Patent Application
20180155501
This application claims, under 35 U.S.C. § 119, the priority of Korean Patent Application No. 10-2016-0165688 filed on Dec. 7, 2016 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a self-healing polysilsesquioxane and a hybrid film using the same.
Crosslinked polymer materials have been studied and used in various applications due to superior mechanical properties, thermal stability, solvent resistance, etc. However, because the crosslinked polymer materials are sensitive to unexpected mechanical damage caused by continued force and external impact, they have limited life span in recycling.
In order to solve this problem, the development of self-healing polymer materials is drawing attentions as a new technology. Self-healing polymers can be largely classified into 1) extrinsic self-healing polymers and 2) intrinsic self-healing polymers. The extrinsic self-healing polymers self-heal by a healing additive injected directly thereinto, whereas the intrinsic self-healing polymers self-heal through chemical bonding.
In particular, regarding the preparation of intrinsic self-healing polymers, the Diels-Alder reaction whereby crosslinkages are formed reversibly depending on temperature. Many self-healing polymer materials have been proposed through theses and patents and self-healing polymers using the organic-inorganic hybrid material polysilsesquioxane have also been studied a lot.
However, the existing self-healing polymer materials require a process of blending dienes and dienophiles for the Diels-Alder reaction, which renders problems in compatibility and uniformity on a nanoscale level. In addition, they have the problems of nonuniform film surface, low transparency, imperfect crosslinkage and inability of recycling.
Korean Patent Registration No. 10-0932765.
In order to solve the problems described above, the present disclosure is directed to preparing a self-healing polysilsesquioxane copolymer and providing a hybrid film that can be used in various applications such as a gas separation membrane, etc. using the copolymer.
In an aspect, the present disclosure relates to a self-healing polysilsesquioxane copolymer represented by Chemical Formula 1:
wherein
each of R1 through R6, which are different from each other, is independently hydrogen or —R7—R8,
R7 is a valence bond or C1-C6 alkyl,
R8 is selected from a group consisting of a valence bond, C1-C6 alkyl, —OR9, an organic functional group containing a diene and an organic material containing a dienophile,
R9 is selected from a group consisting of a hydrogen, C1-C5 alkyl, acryl, epoxy and epoxycyclohexyl,
x is an integer from 1 to 10,000,
y is an integer from 1 to 10,000, and
z is an integer from 1 to 10,000.
In another aspect, the present disclosure relates to hybrid film containing the polysilsesquioxane copolymer.
In another aspect, the present disclosure relates to a gas separation membrane containing the polysilsesquioxane copolymer.
According to the present disclosure, a polysilsesquioxane copolymer which can self-heal within several minutes at 100-120° C. after being crosslinked at 80-100° C. can be provided. The polysilsesquioxane copolymer, having a diene and a dienophile introduced together in the copolymer, can be used as a single material.
In addition, because the self-healing polysilsesquioxane copolymer significantly improves physical properties such as heat resistance, mechanical strength, light transmittance, solubility and processability when applied to a hybrid material such as a film, it is widely applicable as a coating material for displays or automobiles, in addition to gas separation membranes.
Hereinafter, various aspects and exemplary embodiments of the present disclosure are described in more detail.
In an aspect, the present disclosure provides a self-healing polysilsesquioxane copolymer represented by Chemical Formula 1:
wherein
each of R1 through R6, which are different from each other, is independently hydrogen or —R7—R8,
R7 is a valence bond or C1-C6 alkyl,
R8 is selected from a group consisting of a valence bond, C1-C6 alkyl, —OR9, an organic functional group containing a diene and an organic material containing a dienophile,
R9 is selected from a group consisting of a hydrogen, C1-C5 alkyl, acryl, epoxy and epoxycyclohexyl,
x is an integer from 1 to 10,000,
y is an integer from 1 to 10,000, and
z is an integer from 1 to 10,000.
More specifically, R1 and R2 are identical and an organic functional group containing a diene, R3 and R4 identical and an organic material containing a dienophile, and R5 and R6 are —R7—R8. Further more specifically, R7 is C1-C6 alkyl and R8 is C1-C6 alkyl or —OR9, wherein R9 is acryl, epoxy or epoxycyclohexyl.
A Diels-Alder reaction occurs between the organic functional group containing a diene and the organic material containing a dienophile when heat is applied to the polysilsesquioxane copolymer. The Diels-Alder reaction occurs according to Scheme 1. As a result, the polysilsesquioxane copolymer has thermal reversibility.
That is to say, the polysilsesquioxane copolymer forms a crosslinked copolymer within a predetermined temperature range through the Diels-Alder reaction between the organic functional group containing a diene and the organic material containing a dienophile. Crosslinkages may be formed via the Diels-Alder reaction between the organic functional group containing a diene and the organic material containing a dienophile and destroyed via the reverse reaction known as the retro-Diels-Alder reaction.
