The present application is a continuation of, and claims priority benefit to, co-pending international application entitled, “SEMI-TRANSPARENT PHOTOVOLTAIC DEVICE WITH AN OPTIMISED ELECTRICAL CURRENT-COLLECTING GRID,” International Application No. PCT/IB2019/057900, filed Sep. 19, 2019, which claims priority to French Patent Application No. 18/00991, filed Sep. 24, 2018. Each of the above-referenced applications are hereby incorporated by reference into the current application in their entirety.
A thin-film photovoltaic cell is composed of at least:
The thickness of each thin layer varies from a few hundred nanometers to a few microns. The stacking order of the thin layers is determined by the thin film technology in question.
A photovoltaic device designates any type of photovoltaic cell or module. Photovoltaic modules are composed of a plurality of photovoltaic cells, all of which interconnected according to a series, parallel, parallel-series, or series-parallel architecture. A photovoltaic device is composed, for example, of a plurality of photovoltaic cells that are arranged in series in order to increase the electric voltage at the terminals of the module. Methods are known for placing photovoltaic cells in series through successive stages of isolation and interconnection of the various constituent layers as described in document EP 0500451 B 1.
The transparency or semitransparency of photovoltaic devices enable said devices to be integrated more aesthetically into products, particularly into everyday consumer electronic devices such as connected watches. This transparency can be achieved by means of etching, lithography, and/or laser ablation processes. In general, a semitransparent thin-film photovoltaic cell comprises a plurality of opaque photovoltaic active areas that are separated by transparency areas. The photovoltaic areas (and, respectively, transparency areas) can be of any shape. The critical dimension of said shape is then defined as being the smallest of the sizes characterizing it. This is, for example, a side for a square, the width for a rectangle, the height for a triangle. For example, in the case of a photovoltaic strip, the critical dimension, denoted CD, corresponds to the width of said strip. When a transparent, homogeneous appearance is desired (i.e., when it is not desired for the opaque areas to be distinguished with the naked eye from the transparency areas), the critical dimension of the photovoltaic strips is preferably less than 200 microns.
In a known embodiment, the active photovoltaic areas and the transparency areas are organized in networks of elementary, linear, circular, or polygonal geometric structures. The transparency of the photovoltaic cell is then a function of the surface fraction that is occupied by the active photovoltaic areas.
Patent WO 2014/188092 A1 presents an advantageous embodiment of a semitransparent thin-film photovoltaic monocell. Nevertheless, the electrical performance of these semitransparent cells is degraded compared to a solid cell (i.e., without a transparency area) of equivalent surface area. It is known to those skilled in the art to add a collection grid in order to facilitate the collection of the electric current. This electrically conductive collection grid is placed either in contact with the transparent electrode or in contact with the absorber. For example, patent WO 2014/188092 A1 describes a particular architecture of an improved collection grid that is adapted to a method which is implemented in order to achieve transparency. The establishment of electrical contact between the collection grid and the conductive transparent electrode of the thin-film photovoltaic cell is achieved by means of particular structures that are described in the aforementioned patent and referred to as VIAs. The set composed of the collection grid and the VIAs forms the improved collection grid.
However, VIAs are necessarily metallic (made of aluminum, silver, or molybdenum, for example) due to the required electrical conductivity, and they are therefore reflective. Due to their size and orderly placement, the network they form is generally perceptible to the naked eye. Said network of VIAs then causes visual discomfort.
It might be possible to reduce the dimensions of the VIAs. However, the process costs then become prohibitive. Indeed, in order to reduce the dimensions of VIAs to less than a few microns, it would then be necessary to equip production lines with new-generation photolithography machines that are 100 times more expensive than standard photolithography machines.
The present invention seeks to resolve the dual problem of the cost of manufacture and the invisibility of VIAs within semitransparent photovoltaic modules.
