion 65 is projected. On the other end side of the base body 12, a heat radiating portion 66 exposed to the outside is formed. Heat radiating fins may be formed at the periphery of the heat radiating portion 66.
The light-emitting module 13 includes: a support portion 21 having, for example, a three-dimensional shape; a substrate 22 arranged along a surface of the support portion 21; and a plurality of light-emitting portions 23 mounted on the substrate 22.
The support portion 21 is made of, for example, insulating material such as PBT resin, and formed in the shape of a polygon such as hexagon, and one end side of the support portion 21 is formed in the shape of a pyramid such as a six-sided pyramid. That is, the support portion 21 is formed in a three-dimensional polyhedron shape in accordance with an inside shape of the globe 14. The inside of the support portion 21 is formed opening toward the other end side. The partitioning wall portion 63 of the base body 12 is inserted from the other end opening of the support portion 21, and arranged inside the light-emitting module 13.
The substrate 22 is integrally formed of, for example, a lead frame and flexible substrate, and has a plurality of circumferential substrate portions 68 arranged along circumferential faces of the support portion 21; and a plurality of top end substrate portions 69 arranged along top end faces of the support portion 21. The substrate portions 68 and 69 may be adhered and fixed to the surface of the support portion 21. The plurality of light-emitting portions 23 are provided on surfaces of the substrate portions 68 and 69.
Each light-emitting portion 23 has an LED chip 35 emitting, for example, blue light as a semiconductor light-emitting element, the LED chips 35 are mounted on the substrate 22 by a COB (Chip On Board) method. A phosphor layer 70 made of, for example, silicone resin, and covers and seals the LED chip 35, which is mounted on the substrate 22, in a dome shape is formed. A yellow phosphor, which is excited by a part of the blue light emitted from the LED chip 35 and radiates yellow light, is mixed in the phosphor layer 70. Accordingly, a surface of the phosphor layer 70 serves as a light-emitting face of the light-emitting portion 23, and white light is radiated from the light-emitting face.
The globe 14 is formed of a material such as synthetic resin or glass, which has light-transmissivity and light-diffuseness, in a dome shape so as to contain and cover the three-dimensional light-emitting module 13. An edge portion of the other end opening of the globe 14 is attached to the attachment portion 65 of the base body 12 by adhesive or the like.
The light-transmissive member 15 made of, for example, transparent resin such as silicone resin is, for example, interposed filling a gap between a surface of the light-emitting module 13 and an inner face of the globe 14 is filled with the member 15 so that almost no air layer exists. In the silicone resin used for the light-transmissive layer 15, inorganic particles mainly containing, for example, silica (SiO2) having an average particle diameter of about 3μ are dispersed at a rate of 3 (silicone resin):1 (inorganic powder) with respect to the silicone resin.
The insulating unit 61 has a thermal conductivity of 0.1 W/mk or less, and a heat insulating material made of glass wool having a thermal conductivity of 0.033 to 0.050 W/mk is used for the insulating unit 61. Moreover, as the insulating unit 61, polypropylene resin foam heat-insulating material, fumed silica, a calcium silicate heat-insulating material, a vacuum heat-insulating panel, etc., are usable in addition to the glass wool.
In order to make handling of the glass wool excellent, the glass wool is put in a sealable bag and formed into a flexible thin sheet by exhausting air in the bag, the glass wool in the bag is wound around the partitioning wall portion 63 of the base body 12 or arranged along an inner circumferential surface of the light-emitting module 13, the base body 12 and the light-emitting module 13 are coupled with each other, and thus the glass wool in the bag or the insulating unit 61, can be interposed between the base body 12 and the light-emitting module 13.
Alternatively, the glass wool is formed into a cylindrical shape by immersing phenol resin, and the cylindrical glass wool or the insulating unit 61 can be interposed between the base body 12 and the light-emitting module 13.
The heat insulting unit 61 is interposed between one end face of the base body 12, the partitioning wall portion 63 and the attachment portion 65, and the light-emitting module 13 and a part of the light-transmissive material 15, and thermally blocks completely at least between the base body 12 and the light-emitting module 13.
The cover 16 is cylindrically formed of, for example, an insulating material such as a PBT resin, its one end side is fixed to the base body 12 and the other end side thereof is projected from the base body 12.
The cap 17 is, for example, an E17 type cap connectable to a socket for general illumination bulbs and has a shell 41 engaged with, caulked by and fixed to the other end of the cover 16 projecting from the base body 12; an insulating portion 42 provided at the other end side of the shell 41; and an eyelet 43 provided at a top portion of the insulating portion 42.
The lighting circuit 18 is, for example, a circuit for supplying constant current to the LED chips 35 of the light-emitting module 13, and has a circuit substrate 72 on which a plurality of electronic components constituting the circuit are mounted, and the circuit substrate 72 is housed so as to be arranged over the housing space 64 inside the partitioning wall portion 63 of the base body 12, the inside of the cover 16 and the inside of the cap 17. An input side of the lighting circuit 18 is connected to the shell 41 and eyelet 43 of the cap 17 by electric wires, and an output side thereof is connected to the substrate 22 of the light-emitting module 13 by electric wires or the like.
The lighting circuit 18 includes, for example, a rectifying circuit for rectifying alternating current to direct current and a chopper circuit for converting the direct current, which is output from the rectifying circuit, to a predetermined voltage and supplying the voltage to LED chips. A smoothing electrolytic capacitor is used in the lighting circuit 18. However, since the electrolytic capacitor has a heatproof temperature lower than those of the other electronic components, etc., and is easily affected due to temperature rise of the lighting circuit 18, it is preferably mounted on the other end side, which is the cap 17 side located away from the light-emitting module 13, of the circuit substrate 72.
