1. Field of the Invention
The invention is generally related to self-healing and adaptive materials. Particularly, the invention is directed to materials which can alter their internal mass distribution in response to stress gradients in order to optimally utilize the available structural substance in critical areas subjected to stress and temperature rise.
2. Description of the Relevant Art
Altering service environments as well as damaging effects change the stress distribution within structures. Biological systems such as bone are capable of adapting to changes in stress distribution through transport of substance towards and its deposition at highly stressed areas. This adaptive/self-healing capability enables biological structural systems make optimal use of available materials as new circumstances evolve. Various efforts have been made to develop synthetic materials which mimic the self-healing/adaptive qualities of biological systems.
U.S. Pat. No. 6,518,330 discloses a self-healing material with the polymeric healing agent stored in microspheres which are dispersed within the material systems. Damage (cracking) of the material would cause breakage of the microspheres and release of the healing agent, which fills the crack and rebonds the crack faces. U.S. Pat. No. 5,790,304 discloses self-healing coatings incorporating sacrificial constituents which react with oxygen at defects (e.g., cracks and voids) to produce compounds which condense on such defects and thereby restore the integrity of coating. U.S. Pat. No. 5,965,266 discloses a self-healing high-temperature materials incorporating constituents capable of reacting with oxygen to produce compounds to plug cracks and mitigate access of oxygen to the core of the material. U.S. Pat. No. 4,599,256 discloses a high-temperature material incorporating multiple constituents which, when exposed to the elevated service temperature at cracks, react with each other to produce compounds which seal the cracks. U.S. Pat. No. 5,738,664 discloses a material incorporating a viscous flowable constituent which can flow into defects to restore the integrity of the material.
The above inventions rely on damaging effects (e.g., cracks) to either release the healing agent or to promote chemical reactions (e.g., upon exposure to oxygen) which render self-healing and adaptive effects. Unlike the invention described herein, they do not rely on electrolytic mass transport to strengthen highly stressed areas, and they do not convert the destructive mechanical energy concentrated in critical areas to electrical potential and energy which guide and drive the self-healing/adaptive effects.
It is an object of this invention to provide solid material systems within which substance can be transported for an optimum mass distribution to be realized.
It is another object of this invention to convert the destructive mechanical energy concentrated within critical areas of the material into the electrical energy needed to drive the mass transport phenomenon.
It is another object of this invention to convert the stress gradients within the material into the electric potential which guides transport of mass towards critical areas.
It is another object of this invention to integrate the energy conversion and mass transport capabilities into a material system which is inherently capable of transporting substance towards critical areas to render self-healing and adaptive effects.
Applicant has discovered that electrolytic transport and electrodeposition of mass within solid electrolytes can strengthen and densify areas within which electrodeposition has taken place. Applicant has also discovered that the piezoelectric effect can generate sufficient electric potential and energy, by conversion of mechanical energy, to drive and guide electrolytic mass transport within solid electrolyte.
According to the invention, there is provided composite materials incorporating a solid electrolyte a piezoelectric material, which can strengthen and densify highly stressed areas through electrolytic mass transport and electrodeposition.
Damaging effects, changes in service environment and manufacturing defects modify the stress distribution which develop within materials, with local stress rise occurring in critical areas which govern the eventual failure. This invention concerns composite shaped articles that can optimally utilize their available material resources through partial transport of these resources towards critical areas which experience local stress rise, where the increased material concentration can render strengthening and densification effects to mitigate the initiation or propagation of damage.
Solid electrolytes are solids which can dissolve metal salts. Electrolytic phenomena can occur within solid electrolytes, and can be used to transport structural substance towards and to deposit it at particular locations in order to strengthen such locations. The structural substance is present in solid electrolyte in the form of dissolved salt; additional structural substance can be introduced in the form of metals which are in contact with the solid electrolyte.
The electrolysis phenomena within solid electrolyte can be guided and driven by the piezoelectric effect. Piezoelectric materials generate electric potential and charge under stress gradient. If piezoelectric materials are in proper contact with a solid electrolyte, the electric potential resulting from stress gradients can guide, and the corresponding electric charge can drive electrolytic phenomena within the solid electrolyte to transport structural substance towards and deposit it at critical areas experiencing stress rise. The combination of solid electrolyte with a piezoelectric material can thus be used to develop material systems which can partially adapt their internal mass distribution to internal stress systems which are altered by at least one of damaging effects, changing service environments, and manufacturing defects.
Material systems incorporating solid electrolyte, piezoelectric and optionally other constituents can assume different configurations. One configuration introduces the solid electrolyte and the piezoelectric constituents as a multilayer coating system on reinforcing fibers in composites. One other configuration comprises solid electrolyte matrices reinforced with piezoelectric fibers; yet another configuration is in the form of laminated composites comprising solid electrolyte, piezoelectric and optionally other layers.
Solid electrolytes were prepared with dissolved metal salt, without and with fine copper filler. Electrolysis phenomena occurring in the context of a solid electrolyte, causing electrodeposition of metal at cathode, were verified experimentally.
Poly(acrylonitrile) (PAN, Mw=86,200), ethylene carbonate (EC, 98%), propylene carbonate (PC, 99%), copper (II) trifluoromethanesulfonate (CuTf, 98%), copper powder (3 micron, dendritic, 99.7%), and acetonitrile (99.93%+, HPLC grade) were purchased from Aldrich, and were used without any further purification. The use of copper slat in this investigation implies that copper is the metal to be ionically transported and electrodeposited to render self-healing effects. A variety of other metals (nickel, etc.) can replace copper in the process.