Embodiments of the present invention relates to a semitransparent thin-film photovoltaic device that is provided with an electric current-collecting grid, the architecture of which is optimized to minimize the visual impact of said collection grid. Various embodiments propose an architecture of VIAs that are arranged so as to impart a quasi-uniformity in transparency to the photovoltaic device while maximizing the collection of electric charges, all while minimizing the manufacturing cost of said device. It is another object of the invention to propose a method for placing VIAs according to the constraints of the targeted architecture.
In one embodiment, a semitransparent photovoltaic device comprises a plurality of active photovoltaic areas including a transparent substrate, a front electrode, an absorber including one or more thin photoactive layers, and a rear electrode; a transparency area separating at least two of the active photovoltaic areas; and a collection grid. The collection grid includes a metallic contact layer and a plurality of VIAs between the front electrode and the metallic contact layer, wherein the VIAs are randomly distributed within the active photovoltaic area. The VIAs are randomly distributed while respecting predetermined electrical and optical constraints so as to avoid the presence of VIA gaps and clusters.
In one example, the critical dimension CDPV of the active photovoltaic areas is between 1 μm and 100 μm.
According to one embodiment, the critical dimension CDT of the transparency areas is less than 1 mm.
According to one embodiment, the surface area of a VIA is between 15 μm2 and 50 μm2.
According to one embodiment, the maximum distanceDVIA_max between two VIAs is equal to 1000 μm, and the minimum distance DVIA_min between two VIAs is equal to 5 μm.
According to one embodiment, the density d of the VIAs is less than 70 VIAs/mm2 and greater than 10 VIAs/mm2.
According to one embodiment, all of the VIAs are centered within the active photovoltaic areas.
In practice, one of the photoactive layers of the absorber can be composed of amorphous silicon.
Various embodiments provide for random placement of VIAs that enables the semitransparent photovoltaic device described above to be manufactured and comprises the following steps:
According to one embodiment of the method, step B further comprises the following sub-steps:
According to one embodiment of the method, step C further comprises the following sub-steps:
According to one embodiment of the method, step D further comprises the following sub-steps:
The invention will now be described in greater detail with the aid of a description of
It is possible to transform this stack by photolithographic etching and deposition methods that are known to those skilled in the art in order to obtain a semitransparent photovoltaic module. The first step of this process is to create the transparency areas (6T) and to electrically isolate the collection buses (7+, 7−) by means of isolation areas (6I). Transparency and isolation areas (6T and 6I) are produced through successive etching of the thin layers, forming the rear electrode, the absorber, and the front electrode.
Transparency areas (6T) electrically isolate the active photovoltaic strips (5), with each of said strips forming unit photovoltaic cells. In order to electrically connect (in series and/or in parallel) these isolated active photovoltaic areas to the collection buses (7+ and 7−) to obtain a photovoltaic module, it is necessary to establish an electrical contact between the conductive transparent oxide (2) and one of the collection buses (7+). This electrical contact is established by means of a metal collection grid that is electrically isolated from the rear electrode through the use of an isolating material, generally a polymer. The collection grid described in the rest of the document is formed by:
Establishing a VIA-type contact comprises a plurality of consecutive steps. Let us consider the example of an architecture consisting of semitransparent strips such as that shown in
Step 1: Contact areas (80) are etched within the active photovoltaic areas (5). In the example of
The contact areas (80) result from the etching of the rear electrode (4) and of the absorber layer (3) by means of conventional photolithography methods that are known to those skilled in the art.
Step 2: An electrically isolating layer (9) is introduced in order to electrically isolate the front electrode (2) from the rear electrode (4).
Step 3: A metallic contact layer (11) is then deposited and etched, for example using a new photolithography step as shown in
The area of a VIA is defined as being the contact area between the contact metal (11) and the front electrode (2). This surface can be of any shape.
The invention aims to optimize the placement of VIAs (8) within a semitransparent photovoltaic device. This optimization takes into account both the electrical aspects and the visual rendering of semitransparent photovoltaic modules. In order to maximize the electrical performance of said photovoltaic modules, the inter-VIA (DVIA) and inter-VIA-end distance (DEX) is between 1 μm and 1000 μm.