Specifically, the organic functional group containing a diene may be represented by Chemical Formula 2 and the organic material containing a dienophile may be represented by Chemical Formula 3:
wherein each of R1 through R5, which are different from each other, is independently hydrogen, substituted or unsubstituted branched C1-C30 alkyl or C3-C10 cycloalkyl, wherein the substitution is with an amine or hydroxyl functional group. In Chemical Formulas 2 and 3, at least one of R1 through R5 may be substituted with a trialkoxysilane group to be used as a polymerization monomer of a silsesquioxane.
More specifically, in Chemical Formula 2-3, each of R1 through R5, which are different from each other, may be independently hydrogen or C1-C5 alkyl. In this case, the self-healing is achieved quickly within several minutes. When R1 through R5 are other functional groups, the self-healing is achieved very slowly within several hours.
Specifically, the polysilsesquioxane copolymer may have a number-average molecular weight (Mn) of 100-100,000. Outside this range, the copolymer exhibits physical properties which are difficult for film formation.
In particular, the polysilsesquioxane copolymer may be a ladder-type polysilsesquioxane (LPSQ). Because this structure is structurally stable and exhibits high thermal stability and good compatibility with an organic solvent, it is useful as an organic-inorganic hybrid material.
If the polysilsesquioxane copolymer is a polyoctahedral polyhedral silsesquioxane (POSS), it is difficult to be prepared into a film because it has a small molecular weight and is crystalline. In addition, it is difficult to be applied industrially due to unsatisfactory physical properties.
More specifically, the polysilsesquioxane copolymer may have a structure of one of Chemical Formulas 1a to 1g.
Once being crosslinked at 80-100° C., the ladder-type polysilsesquioxane copolymer self-heals at 100-120° C. within several minutes, as demonstrated in the examples described later and
In an exemplary embodiment, the ladder-type polysilsesquioxane copolymer may be prepared by reacting a trialkoxysilane monomer, an organic material containing a diene and an organic material containing a dienophile at 20-30° C. for 50-150 hours and then purifying the product, as shown in Scheme 2.
In another exemplary embodiment, a non-ladder-type polysilsesquioxane copolymer may be synthesized selectively by preparing a water-containing organic solution containing a trialkoxysilane monomer, an organic solvent, water and a catalyst and then controlling the amount of the organic solvent or water in the water-containing organic solution, although not being limited thereto.
In another aspect, the present disclosure relates to a hybrid film containing the polysilsesquioxane copolymer. Specifically, the hybrid film (thickness: 1 nm to 500 μm) may have a light transmittance of 80-100% at a wavelength of 500-800 nm. Therefore, the hybrid material is widely applicable as a coating material for displays or automobiles.
In addition, the hybrid film containing the polysilsesquioxane copolymer containing a photocurable organic functional group may be prepared into a high-strength thermosetting hybrid film through a primary photocuring process.
In another aspect, the present disclosure relates to a gas separation membrane containing the polysilsesquioxane copolymer.
Hereinafter, the present disclosure will be described in more detail through examples. However, the scope of the present disclosure is not reduced or limited by the following examples. It will be obvious that those of ordinary skill in the art can easily carry out the present disclosure for which experimental results are not specifically described on the basis of the disclosure of the present disclosure including the examples and that such modifications and changes belong to the scope of the present disclosure.
The experimental results presented below are only representative experimental results of the examples and comparative examples.
a) 0.01 g of potassium carbonate as a catalyst previously dissolved in 1.2 g of distilled water was stirred with 2 g of tetrahydrofuran for 20 minutes.
b) 0.04 mol of N-(3-trimethoxysilylpropyl)pyrrole (ABCR, 95%) as an organic material containing a diene and 0.04 mol of ethyltrimethoxysilane (ABCR, 97%) as an organic material containing a dienophile were added dropwise to the solution of a) with stirring. Upon completion of the addition, the mixture was reacted at 25° C. for 96 hours. After purification by fractional distillation using a water-immiscible solvent that can dissolve polysilsesquioxane-based materials, such as chloroform, methylene chloride, toluene, xylene, etc., a ladder-type polysilsesquioxane represented by Chemical Formula 1a was synthesized (Mw=13,000 (based on polystyrene), yield=95%).
a) The same procedure as in Example 1 was conducted.
b) 0.016 mol of propyltrimethoxysilane, 0.032 mol of N-(3-trimethoxysilylpropyl)pyrrole and 0.032 mol of 2-(3-cyclohexenyl)ethyltrimethoxysilane were added dropwise to the solution of a) with stirring. Upon completion of the addition, the mixture was reacted at 25° C. for 96 hours. After purification by fractional distillation using a water-immiscible solvent that can dissolve polysilsesquioxane-based materials, such as chloroform, methylene chloride, toluene, xylene, etc., a ladder-type polysilsesquioxane represented by Chemical Formula 1b was synthesized (Mw=23,000 (based on polystyrene), yield=95%).
