Claims
- 1. A nanostructure, comprising:
a substrate comprising at least one semiconductor oxide; and a substantially rectangular cross-section.
- 2. The nanostructure of claim 1, wherein the at least one semiconductor oxide is chosen from oxides of zinc, cadmium, mercury, gallium, indium, tellurium, germanium, tin, and lead.
- 3. The nanostructure of claim 2, wherein the at least one semiconductor oxide is a doped semiconductor oxide, wherein the doped semiconductor oxide includes the at least one semiconductor oxide and at least one dopant, wherein the at least one dopant is chosen from aluminum, gallium, boron, yttrium, indium, scandium, silicon, germanium, titanium, zirconium, hafnium, antimony, tin, nitrogen, and fluorine.
- 4. The nanostructure of claim 1, wherein the nanostructure is single crystalline. defect-free, dislocation-free, and structurally uniform.
- 5. The nanostructure of claim 1, wherein the nanostructure has a width-to-height ratio of about 5 to about 35.
- 6. The nanostructure of claim 1, wherein the nanostructure is about 20 nanometers to about 3000 nanometers in width, about 5 nanometers to about 50 nanometers in height, and about 100 nanometers to about 3 millimeters in length.
- 7. The nanostructure of claim 1, wherein the nanostructure has a substantially uniform width along the length of the substrate.
- 8. The nanostructure of claim 1, wherein the semiconductor oxide is a binary compound.
- 9. The nanostructure of claim 1, wherein the semiconductor oxide is a ternary compound.
- 10. A nanostructure comprising:
a substrate comprising at least one semiconductor; and a top, a bottom, a right side, and a left side, wherein the top and the bottom have the same width and wherein the right side and the left side have the same height.
- 11. The nanostructure of claim 10, wherein the at least one semiconductor is chosen from oxides of zinc, cadmium, gallium indium, tin, and lead.
- 12. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of lead the top and the bottom have ±(201) surfaces and the left and the right sides have ±(10 {overscore (1)}) surfaces.
- 13. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of gallium the top and the bottom have ±(100) surfaces and the left and right sides have ±(010) surface.
- 14. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of gallium the top and bottom surfaces have ±(201) and left and right sides have ±(10 {overscore (1)}) surface.
- 15. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of zinc the top and the bottom have ±(2 {overscore (1)} {overscore (1)} 0) surfaces and the left and right sides have ±(01 {overscore (1)} 0).
- 16. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of zinc the bottom surfaces surfaces have ±(2 {overscore (1)} {overscore (1)} 0) and the left and right sides have ±(0001).
- 17. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of tin the top and the bottom have ±(10{overscore (1)}) surfaces and the left and the right sides have ±(010) surfaces.
- 18. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of indium the top and the bottom have ±(100) surfaces and the left and the right sides have ±(010) surfaces.
- 19. The nanostructure of claim 11, wherein if the at least one semiconductor is the oxide of cadmium the top and the bottom have ±(001) surfaces and the left and the right sides have ±(010) surfaces.
- 20. The nanostructure of claim 10, wherein the nanostructure has a width-to-height ratio of about 5 to about 10.
- 21. A method of preparing a plurality of semiconductor oxide nanostructures from an oxide powder, each of the plurality of semiconductor oxide nanostructures having a substantially rectangular cross-section, the method comprising:
heating the oxide powder to an evaporation temperature of the oxide powder for about 1 hour to about 3 hours at about 200 torr to about 400 torr in an atmosphere comprising argon; evaporating the oxide powder; and forming the plurality of semiconductor oxide nanostructures.
- 22. The method of claim 21, wherein forming the plurality of semiconductor oxide nanostructures comprises:
forming the plurality of semiconductor oxide nanostructures, wherein the plurality of semiconductor oxide nanostructures includes at least one semiconductor oxide that is chosen from oxides of zinc, cadmium, mercury, gallium, indium, tellurium, germanium, tin, and lead.
- 23. The method of claim 21, wherein forming the plurality of semiconductor oxide 2 nanostructures comprises:
forming the plurality of semiconductor oxide nanostructures, wherein the at least one semiconductor oxide is a doped semiconductor oxide, wherein the doped semiconductor oxide includes the semiconductor oxide and at least one dopant, wherein the at least one dopant is chosen from aluminum, gallium, boron, yttrium, indium, scandium, silicon, germanium, titanium, zirconium, hafnium. antimony, tin, nitrogen, and fluorine.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to copending U.S. provisional application entitled “Semiconductive Oxide Nanobelts,” having ser. No. 60/261,367, filed Jan. 12, 2001, which is entirely incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
|
60261367 |
Jan 2001 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
10042868 |
Jan 2002 |
US |
Child |
10211696 |
Aug 2002 |
US |