The self-ballasted lamp 11 thus constituted is a mini-krypton self-ballasted lamp size in which the length from the globe 14 to the cap 17 is 80 mm and the maximum diameter of the globe 14 is 45 mm, and the light-emitting module 13 has a current of 0.54 A, a voltage of 12.5V and a total light flux of 600 lm.
When the self-ballasted lamp 11 is energized by attaching the cap 17 to the socket 53 of the lighting equipment 51, the lighting circuit 18 operates, power is supplied to the LED chip 35 of each light-emitting portion 23 of the light-emitting module 13, the LED chips 35 emit light, and the light radiated from the light-emitting face of each light-emitting portion 23 is radiated through the light-transmissive member 15 and the globe 14. Since light-diffusing materials are dispersed in the light-transmissive member 15, the light is diffused and radiated through the globe 14.
Heat generated from the LED chip 35 of each light-emitting portion 23 of the light-emitting module 13 when the self-ballasted lamp 11 is lit is directly conducted from the light-emitting portion 23 to the light-transmissive member 15, and is conducted from the LED chips 35 to the substrate 22 and the support portion 21. The heat is then conducted from a surface of the substrate 22 to the light-transmissive member 15 and further conducted from the light-transmissive member 15 to the globe 14, and radiated from a surface of the globe 14 into the air. Here, since an air layer having a low thermal conductivity, etc., does not exist between the LED chip 35 of each light-emitting portion 23 of the light emitting module 13 and the globe 14, the heat from the LED chips 35 can be efficiently conducted to the globe 14, and high radiation performance from an outer face of the globe 14 can be secured. Thus, temperature rise of the LED chip 35 can be suppressed and the life of the LED chip 35 can be lengthened.
Since the insulating unit 61 is here interposed between the light-emitting module 13 and the base body 12, conduction of heat generated from the LED chips 35 of the light-emitting module 13 to the base body 12 and the lighting circuit 18 housed inside the base body 12 is suppressed.
Accordingly, almost all of the heat generated from the LED chips 35 of the light-emitting module 13 is radiated from the surface of the globe 14 through the light-transmissive member 15.
When the lighting circuit 18 operates, heat is generated from electronic components included in the lighting circuit 18 and conducted to the base body 12. The heat conducted to the base body 12 is radiated in the air from the heat radiating portion 66, which is exposed to the outside the base body 12. The heat generated from the lighting circuit 18 can be efficiently radiated by the metallic base body 12 having the partitioning wall portion 63 interposed between the insulating unit 61 and the lighting circuit 18 and the heat radiating portion 66 exposed to the outside.
Since the insulating unit 61 is here interposed between the light-emitting module 13 and the base body 12, heat conducted to the base body 12 is mainly composed of the heat generated from the lighting circuit 18, the heat generated from the lighting circuit 18 can be efficiently radiated from the heat radiating portion 66 of the base body 12 and the temperature rise of the lighting circuit 18 can be suppressed.
Accordingly, by the insulating unit 61, the light-emitting module 13 and the lighting circuit 18, which are heat generating sources respectively, are separated from each other, and thermal influence to each other can be suppressed.
When temperature distribution of the lit self-ballasted lamp 11 was measured for verifying effects of the insulating unit 61, a top portion of the light-emitting module 13 had a temperature TC1 of 89° C., and a portion, which is located inside the light-emitting module 13 of the circuit substrate 72 of the lighting circuit 18 had a temperature TC2 of 58° C. A difference ΔT between the temperatures was 31° C., and it was confirmed that conduction of the heat, which is generated from the LED chips 35 of the light-emitting module 13, to the lighting circuit 18 is suppressed by the insulating unit 61.
According to the self-ballasted lamp 11 of the present embodiment, reliability of the lighting circuit 18 can be improved, because the light-transmissive member 15 interposed between the light-emitting module 13 and the globe 14 allows the heat generated from the LED chips 35 to be efficiently conducted to the globe 14 and radiated from the surface of the globe 14, and the insulating unit 61 interposed between the light-emitting module 13 and the lighting circuit 18 can suppress the conduction of the heat from the LED chips 35 to the lighting circuit 18 and further suppress the temperature rise, which is caused by the heat from the LED chips 35, of the lighting circuit 18.
Thus, even when the small-sized mini-krypton type self-ballasted lamp 11 is used, high radiation performance from the globe 14 can be secured, the temperature rise of the LED chips 35 can be suppressed, the temperature rise of the lighting circuit 18 can also be suppressed, and thus light output can be improved by increasing power to be input to the LED chips 35.
Since plastic has a thermal conductivity of about 0.2 to 0.3 W/mk, conduction of the heat from the LED chips 35 to the lighting circuit 18 can be efficiently suppressed as long as the insulating unit 61 has a thermal conductivity of 0.1 W/mk or less.
Preferably, the insulating unit 61 has a thermal conductivity of 0.01 to 0.05 W/mk. In this case, a mini-krypton size self-ballasted lamp 11 having a diameter of 45 mm and a lamp power of 5 W or less can be provided. Further, preferably, the insulating unit 61 has a thermal conductivity of 0.01 W/mk or less. In this case, a mini-krypton size self-ballasted lamp 11 having a diameter of 45 mm and a lamp power of 5 W or larger can be provided.
Moreover, as the insulating unit 61, the following materials may be used in addition to glass wool having a thermal conductivity of 0.033 to 0.50 W/mk: a polypropylene resin foam heat-insulating material having a thermal conductivity of 0.036 W/mk; a calcium silicate heat-insulating material having a thermal conductivity of 0.07 W/mk; a vacuum heat-insulating panel having a thermal conductivity of 0.002 W/mk; and the like.