The invention should make it possible to eliminate the appearance of VIA clusters (82) and gaps (81). It is considered that the elimination of clusters (82) is made possible if the density of the VIAs remains less than 70 VIAs/mm2 everywhere. The elimination of gaps (81) is made possible if the density of the VIAs remains greater than 10 VIAs/mm2 everywhere.
Consider a semitransparent strip-type module as shown in
Step A: Selection of an eligible active photovoltaic area for the placement of VIAs, which is broken down into sub-steps as follows:
Step B: Define the constraints for the placement of VIAs (8)
Step C: Initialization of the placement of VIAs (8) within the eligible active photovoltaic areas, which breaks down into sub-steps as follows:
Step D: Iterative method for the placement of other VIAs (8)
Step E: Return to step A as long as one or more active photovoltaic area(s) not already selected previously does not contain VIAs. An example is shown in
Let us consider a semitransparent module whose transparency areas form hexagons arranged in a “honeycomb”-type network.
In order to place the VIAs using the method described above, it is necessary to select the photovoltaic areas. Considering a continuous photovoltaic line going from one bus to the other of the device does not allow all of the photovoltaic areas to be traversed. In this example, it is then desirable to define an active photovoltaic area as a photovoltaic segment that forms one of the sides of the hexagon and within which steps A2, A3, B, C and D will be carried out. Since these steps are identical to those presented in the example of the semitransparent strip-type photovoltaic module, they will not be detailed again below.
A method for selecting all of the photovoltaic segments of the device is proposed below.
Step 1: Artificial reconstruction of incomplete hexagons in order to allow the indexing of the hexagons and the selection of the sides thereof, thus enabling steps 2, 3, and 4 to be carried out.
Step 2: Indexing of the hexagons
In this step, it is recommended to use a row (Li) and column (Cj) mesh in order to be able to identify the hexagons. Advantageously, the hexagons of index i,j can be selected by their center Si,j. A regular mesh is proposed within
Let M denote the number of rows and N the number of columns of said mesh. In the example of
It should be noted that, in this mesh, the hexagons are described by the following centers:
Step 3: Selection of three adjacent sides H1, H2, H3 of any hexagon according to the orientation of
In order to select all of the photovoltaic segments of the real device, it is sufficient for each hexagon of
Step 4: Selection of photovoltaic areas and placement of VIAs
For i varying from 1 to N
For k varying from 1 to 3
Step 4B: Selection of the side Hi,j,k and definition of the eligible photovoltaic area
Step 4C: Perform steps A2, A3, B, C, and D
Repeat step 4 until all hexagons have been considered.
In order to better understand these steps, let us consider the example of
Let us now consider the index i=3. The hexagons to be considered have the centers S3,4, S3,8, S3,12, and S3,16. By applying the algorithm to this entire row, we obtain the results of
Now let us consider the index i=4. The hexagons to be considered have the centers S4,2, S4,6, S4,10, S4,44, and S4,18. By applying the algorithm to this entire row, we obtain the results of
After having gone through all of the values of i and j, all of the photovoltaic segments will have been processed and the placement of the vias carried out.
This example of an algorithm for the placement of VIAs within a honeycomb structure is not limiting and is presented only by way of example. Those skilled in the art will know how to generate the appropriate algorithms as a function of the transparency patterns.
A plurality of semitransparent thin-film photovoltaic devices according to the invention were produced. Let us take the concrete example of a semitransparent photovoltaic module that is designed to be integrated into a watch glass. This module comprises:
This photovoltaic module has a diameter of 35 mm. It has a transparency level of 90%. In view of the dimensions involved, the VIAs were placed entirely within the photovoltaic areas. The placement of the VIAs was performed randomly under constraints such as:
A Gaussian random distribution was used for the placement of VIAs in the effective VIA placement areas.
A photograph of said exemplary embodiment is shown in
Number | Date | Country | Kind |
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FR 18 00991 | Sep 2018 | FR | national |
Number | Date | Country | |
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Parent | PCT/IB2019/057900 | Sep 2019 | US |
Child | 17209967 | US |