PAN (1.06 g or 20 mole %), EC (3.6 g or 41 mole %) and CuTf (1.8 g or 5 mole %) were weighed into a ceramic crucible and mixed well before adding PC (3.4 g or 34 mole %). PC was then added, and the blend was stirred until thorough dissolution and a mixture of uniform light blue color was obtained. The mixture was then heated to 120° C. and maintained at this temperature for 45 minutes (using a temperature-programmed oven with heating rate of 20° C./min, and total heating duration of 51 minutes). The mixture was allowed to cool down to room temperature, and was then vacuum dried for 24 hours, and further dried at 60° C. under vacuum for 2 hours. The end product was light green in color, and it was pressed to yield the test specimen.
Preparation of Solid Electrolyte with Copper Filler
The copper salt dissolved in solid electrolyte can act as the source of metallic ion to be transported and deposited for self-healing effects. In addition, one can add copper fillers to raise the quantity of metal available to render self-healing effects. In order to prepare the PAN-based solid electrolyte incorporating copper filler, first PAN, EC and CuTf were weighed in a ceramic crucible, and mixed well before adding PC. PC was then added, and the mix was magnetically stirred until thorough dissolution (a uniform mixture) was achieved after about 1 hour. Different amounts of copper particles were then added to the mix and magnetically stirred until a mixture with uniform light brown/blue color was obtained; the intensity of brown color depended on the dosage of copper filler. The mixture incorporated 1.0 g of water for 10% filler content. The remaining steps in synthesis and pressing of solid electrolyte specimens with copper filler were similar to those taken for the specimen without filler.
The solid electrolyte was tightly sandwiched between two aluminum electrodes, as shown in
Since the solid electrolyte has some copper salt dissolved in it, even with no copper filler added to the solid electrolyte, indications of electrodeposition of copper was observed to occur on the aluminum sheet at cathode, as shown in
Copper fillers were added to the PAN-based solid electrolyte to complement the dissolved metal salt as the source of metal for electrolysis processes which render self-healing effects. In the case of solid electrolyte with metallic filler, dispersed copper fillers as well as the dissolve copper salt were the sources of copper for the electrolysis process.
Materials: The materials used for preparation of PVDF-HFP solid electrolyte included poly(vinylidine fluoride-co-hexafluropropylene) (PVDF-HFP) (pellets, crystalline copolymer, 15% HFP, average Mw˜400,000), ethylene carbonate (EC, 98%), propylene carbonate (PC, 99%), copper (II) trifluoromethanesulfonate (CuTf, 98%), and tetrahydrofuran (THF, 99.9+ HPLC grade, inhibitor free). The electrodes were made of 50 micron thick stainless steel shims. The copper salt was used in this verification study as an example; other metal salts could replace the copper salt to yield self-healing and adaptive effects by deposition of metals with higher performance-to-weight rations than copper.
Two different solid electrolytes were prepared by varying the proportions of copper salt, EC and PC while keeping the PVDF-HFP percentage constant. In order to prepare the solid polymer electrolyte with 3% copper ion concentration, PVDF-HFP was dissolved in THF (30% by weight, 3 g) at 60° C. Subsequently, CuTf (1.8084 g), EC (3.5224 g) and PC (1.7865 g) were added to the mix (70% by weight at CuTf:EC:PC ratios of 1.0:8.0:3.5), and dissolved until a uniform solution was obtained. The solution was cast on a Petri dish, and left at room temperature until all the THF was evaporated. A free standing polymer sheet of blue/green color was obtained, which was cut into pieces for use in electrochemical experiments. Since the most common coordination number of copper is four, each copper ion will bind with four fluorine atoms. This defines the maximum copper ion-to-polymer molar ratio of 2, which guides our efforts to increase the concentration of copper ions in PVDF-HFP.
In order to prepare the solid polymer electrolyte with 6% copper ion concentration, PVDF-HFP was dissolved in THF (30% by weight, 3 g) at 60° C. Subsequently, CuTf (3.6168 g), EC (1.7612 g) and PC (0.89325 g) were added to the mix (70% by weight at CuTf plus EC plus PC), and dissolved until a uniform solution was obtained. The solution was cast on a Petri dish, and left at room temperature until all the THF was evaporated. A free standing polymer sheet of blue/green color was obtained, which was cut into pieces for use in electrochemical experiments. Since the most common coordination number of copper is four, each copper ion will bind with four fluorine atoms. This defines the maximum copper ion-to-polymer molar ratio of 2, which guides efforts to increase the concentration of copper ions in PVDF-HFP.
In order to validate piezo-induced electrolysis within solid electrolyte, PVDF-HFP specimens with dissolve copper salt was sandwiched between two stainless steel electrodes, as shown in
The experimental results provided clear evidence of metal deposition at cathode interface under piezo-driven electrolysis in solid electrolyte.
This invention was made with U.S. government support under Contract W911W6-04-C-0024 by U.S. Army. The U.S. government has certain rights in the invention.
Number | Date | Country | |
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Parent | 10887683 | Jul 2004 | US |
Child | 12459872 | US |