Additionally, as the insulating unit 61, an air layer may be used which is provided between the light-emitting module 13 and the lighting circuit 18. Since a thermal conductivity of the air layer rises from 0.033 W/mk by generation of a convection current, for example, a convection current suppressing unit for suppressing the convection current of air may be used, the suppressing unit being formed of aluminum foil which is wound into a plurality of layers and inserted into the air layer.
Alternatively, in the case where the insulating unit 61 is constituted by the air layer, a heat radiation suppressing unit may be used in which aluminum is vapor-deposited on an inner face of the light-emitting module 13 facing the lighting circuit 18 and formed into an aluminum mirror face having a low heat radiation rate. Although plastic has a heat radiation rate of 0.90 to 0.95, the aluminum mirror face has a heat radiation rate of about 0.05. Therefore, even in the case where the heat insulting unit 61 is constituted by the air layer, high insulation performance can be obtained.
Since the light-emitting module 13 is formed in the three-dimensional shape and a part of the lighting circuit 18 is housed and arranged in an inner space of the light-emitting module 13, the self-ballasted lamp 11 can be downsized. It is effective for thus downsizing the self-ballasted lamp 11 to use the insulating unit 61.
Although the lighting circuit 18 is arranged inside the light-emitting module 13 in the embodiment, not limited to this arrangement, the lighting circuit 18 may be arranged outside the light-emitting module 13. In this case, the lighting circuit 18 may be arranged inside the base body 12 and the cap 17, and the insulating unit 61 may be interposed between the lighting circuit 18 and the light-emitting module 13.
Moreover, at least a part of the light-transmissive member 15 comes into contact with the light-emitting module 13, and heat can be conducted at a surface side of the light-transmissive member 15. That is, selection of a material of the light-transmissive member 15 or a design on whether the whole or a part of light-emitting module 13 is covered can be made in accordance with the degree of need for heat radiation. Additionally, also a light-transmissive member 15 having a cavity therein is acceptable.
As the semiconductor light-emitting element, an EL (Electro Luminescence) chip can be used in addition to the LED chip.
Moreover, the self-ballasted lamp 11 in which the globe 14 is not used and the light-transmissive member 15 is integrally molded into a desired shape so as to constitute a light-emitting face of the sell-ballasted lamp 11 may be used.
Additionally, the self-ballasted lamp can also be used for a self-ballasted lamp using an E26 type cap.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-221637 | Sep 2009 | JP | national |
| 2009-242523 | Oct 2009 | JP | national |
This application is a Continuation of U.S. application Ser. No. 12/885,849 filed Sep. 20, 2010. U.S. application Ser. No. 12/885,849 claims priority under 35 U.S.C. §119 to Japanese Patent Application Nos. 2009-221637 and 2009-242523 filed on Sep. 25, 2009 and Oct. 21, 2009, respectively. The entirety of all of the above-listed applications are incorporated herein.
| Number | Name | Date | Kind |
|---|---|---|---|
| 1972790 | Olley | Sep 1934 | A |
| 4355853 | Kourimsky | Oct 1982 | A |
| 4503360 | Bedel | Mar 1985 | A |
| 4630182 | Moroi | Dec 1986 | A |
| 4939420 | Lim | Jul 1990 | A |
| 5323271 | Shimada | Jun 1994 | A |
| 5327332 | Hafemeister | Jul 1994 | A |
| D356107 | Watanabe et al. | Mar 1995 | S |
| 5537301 | Martich | Jul 1996 | A |
| 5556584 | Yamazaki | Sep 1996 | A |
| 5585697 | Cote | Dec 1996 | A |
| 5607228 | Ozaki et al. | Mar 1997 | A |
| 5632551 | Roney | May 1997 | A |
| 5685628 | Feger et al. | Nov 1997 | A |
| 5775792 | Wiese | Jul 1998 | A |
| 5785418 | Hochstein | Jul 1998 | A |
| 5857767 | Hochstein | Jan 1999 | A |
| 5947588 | Huang | Sep 1999 | A |
| 6095668 | Rykowski et al. | Aug 2000 | A |
| 6111359 | Work et al. | Aug 2000 | A |
| 6161910 | Reisenauer | Dec 2000 | A |
| 6186646 | Wiedemer | Feb 2001 | B1 |
| 6227679 | Zhang et al. | May 2001 | B1 |
| 6234649 | Katougi | May 2001 | B1 |
| 6294973 | Kimura | Sep 2001 | B1 |
| 6502968 | Simon | Jan 2003 | B1 |
| 6517217 | Liao | Feb 2003 | B1 |
| 6525668 | Petrick | Feb 2003 | B1 |
| 6598996 | Lodhie | Jul 2003 | B1 |
| 6641283 | Bohler | Nov 2003 | B1 |
| 6787999 | Stimac et al. | Sep 2004 | B2 |
| 6793374 | Begemann | Sep 2004 | B2 |
| D497439 | Shaw et al. | Oct 2004 | S |
| 6814470 | Rizkin et al. | Nov 2004 | B2 |
| 6936855 | Harrah | Aug 2005 | B1 |
