Semiconductor device-socket

This application is based on Patent Application No. 2001-195418 filed Jun. 27, 2001 in Japan, the content of which is incorporated hereinto by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device-socket used for testing a semiconductor device.

2. Description of the Related Art

Semiconductor devices mounted on an electronic equipment or others are subjected to various tests at a stage prior to being actually mounted so that latent defects therein are removed. The test is performed nondestructively through application of voltage stress, high-temperature operation, and high-temperature storage corresponding to thermal and mechanical environment tests or the like. Among these tests, there is a burn-in test effective for removing initial-inoperable integrated circuits, in which an operation test is performed under a high temperature condition for a predetermined time.

A semiconductor device-socket subjected to such a test as disclosed in Japanese Patent No. 3059946 and as illustrated in

FIG. 7

, for example, is disposed on a printed circuit board

2

that includes an input/output portion, to which portion a predetermined test voltage is supplied and which portion outputs an abnormality-detection signal representing a short-circuit or others is returned from the semiconductor device as an object to be tested and the abnormality detection signal is transmitted.

The semiconductor device-socket comprises a positioning member

10

including a accommodation portion

10

a

in which a BGA-type (Ball Grid Array) semiconductor device is loaded as the semiconductor device for example; a contact deviation member

8

for supporting the positioning member

10

arranged in a socket body movably as described later in a reciprocating fashion in a predetermined direction and bringing one of contact portion of a contact terminal

16

ai

described later into close proximity to the other of contact or keeping the one away from the other; a socket body

4

for accommodating the contact deviation member

8

relatively movably with respect to a pair of the contact portion of the contact terminal

16

ai

; and a frame member

12

for transmitting operation force acting on itself to the contact deviation member

8

through a driving mechanism of the contact deviation member

8

(not shown).

At a predetermined position on the printed circuit board

2

are formed a group of electrodes connected electrically to the input/output portion through a conductor layer. To the electrode group is connected a terminal

16

B on a proximal end side of a plurality of the contact terminals (i=1 to n, n is a positive integer.) provided on the socket body

4

disposed on the printed circuit board

2

. Each contact terminal

16

ai

, which is provided corresponding to each electrode portion

6

a

of a mounted semiconductor device

6

, comprises a terminal

16

B on the side of the proximal end and a pair of movable contact portions

16

A

1

and

16

A

2

that are coupled with the just-mentioned terminal

16

B for selectively supporting each electrode portion

6

a

of the semiconductor device

6

. The pair of the movable contact portions

16

A

1

and

16

A

2

approach each other in response to the movement of the contact deviation member

8

to pinch each electrode portion

6

a

of the semiconductor device

6

or are separated from each other to release each electrode portion

6

a

of the semiconductor device

6

.

The contact deviation member

8

is disposed movably along the movement direction of the movable contact portions

16

A

1

and

16

A

2

of each contact terminal

16

ai

in the accommodation portion

4

a

of the socket body

4

. The contact deviation member

8

is coupled to a driving mechanism composed of a pin and a lever as disclosed in Japanese Patent No. 3059946. One end of the lever of the driving mechanism makes contact with an end of the frame member

12

. A partition wall portion

8

P is provided as a movable contact pressing portion inside of each opening portion where the movable contact portions

16

A

1

and

16

A

2

of each contact terminal

16

ai

in the contact deviation member

8

are protruded, which portion

8

P is formed so as to divide portion between the movable contact portion

16

A

1

and the movable contact portion

16

A

2

of each contact terminal

16

ai

. Further, between the one end of the contact deviation member

8

and an inner peripheral portion of the accommodation portion

4

a

of the socket body

4

is provided a coiled spring

14

as an urging member for urging the contact deviation member

8

oppositely to a direction indicated by an arrow Mo in

FIG. 7

to return the contact deviation member

8

to an initial position.

As shown

FIG. 8

, when the contact deviation member

8

is moved against the urging force of the coiled spring

14

in the direction indicated by the arrow Mo in response to the lowering operation of the frame member

12

, the partition wall portion

8

P is moved so as to separate the movable contact portion

16

A

2

of each contact terminal

16

ai

from the movable contact portion

16

A

1

. In contrast, referring to

FIG. 9

, the contact deviation member

8

is moved owing to the urging force of the coiled spring

14

and the restoring force of the movable contact portion

16

A

2

oppositely to the direction indicated by the arrow Mo in response to rising operation of the frame member

12

.