A ladder-type polysilsesquioxane represented by Chemical Formula 1c was synthesized in the same manner as in Example 2, except that hexyltrimethoxysilane was used instead of the propyltrimethoxysilane (Mw=11,000 (based on polystyrene), yield=95%).
A ladder-type polysilsesquioxane represented by Chemical Formula 1d was synthesized in the same manner as in Example 2, except that dodecyltrimethoxysilane was used instead of the propyltrimethoxysilane (Mw=11,000 (based on polystyrene), yield=95%).
A ladder-type polysilsesquioxane represented by Chemical Formula 1e was synthesized in the same manner as in Example 2, except that 3-acryloxypropyltrimethoxysilane was used instead of the propyltrimethoxysilane (Mw=13,000 (based on polystyrene), yield=95%).
A ladder-type polysilsesquioxane represented by Chemical Formula 1f was synthesized in the same manner as in Example 2, except that 3-glycidoxypropyltrimethoxysilane was used instead of the propyltrimethoxysilane (Mw=12,000 (based on polystyrene), yield=95%).
A ladder-type polysilsesquioxane represented by Chemical Formula 1g was synthesized in the same manner as in Example 2, except that 2-3-cyclohexylepoxyethyltrimethoxysilane was used instead of the propyltrimethoxysilane (Mw=10,000 (based on polystyrene), yield=95%).
The polysilsesquioxane copolymers of Examples 1-4 were prepared into transparent solutions by dissolving in tetrahydrofuran to 50 wt %. The solution was drop-casted on a glass substrate. After drying at room temperature for a day and then drying in vacuo at 40° C. for 2 hours, a 50-μm-thick hybrid film was prepared.
(a) A transparent solution was prepared by dissolving each of the self-healing polysilsesquioxanes prepared in Examples 5-7 in tetrahydrofuran to 50 wt %. A transparent solution was prepared by adding 1 wt % 1-hydroxycyclohexyl phenyl ketone (Irgacure 184, BASF) as a photoinitiator to the solution of Example 5 (LPAPCSQ244) and 3 wt % (4-methylphenyl)[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate (Irgacure 250, BASF) as a photoinitiator to the solutions of Example 6 (LPGPCSQ244) and Example 7 (LPCEPCSQ244).
(b) The solution was drop-casted on a glass substrate. After drying at room temperature for a day and then drying in vacuo at 40° C. for 2 hours, a 50-μm-thick hybrid film was prepared. Then, a photocurable/thermally self-healing hybrid film was prepared by irradiating UV at 500 mJ/cm2.
1H NMR, 29Si NMR and FT-IR analyses were conducted for the ladder-type polysilsesquioxane copolymers of Examples 1-7. The result is shown in
The hybrid films of Examples 8-11 were analyzed by TGA and DSC. The result is shown in
From the DSC analysis result of
The transparency of the hybrid films of Examples 8-11 was analyzed by UV-vis (ultraviolet-visible) spectroscopy. The result is shown in
Referring to
In order to investigate the self-healing ability of the hybrid films of Examples 8-11, each hybrid film was cured at 90° C. for 2 hours via the Diels-Alder reaction and then a scratch with a size of ˜100 μm was made. Then, the occurrence of self-healing was analyzed under an optical microscope. The result is shown in
Referring to
In addition, the hybrid films of Examples 12-14 were crosslinked by curing at 100° C. for 30 minutes via the DA (Diels-Alder) reaction. Then, after making scratches intentionally, they were heat-treated at 120° C. for 10 minutes such that the crosslinkage could be broken via the rDA (retro-Diels-Alder) reaction. The FT-IR analysis result is shown in
According to the present disclosure, a polysilsesquioxane copolymer which can self-heal within several minutes at 100-120° C. after being crosslinked at 80-100° C. can be provided. The polysilsesquioxane copolymer, having a diene and a dienophile introduced together in the copolymer, can be used as a single material.
In addition, because the self-healing polysilsesquioxane copolymer significantly improves physical properties such as heat resistance, mechanical strength, light transmittance, solubility and processability when applied to a hybrid material such as a film, it is widely applicable as a coating material for displays or automobiles, in addition to gas separation membranes.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2016-0165688 | Dec 2016 | KR | national |