| 6948829 | Verdes et al. | Sep 2005 | B2 |
| 6982518 | Chou et al. | Jan 2006 | B2 |
| 7059748 | Coushaine | Jun 2006 | B2 |
| 7074104 | Itaya | Jul 2006 | B2 |
| 7111961 | Trenchard | Sep 2006 | B2 |
| 7125146 | Willis | Oct 2006 | B2 |
| 7144140 | Sun et al. | Dec 2006 | B2 |
| D534665 | Egawa et al. | Jan 2007 | S |
| D535038 | Egawa et al. | Jan 2007 | S |
| 7157746 | Ota | Jan 2007 | B2 |
| 7165866 | Li | Jan 2007 | B2 |
| 7198387 | Gloisten et al. | Apr 2007 | B1 |
| 7226189 | Lee et al. | Jun 2007 | B2 |
| 7281818 | You | Oct 2007 | B2 |
| 7300173 | Catalano | Nov 2007 | B2 |
| 7329024 | Lynch | Feb 2008 | B2 |
| 7331689 | Chen | Feb 2008 | B2 |
| 7347589 | Ge | Mar 2008 | B2 |
| 7431477 | Chou et al. | Oct 2008 | B2 |
| 7497596 | Ge | Mar 2009 | B2 |
| 7625104 | Zhang et al. | Dec 2009 | B2 |
| 7631987 | Wei | Dec 2009 | B2 |
| 7679096 | Ruffin | Mar 2010 | B1 |
| 7744256 | Smester | Jun 2010 | B2 |
| 7824075 | Maxik | Nov 2010 | B2 |
| 7918587 | Hsu et al. | Apr 2011 | B2 |
| 7919339 | Hsu | Apr 2011 | B2 |
| 7947596 | Takeda | May 2011 | B2 |
| 7963686 | Hu | Jun 2011 | B2 |
| 8058782 | Lai | Nov 2011 | B2 |
| 8058784 | Treurniet | Nov 2011 | B2 |
| 8066417 | Balazs | Nov 2011 | B2 |
| 8072130 | Wang et al. | Dec 2011 | B2 |
| 8075172 | Davey | Dec 2011 | B2 |
| 8157418 | Kraus | Apr 2012 | B2 |
| 8226270 | Yamamoto et al. | Jul 2012 | B2 |
| 8547002 | Lenk et al. | Oct 2013 | B2 |
| 8653723 | Cao et al. | Feb 2014 | B2 |
| 8820950 | Matsuda et al. | Sep 2014 | B2 |
| 20020012246 | Rincover et al. | Jan 2002 | A1 |
| 20020024814 | Matsuba | Feb 2002 | A1 |
| 20020097586 | Horowitz | Jul 2002 | A1 |
| 20020118538 | Calon et al. | Aug 2002 | A1 |
| 20020145152 | Shimomura | Oct 2002 | A1 |
| 20020195918 | Matsuba et al. | Dec 2002 | A1 |
| 20030039122 | Cao | Feb 2003 | A1 |
| 20030063476 | English et al. | Apr 2003 | A1 |
| 20030117797 | Sommers et al. | Jun 2003 | A1 |
| 20030117801 | Lin | Jun 2003 | A1 |
| 20030137838 | Rizkin et al. | Jul 2003 | A1 |
| 20030151917 | Daughtry | Aug 2003 | A1 |
| 20040012955 | Hsieh | Jan 2004 | A1 |
| 20040109310 | Galli | Jun 2004 | A1 |
| 20040120156 | Ryan | Jun 2004 | A1 |
| 20040145898 | Ase et al. | Jul 2004 | A1 |
| 20040156191 | Biasoli | Aug 2004 | A1 |
| 20040218385 | Tomiyoshi | Nov 2004 | A1 |
| 20040232815 | Tomiyoshi et al. | Nov 2004 | A1 |
| 20050007772 | Yen | Jan 2005 | A1 |
| 20050024864 | Galli | Feb 2005 | A1 |
| 20050068776 | Ge | Mar 2005 | A1 |
| 20050073244 | Chou et al. | Apr 2005 | A1 |
| 20050111234 | Martin et al. | May 2005 | A1 |
| 20050162864 | Verdes et al. | Jul 2005 | A1 |
| 20050174769 | Yong | Aug 2005 | A1 |
| 20050243552 | Maxik | Nov 2005 | A1 |
| 20050254246 | Huang | Nov 2005 | A1 |
| 20060034077 | Chang | Feb 2006 | A1 |
| 20060043546 | Kraus | Mar 2006 | A1 |
| 20060092640 | Li | May 2006 | A1 |
| 20060193130 | Ishibashi | Aug 2006 | A1 |
| 20060193139 | Sun | Aug 2006 | A1 |
| 20060198147 | Ge | Sep 2006 | A1 |
| 20060215408 | Lee | Sep 2006 | A1 |
| 20060219428 | Chinda et al. | Oct 2006 | A1 |
| 20060227558 | Osawa | Oct 2006 | A1 |
| 20060239002 | Chou et al. | Oct 2006 | A1 |
| 20070002570 | Souza | Jan 2007 | A1 |
| 20070041182 | Ge et al. | Feb 2007 | A1 |
| 20070096114 | Aoki | May 2007 | A1 |
| 20070103904 | Chen | May 2007 | A1 |
| 20070247840 | Ham | Oct 2007 | A1 |
| 20070279903 | Negley | Dec 2007 | A1 |
| 20070285926 | Maxik | Dec 2007 | A1 |
| 20080002100 | Kaneko | Jan 2008 | A1 |
| 20080006911 | Nakahara et al. | Jan 2008 | A1 |
| 20080037255 | Wang | Feb 2008 | A1 |
| 20080080187 | Purinton | Apr 2008 | A1 |
| 20080084700 | Van De Ven | Apr 2008 | A1 |
| 20080084701 | Van De Ven | Apr 2008 | A1 |
| 20080112170 | Trott | May 2008 | A1 |
| 20080130298 | Negley | Jun 2008 | A1 |
| 20080173883 | Hussell | Jul 2008 | A1 |
| 20080224608 | Konishi | Sep 2008 | A1 |
| 20080289867 | Owens | Nov 2008 | A1 |
| 20090059595 | Ge | Mar 2009 | A1 |
| 20090116229 | Dalton | May 2009 | A1 |
| 20090116231 | Miller | May 2009 | A1 |
| 20090161356 | Negley | Jun 2009 | A1 |
| 20090175041 | Yuen et al. | Jul 2009 | A1 |
| 20090184616 | Van De Ven | Jul 2009 | A1 |
| 20090184646 | Devaney | Jul 2009 | A1 |
| 20090207602 | Reed | Aug 2009 | A1 |
| 20090257220 | Lenk | Oct 2009 | A1 |
| 20090294780 | Chou | Dec 2009 | A1 |
| 20090315442 | Rooymans | Dec 2009 | A1 |
| 20100026157 | Tanaka | Feb 2010 | A1 |
| 20100060130 | Li | Mar 2010 | A1 |
| 20100067241 | Lapatovich | Mar 2010 | A1 |
| 20100096992 | Yamamoto | Apr 2010 | A1 |
| 20100207534 | Dowling | Aug 2010 | A1 |
| 20100277082 | Reed | Nov 2010 | A1 |
| 20100287652 | Popi | Nov 2010 | A1 |
| 20100289396 | Osawa | Nov 2010 | A1 |
| 20100313983 | Aoki | Dec 2010 | A1 |