In such a structure, when the semiconductor device

6

is accommodated in the accommodation portion

10

a

of the positioning member

10

as indicated by a chain double-dashed line in

FIG. 7

, the frame member

12

is first moved downward. Accordingly, the contact deviation member

8

is moved against the urging force of the coiled spring

14

. As shown further in

FIG. 8

, when the partition wall portion

8

P is moved and held such that the movable contact portion

16

A

2

of each contact terminal

16

ai

is kept away from the movable contact portion

16

A

1

, the electrode portion

6

a

of the semiconductor device

6

is positioned between the movable contact portion

16

A

1

of each contact terminal

16

ai

and the movable contact portion

16

A

2

of the same by placing the semiconductor device

6

on the accommodation portion

10

a

of the positioning member

10

.

When the frame member

12

is raised as indicated by a solid line in

FIG. 7

, the contact deviation member

8

is moved to an initial position with the aid of the urging force of the coiled spring

14

and the restoring force of the movable contact

16

A

2

, so that the partition wall portion

8

P is separated from the movable contact portion

16

A

2

and brought into contact with the movable contact portion

16

A

1

.

Accordingly, as shown in

FIG. 9

, each electrode portion

6

a

of the semiconductor device

6

is pinched with the movable contact portion

16

A

1

of each contact terminal

16

ai

and the movable contact portion

16

A

2

of the same to permit each electrode portion

6

a

of the semiconductor device

6

to be electrically connected with each contact terminal

16

ai.

However, the contact deviation member

8

is moved with the aid of the urging force of the coiled spring

14

and the restoring force of the movable contact portion

16

A

2

as described above, whereby three partition wall portions

8

p

are separated from the movable portion

16

A

2

, respectively and make contact with the movable contact portion

16

A

1

for movement to the initial position for example, whereby there happens a situation where some of the movable contacts

16

A

1

are separated from the electrode portion

6

a

, as illustrated in FIG.

10

. There is therefore a possibility that contact pressure between the movable contact portion

16

A

1

of the contact terminal

16

ai

and the movable contact portion

16

A

2

of the same is deteriorated and electrical connection is incomplete.

It is contemplated as the cause of the foregoing possibility that a variation in the distance between some of the electrode portions

6

a

of the semiconductor device

6

results from the positional deviation from a reference position.

There might be also contemplated in this situation that position accuracy of the electrode portion

6

a

in the semiconductor device

6

is improved, but it is inadvisable to do so because of a certain limitation.

SUMMARY OF THE INVENTION

In view of the aforementioned with the prior art, it is an object of the present invention to provide a semiconductor device-socket for use in a test for a semiconductor device and which securely achieves electrical connection for an electrode portion without being influenced by variations of position accuracy of the electrode portion of the semiconductor device.

To achieve the above object, a semiconductor device-socket according to the present invention comprises a contact terminal for selectively supporting a terminal of a semiconductor device cooperatively with a plurality of contact portions and electrically connecting the same to a transmission line; a supporting member for supporting a proximal end side of the contact terminal; a contact deviation member disposed movably in the supporting member, the contact deviation member including a press portion between the contact portion of the contact terminal into or out of close proximity to each other following the movement of the press portion; and a position restriction member for restricting the press portion of the contact deviation member at a predetermined gap formed between contact portion sides of the contact terminals when the contact deviation member is moved relatively with respect to the supporting member.

The semiconductor device-socket according to the present invention may be one where it further includes an urging member for urging the contact deviation member in one direction such that a plurality of the contact portions of the contact terminal are brought into the close proximity to each other following the movement of the plurality of the contact portions of the contact terminal.

The socket may be another one where it includes a moving mechanism for moving the contact deviation member in the other direction such that the plurality of the contact portions of the contact terminal are separated from each other following the movement of the plurality of contact portions of the contact terminal.

The position restriction member provided on the supporting member may be a protrusion selectively engaged with the contact deviation member.