| 20110043120 | Panagotacos | Feb 2011 | A1 |
| 20110050133 | Grajcar | Mar 2011 | A1 |
| 20110079814 | Chen | Apr 2011 | A1 |
| 20110084956 | Choi | Apr 2011 | A1 |
| 20110090691 | Markle et al. | Apr 2011 | A1 |
| 20110139491 | Chang | Jun 2011 | A1 |
| 20110299695 | Nicholson | Dec 2011 | A1 |
| Number | Date | Country |
|---|---|---|
| 1264152 | Aug 2000 | CN |
| 1380704 | Nov 2002 | CN |
| 1433070 | Jul 2003 | CN |
| 1644978 | Jul 2005 | CN |
| 1880844 | Dec 2006 | CN |
| 201014266 | Jan 2008 | CN |
| 201081193 | Jul 2008 | CN |
| 101307887 | Nov 2008 | CN |
| 201180976 | Jan 2009 | CN |
| 101506934 | Aug 2009 | CN |
| 101521140 | Sep 2009 | CN |
| 10 2004 042186 | Mar 2006 | DE |
| 20 2008 016 231 | Apr 2009 | DE |
| 20 2008 016 868 | Apr 2009 | DE |
| 1 215 735 | Jun 2002 | EP |
| 1705421 | Sep 2006 | EP |
| 2037633 | Mar 2009 | EP |
| 2149742 | Feb 2010 | EP |
| 2 163 808 | Mar 2010 | EP |
| 57-152706 | Sep 1982 | JP |
| 59-035303 | Feb 1984 | JP |
| 61-35216 | Feb 1986 | JP |
| 62-190366 | Dec 1987 | JP |
| 63-5581 | Jan 1988 | JP |
| 63-102265 | May 1988 | JP |
| 64-7204 | Jan 1989 | JP |
| 1-206505 | Aug 1989 | JP |
| 2-91105 | Mar 1990 | JP |
| 2000-083343 | Mar 2000 | JP |
| 2000-173303 | Jun 2000 | JP |
| 2001-243809 | Sep 2001 | JP |
| 2002-093206 | Mar 2002 | JP |
| 2002-525814 | Aug 2002 | JP |
| 2002-280617 | Sep 2002 | JP |
| 2003-016808 | Jan 2003 | JP |
| 2003-051209 | Feb 2003 | JP |
| 2003-059305 | Feb 2003 | JP |
| 2003-59330 | Feb 2003 | JP |
| 2003-92022 | Mar 2003 | JP |
| 2003-303504 | Oct 2003 | JP |
| 2004-6096 | Jan 2004 | JP |
| 2004-119078 | Apr 2004 | JP |
| 2004-193053 | Jul 2004 | JP |
| 2004-221042 | Aug 2004 | JP |
| 2004-265730 | Sep 2004 | JP |
| 2005-93097 | Apr 2005 | JP |
| 2005-123200 | May 2005 | JP |
| 2005-513815 | May 2005 | JP |
| 2005-166578 | Jun 2005 | JP |
| 3112794 | Jul 2005 | JP |
| 3112794 | Jul 2005 | JP |
| 2005-217354 | Aug 2005 | JP |
| 2005-286267 | Oct 2005 | JP |
| 2006-040727 | Feb 2006 | JP |
| 3121916 | May 2006 | JP |
| 2006-156187 | Jun 2006 | JP |
| 2006-244725 | Sep 2006 | JP |
| 2006-286461 | Oct 2006 | JP |
| 2006-310057 | Nov 2006 | JP |
| 2006-313717 | Nov 2006 | JP |
| 2006-313718 | Nov 2006 | JP |
| 2007-059260 | Mar 2007 | JP |
| 2007-073306 | Mar 2007 | JP |
| 2007-073478 | Mar 2007 | JP |
| 2007-188832 | Jul 2007 | JP |
| 2007-207576 | Aug 2007 | JP |
| 2007-317573 | Dec 2007 | JP |
| 2008-027910 | Feb 2008 | JP |
| 2008-91140 | Apr 2008 | JP |
| 2008-103112 | May 2008 | JP |
| 2008-227412 | Sep 2008 | JP |
| 2008-277561 | Nov 2008 | JP |
| 2009-37995 | Feb 2009 | JP |
| 2009-117342 | May 2009 | JP |
| 2009-135026 | Jun 2009 | JP |
| 2009-164157 | Jul 2009 | JP |
| 2009-206104 | Aug 2009 | JP |
| 2009-535784 | Oct 2009 | JP |
| 2010-040223 | Feb 2010 | JP |
| WO 03056636 | Jul 2003 | WO |
| WO 2005024898 | Mar 2005 | WO |
| WO 2006118457 | Nov 2006 | WO |
| WO 2007130358 | Nov 2007 | WO |
| WO 2007130359 | Nov 2007 | WO |
| WO 2008146694 | Dec 2008 | WO |
| WO2009085231 | Jul 2009 | WO |
| WO 2009087897 | Jul 2009 | WO |
| Entry |
|---|
| English Language Abstract of JP 2001-243809, published Sep. 7, 2001. |
| English Language Abstract of JP Publication 01-206505 published Aug. 18, 1989. |
| English Language Abstract of JP Publication 2005-093097 published Apr. 7, 2005. |
| English Language Abstract of JP Publication 2005-123200 published May 12, 2005. |
| English Language Abstract of JP 2006-313718, published Nov. 16, 2006. |
| English Language Abstract of JP Publication 63-005581 published Jan. 11, 1988. |
| English Language Abstract of JP Publication 64-007402 published Jan. 11, 1989. |
| English Language Machine Translation of JP 2000-083343, published Mar. 21, 2000. |
| English Language Machine Translation of JP 2000-173303 published Jun. 23, 2000. |
| English Language Machine Translation of JP 2001-243809, published Sep. 7, 2001. |
| English Language Machine translation of JP 2003-59330 published Feb. 28, 2003. |
| English Language Machine Translation of JP 2004-006096 published Jan. 8, 2004. |
| English Language Machine Translation of JP 2004-193053 published Jul. 8, 2004. |
| English Language Machine Translation of JP 2005-166578 published Jun. 23, 2005. |
| English Language Machine translation of JP 2005-513815 published May 12, 2005. |
| English Language Machine translation of JP 2006-040727 published Feb. 9, 2006. |
| English Language Machine Translation of JP 2006-310057, published Nov. 9, 2006. |
| English Language Machine Translation of JP 2006-313718, published Nov. 16, 2006. |
| English Language Machine translation of JP 2008-91140 published Apr. 17, 2008. |
| English Language Machine Translation of JP 2009-37995, published Feb. 19, 2009. |
| English Language Machine Translation of JP 3121916, published May 10, 2006. |
| English Language Machine Translation of JP Publication 2005-093097 published Apr. 7, 2005. |
| English Language Machine Translation of JP Publication 2005-123200 published May 12, 2005. |
| English Language Machine translation of JP-2002-280617published Sep. 27, 2002. |
| English Language Machine translation of JP-2005-286267 published Oct. 13, 2005. |
| English Language Machine translation of JP-2006-244725 published Sep. 14, 2006. |
| English Language Machine Translation ofJP 2003-092022 published Mar. 28, 2003. |
| English Language Translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Oct. 20, 2009. |
| English Language Translation of International Search Report for PCT/JP2008/073436 mailed Mar. 24, 2009. |
| English translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Jul. 7, 2009. |
| English translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Aug. 25, 2009. |
| English Language Translation of Office Action issued in Japanese Appl 2005-221688 on Jan. 26, 2010. |
| Machine English language translation of JP-2003-016808 published Jan. 17, 2003. |
| Office Action issued in corresponding Japanese Appl 2005-221571 on Jul. 7, 2009. |
| Office Action issued in corresponding Japanese Appl 2005-221571 on Aug. 25, 2009. |
| Office Action issued in corresponding Japanese Appl 2005-221571 on Oct. 20, 2009. |
| Search Report of International Application No. PCT/JP2008/068625 mailed Dec. 9, 2008. |
| English Language Abstract of JP 2004-193053 published Jul. 8, 2004. |
| English Language Abstract of JP 2-91105 published Mar. 30, 1990. |
| English Language Abstract of JP 2000-173303 published Jun. 23, 2000. |
| English Language Abstract of JP 2003-092022 published Mar. 28, 2003. |
| English language abstract of JP-2002-280617 published Sep. 27, 2002. |
| English language abstract of JP-2003-016808 published Jan. 17, 2003. |
| English Language Abstract of 2003-59330 published Feb. 28, 2003. |
| English Language Abstract of JP 2005-166578 published Jun. 23, 2005. |
| English language abstract of JP-2005-286267 published Oct. 13, 2005. |
| English Language Abstract of JP 2006-040727 published Feb. 9, 2006. |
| English language abstract of JP-2006-244725 published Sep. 14, 2006. |
| English Language Abstract of JP 2008-91140 published Apr. 17, 2008. |
| English Language Abstract of JP 2004-006096 published Jan. 8, 2004. |
| Office Action issued in Japanese Appl 2005-221688 on Jan. 26, 2010. |
| English Language Abstract of JP 2009-37995, published Feb. 19, 2009. |
| English Language Abstract of JP 2000-083343, published Mar. 21, 2000. |
| English Language Abstract of JP 57-152706 published Sep. 21, 1982. |
| English Language Abstract of JP 2006-310057, published Nov. 9, 2006. |
| International Preliminary Report on Patentability and Written Opinion issued in PCT/JP2008/068625 mailed May 11, 2010. |
| Office Action issued in Japanese Appl 2005-371406 on Apr. 20, 2010. |
| English Translation of Office Action issued in Japanese Appl 2005-371406 on Apr. 20, 2010. |
| U.S. Appl. No. 12/825,650 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/794,379 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/794,429 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/794,476 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/794,509 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/794,558 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/811,795 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/738,081 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/713,230 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/825,956 electronically captured on May 15, 2014. |
| Japanese Office Action issued in JP 2008-198625 on May 26, 2010. |
| English Translation of Japanese Office Action issued in JP 2008-198625 on May 26, 2010. |
| Amendment filed in JP 2008-198625 on Jun. 28, 2010. |
| English Translation of Amendment filed in JP 2008-198625 on Jun. 28, 2010. |
| English Language Abstract of JP 2006-313717 published Nov. 16, 2006. |
| Machine English Translation of JP 2006-313717 published Nov. 16, 2006. |
| English Language Abstract of JP 2009-135026 published Jun. 18, 2009. |
| English Language Translation of JP 2009-135026 published Jun. 18, 2009. |
| English Language Abstract of JP 2002-525814 published Aug. 13, 2002. |
| English Language Translation of JP 2002-525814 published Aug. 13, 2002. |
| English Language Abstract of JP 2003-059305 published Feb. 28, 2003. |
| English Language Translation of JP 2003-059305 published Feb. 28, 2003. |
| English Language Abstract of JP 2007-188832 published Jul. 26, 2007. |