The position restriction member provided on the contact deviation member may be a protrusion selectively engaged with a peripheral edge of a recessed portion in the supporting member.

The position restriction member may be a cam member included in the movement mechanism and inserted into a gap between the end of the contact deviation member and the supporting member for moving the contact deviation member.

The position restriction member may be a lever member included in the movement mechanism for interfering the supporting member by relative rotation with respect to the supporting member, the lever member for restricting the movement of the contact deviation member.

The urging member may be a spring member.

A semiconductor device-socket according to the present invention comprises a plurality of contact terminals for selectively supporting a terminal of a semiconductor device cooperatively with a plurality of contact portions and electrically connecting the terminal with a transmission line; a supporting member for supporting a proximal end side of the contact terminal; a contact deviation member disposed movably in the supporting member, the contact deviation member including a plurality of press portions between the contact portion of the contact terminal for bringing the contact portions of the plurality of the contact terminals into or out of close proximity to each other following the movements of the contact deviation, and a position restriction member for restricting the position of each press portion of the contact deviation member at a predetermined gap between the contact portion sides of the contact terminal when the contact deviation member is moved relatively with respect to the supporting member.

In accordance with the semiconductor device-socket of the present invention, as clearly evidenced with the aforementioned description, the position restriction member restricts the position of the press portion of the contact deviation member at a predetermined gap between the contact terminals on the side of the contacts when the contact deviation member is moved relatively with respect to the supporting member, so that electric connection to the electrode portion is securely achieved without being influenced by variations of the positioning accuracy of the electrode portion of the semiconductor device.

The above and other objects, effects, features and advantages of the present invention will become more apparent from the following description of embodiments thereof taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1

is a cross-sectional view illustrating a first preferred embodiment of a semiconductor device-socket according to the present invention;

FIG. 2

is a cross-sectional view, partly enlarged, for illustrating the first preferred embodiment in

FIG. 1

;

FIG. 3

is a cross-sectional view illustrating a second preferred embodiment of the semiconductor device-socket according top the present invention;

FIG. 4

is a cross-sectional view illustrating a third preferred embodiment of the semiconductor device-socket according to the present invention;

FIG. 5

is a cross-sectional view illustrating a modified one of the first embodiment in

FIG. 1

;

FIG. 6

is a cross-sectional view illustrating another modified example of the modified one of the embodiment in

FIG. 1

;

FIG. 7

is a cross-sectional view schematically illustrating the arrangement of a prior art semiconductor device-socket;

FIG. 8

is a cross-sectional view, partly enlarged, for describing the operation of the semiconductor device-socket illustrated in

FIG. 7

;

FIG. 9

is a cross-sectional view, partly enlarged, for describing the operation of the semiconductor device-socket illustrated in

FIG. 7

; and

FIG. 10

is a cross-sectional view, partly enlarged, for describing the operation of the semiconductor device-socket illustrated in FIG.

7

.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1

illustrates a first preferred embodiment of a semiconductor device-socket according to the present invention.

Referring to

FIG. 1

, a semiconductor device-socket is disposed on a printed circuit board

20

including an input/output portion through which a predetermined test voltage is supplied to and an abnormality-detection signal representing short-circuiting or others is returned from a semiconductor device as an object to be tested and the abnormality-detection signal is transmitted.

The semiconductor device-socket comprises a positioning member

28

that includes a accommodation portion

28

a

in which semiconductor device

30

of a BGA (Ball Grid Array)-type for example as a semiconductor device is positioned and loaded, a contact deviation member

32

disposed in a reciprocating manner in a predetermined direction for supporting the positioning member

28

and for bringing one of movable contact portions of a contact terminal

24

ai

described later into or out of close proximity to the other of movable contact portion, a socket body

22

in which the contact deviation member

32

is accommodated relatively movably with respect to a pair of contact portions of the contact terminal

24

ai

electrically connected to the input/output portion of the printed circuit board

20

, and a frame member

26

for transmitting an operation force acting on itself to the contact deviation member

32

through a driving mechanism (not shown) of the contact deviation member

32

.