| English Language Translation of JP 2007-188832 published Jul. 26, 2007. |
| English Language Abstract of JP 2008-027910 published Feb. 7, 2008. |
| English Language Translation of JP 2008-027910 published Feb. 7, 2010. |
| English Language Abstract of JP 2007-207576 published Aug. 16, 2007. |
| English Language Translation of JP 2007-207576 published Aug. 16, 2007. |
| English Language Abstract of JP 2007-073306 published Mar. 22, 2007. |
| English Language Translation of JP 2007-073306 published Mar. 22, 2007. |
| U.S. Appl. No. 12/880,490 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/845,330 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/885,005 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/933,969 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/885,849 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/886,025 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/886,123 electronically captured on May 15, 2014. |
| U.S. Appl. No. 11/399,492 electronically captured on May 15, 2014. |
| Extended European Search Report issued in EP Appl 10006720.6 on Oct. 13, 2010. |
| English Language Abstract of JP 61-35216 published Feb. 2, 1986. |
| IPRP & WO issued in PCT/JP2008/073436 on Aug. 10, 2010. |
| English Language Abstract of JP 2006-156187 published Jun. 15, 2006. |
| English Language Translation of JP 2006-156187 published Jun. 15, 2006. |
| U.S. Appl. No. 13/044,369 electronically captured on May 15, 2014. |
| U.S. Appl. No. 12/888,921 electronically captured on May 15, 2014. |
| U.S. Appl. No. 13/034,959 electronically captured on May 15, 2014. |
| U.S. Appl. No. 13/172,557 electronically captured on May 15, 2014. |
| Extended European Search Report issued in EP 111560003.9 on May 18, 2011. |
| Extended European Search Report issued in EP 08838942.4 on Jun. 1, 2011. |
| English Language Abstract of JP 2008-277561 published on Nov. 13, 2008. |
| English Language Translation of JP 2008-277561 published on Nov. 13, 2008. |
| English Language Abstract of JP 2008-227412 published Sep. 25, 2008. |
| English Language Translation of JP 2008-227412 published Sep. 25, 2008. |
| Japanese Office Action issued in 2005-269017 on Jan. 13, 2011. |
| English Language Translation of Japanese Office Action issued in 2005-269017 on Jan. 13, 2011. |
| English Language Abstract of JP 2004-221042 published Aug. 5, 2004. |
| English Language Translation of JP 2004-221042 published Aug. 5, 2004. |
| English Language Abstract of JP 63-102265 published May 7, 1988. |
| English Language Abstract of JP 2009-206104 published Sep. 10, 2009. |
| English Language Translation of JP 2009-206104 published Sep. 10, 2009. |
| European Search Report issued in EP 10178361.1 on Jul. 4, 2011. |
| U.S. Appl. No. 13/221,519 electronically captured on May 15, 2014. |
| U.S. Appl. No. 13/221,551 electronically captured on May 15, 2014. |
| Chinese Office Action issued in CN 201010216943 on Oct. 26, 2011. |
| English Language Translation of Chinese Office Action issued in CN 201010216943 on Oct. 26, 2011. |
| English Language Abstract of CN 101307887 published Nov. 19, 2008. |
| English Language Translation of JP 2009/117342 published May 28, 2009. |
| English Language Abstract of JP 2009/117342 published May 28, 2009. |
| English Language Abstract of JP 2004-119078 published Apr. 15, 2004. |
| English Language Translation of JP 2004-119078 published Apr. 15, 2004. |
| Chinese Office Action issued in CN 201010121809.11 on Mar. 31, 2012. |
| English Translation of Chinese Office Action issued in CN 201010121809.11 on Mar. 31, 2012. |
| English Language Abstract and Claims of CN201149860 published Nov. 12, 2008. |
| English Language Abstract and Claims of CN201072113 published Jun. 11, 2008. |
| English Language Abstract of CN2602514 published Feb. 4, 2004. |
| Extended European Search Report for EP 10179580.5, dated May 24, 2012. |
| Chinese Office Action issued in CN 201010243165.3 on Jul. 17, 2012. |
| English Language Translation of Chinese Office Action issued in CN 201010243165.3 on Jul. 17, 2012. |
| English Language Abstract of CN 1264152 published Aug. 23, 2000. |
| Chinese Office Action issued in CN2010102793033 on Jul. 10, 2012. |
| English Language Translation of Chinese Office Action issued in CN2010102793033 on Jul. 10, 2012. |
| English Language Abstract of JP 2005-217354 published Aug. 11, 2005. |
| English Language Translation of JP 2005-217354 published Aug. 11, 2005. |
| English Language Abstract of JP 2006-286461 published Oct. 19, 2006. |
| English Language Translation of JP 2006-286461 published Oct. 19, 2006. |
| English Language Abstract of WO 2009/085231 published Jul. 9, 2009. |
| English Language Abstract of CN 1644978 published Jul. 27, 2005. |
| Chinese Office Action issued in CN 201010292756 dated Jun. 29, 2012. |
| English Language Translation of Chinese Office Action issued in CN 201010292756 dated Jun. 29, 2012. |
| English Language Abstract of CN 201014266 published Jan. 30, 2008. |
| Chinese Office Action issued in CN 201010292760.6 dated Sep. 10, 2012. |
| English Language Translation of Chinese Office Action issued in CN 201010292760.6 dated Sep. 10, 2012. |
| English Language Abstract of CN 201081193 published Jul. 2, 2008. |
| English Language Abstract of CN 1380704 published Nov. 20, 2002. |
| English Language Abstract of CN 101521140 published Sep. 2, 2009. |
| English Language Abstract of CN 101506934 published Aug. 12, 2009. |
| English Language Abstract of CN 201180976 published Jan. 14, 2009. |
| English Language Abstract of CN 1880844 published Dec. 20, 2006. |
| Chinese Office Action issued in CN 201010292771.4 dated Jun. 19, 20123. |
| English Language Translation of Chinese Office Action issued in CN 201010292771.4 dated Jun. 19, 20123. |
| Japanese Office Action issued in JP2009-219771 on Aug. 9, 2012. |
| English Language Translation of Japanese Office Action issued in JP2009-219771 on Aug. 9, 2012. |
| English Language Abstract of JP 2009-164157 published Jul. 23, 2009. |
| English Language Translation of JP 2009-164157 published Jul. 23, 2009. |
| Chinese Office Action issued in CN201010287917.6 dated Jun. 27, 2012. |
| English Language Translation of Chinese Office Action issued in CN201010287917.6 dated Jun. 27, 2012. |
| English Language Abstract of CN 1433070 published Jul. 30, 2003. |
| Chinese Office Action issued in CN 201010216943 on Jul. 11, 2012. |
| English Language Translation of Chinese Office Action issued in CN 201010216943 on Jul. 11, 2012. |
| Chinese Office Action issued in CN 200910176110.2 dates Jul. 4, 2012. |
| English Language Translation of Chinese Office Action issued in CN 200910176110.2 dates Jul. 4, 2012. |
| Japanese Office Action issued in JP 2010-042528 on Nov. 14, 2012. |
| English Language Translation of Japanese Office Action issued in JP 2010-042528 on Nov. 14, 2012. |
| English Language Abstract of JP 2010-040223 published Feb. 18, 2010. |
| English Language Translation of JP 2010-040223 published Feb. 18, 2010. |
| English Language Abstract of JP 2007-073478 published Mar. 22, 2007. |
| English Language Translation of JP 2007-073478 published Mar. 22, 2007. |
| English Language Abstract of JP 2002-093206 published Mar. 29, 2002. |
| English Language Translation of JP 2002-093206 published Mar. 29, 2002. |
| Japanese Office Action issued in JP 2009-221637 on Mar. 13, 2013. |
| English Language Translation of Japanese Office Action issued in JP 2009-221637 on Mar. 13, 2013. |
| English Language Abstract of JP 2007-059260 published Mar. 8 , 2007. |
| English Language Translation of JP 2007-059260 published Mar. 8 , 2007. |
| English Language Translation of JP 3112794 published Jul. 13, 2005. |
| Extended European Search Report issued in EP10178363.7 on Mar. 14, 2013. |
| Japanese Office Action issued in JP 2009-221637 published May 22, 2013. |
| English Language Translation of Japanese Office Action issued in JP 2009-221637 published May 22, 2013. |
| English Language Abstract of JP 2004-265730 published Sep. 24, 2004. |
| English Language Translation of JP 2004-265730 published Sep. 24, 2004. |
| English Language Abstract of JP 2007-317573 published Dec. 6, 2007. |
| English Language Translation of JP 2007-317573 published Dec. 6, 2007. |
| U.S. Appl. No. 12/794,476 electronically captured on Jul. 17, 2014. |
| U.S. Appl. No. 12/794,509 electronically captured on Jul. 17, 2014. |
| U.S. Appl. No. 12/713,230 electronically captured on Jul. 17, 2014. |
| U.S. Appl. No. 13/221,519 electronically captured on Jul. 17, 2014. |
| U.S. Appl. No. 13/221,551 electronically captured on Jul. 17, 2014. |
| Japanese Office Action issued in JP 2013-178725 on Apr. 17, 2014. |
| English Language Translation of Japanese Office Action issued in JP 2013-178725 on Apr. 17, 2014. |
| English Language Translation of JP 2009-535784 published on Oct. 1, 2009. |
| Japanese Office Action issued in JP 2013/178725 on Oct. 15, 2014 with English Language Translation. |
| English Language Abstract of JP 3112794 U published Jul. 13, 2005. |
| English Language Abstract of JP 2008-103112 published on May 1, 2008. |
| English Language Abstract of JP 2003-303504 published on Oct. 24, 2003. |
| Number | Date | Country | |
|---|---|---|---|
| 20140145590 A1 | May 2014 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12885849 | Sep 2010 | US |
| Child | 14170130 | US |