Note that

FIG. 1

illustrates a situation which the semiconductor device

30

is loaded in the accommodation portion

28

a

and can be tested.

A plurality of the sockets for semiconductor device are disposed crisscross at a predetermined intervals correspondingly to a group of the electrodes provided on the printed circuit board

20

. The input/output portion in the printed circuit board

20

is electrically connected with the group of the electrodes through a conductor layer (not shown).

In the substantially square semiconductor device

30

shaped like a thin sheet, a plurality of the electrodes

30

a

electrically connected with an integrated circuit formed therein are formed at a predetermined intervals on one surface thereof.

The socket body

22

provided on the printed circuit board

20

includes a groove in an outer periphery thereof corresponding to pawls provided on four sides of a frame member

26

(not shown) for guiding movably up or down the each pawl and maintaining the same at predetermined positions. It is noticed that the socket body is not limited to the just-mentioned example, and one may be adopted where such pawls and groove are provided on and in two sides of the frame member

26

, respectively.

The socket body

22

includes thereinside the accommodation portion

22

a

for accommodating movably the contact deviation member

32

within the range of a predetermined distance. In a bottom of the accommodation portion

22

a

, through-holes

22

bi

(i=1 to n, n is a positive integer.) are formed, through which the contact terminal

24

ai

(i=1 to n, n is a positive integer.) is inserted and supported. The through-holes

22

bi

are formed at a predetermined intervals corresponding to the electrodes.

30

a

of the semiconductor device

30

. One end of the through-hole

22

bi

is opened toward the printed circuit board

20

after penetrating the socket body

22

. Around a peripheral edge of the through-hole

22

bi

is formed a slope

22

S for guiding the movable contact portion

24

A

2

of the contact terminal

24

ai

on one internal portion of the contact deviation member

32

on the side in the movement direction of the contact deviation member

32

described later. It is herein noticed that no slope

22

S may be formed when the contact terminal

24

ai

is formed of a material that is displaceable with ease.

The contact terminal

24

ai

includes a terminal

24

B connected to the printed circuit board

20

, and the movable contact

24

A

1

and the movable contact

24

A

2

both coupled to the terminal

24

B. The movable contact

24

A

1

and the movable contact

24

a

2

, which oppose to each other across a partition wall

32

W described later therebetween, are coupled to the terminal portion

24

B so as to support the electrode

30

a

of the mounted semiconductor device

30

in corporation therewith, as indicated with a solid line in FIG.

1

. The movable contact

24

A

2

is connected to the terminal portion

24

B such that it is brought into or out of close proximity to the movable contact

24

A

1

toward the moving direction of the contact deviation member

32

described later as indicated by a chain double-dashed line.

Tip ends of the movable contact

24

A

1

and movable contact

24

A

2

are protruded from a plurality of the openings

32

b

at an upper portion of the internal periphery

32

a

of the contact deviation member

32

through the same internal periphery

32

a

of the contact deviation member

32

, respectively.

The contact deviation member

32

is supported relatively movably in the direction indicated by an arrow C or an arrow O in

FIG. 1

with respect to the bottom of the accommodation portion

22

a

. The adjacent openings

32

b

in the contact deviation member

32

are divided by a partition wall (not shown).

In each opening

32

b

is formed a partition wall

32

W as the press portion for partitioning between the movable contact

24

A

1

and the movable contact

24

A

2

. A protrusion

22

P is provided on the bottom of the accommodation portion

22

a

as the positioning restriction member selectively engaged with the internal periphery

32

a

of the contact deviation member

32

. The protrusion

22

P is provided so that a predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

as enlarged illustrated in

FIG. 2

when the movement of the contact deviation member

32

is interrupted and hence the movable contact

24

A

1

and the movable contact

24

A

2

pinch the electrode

30

a

of the mounted semiconductor device

24

A

1

. At the same time, a predetermined gap CL

2

is formed also between an outer periphery of the partition wall

32

W and the movable contact

24

A

2

. The gaps CL

1

and CL

2

are set to values exceeding the supposed amount of positional deviation of the electrode

30

a

of the semiconductor device

30

, respectively.

A coiled spring

34

is provided between the internal peripheral surface

22

a

of the accommodation portion

22

a

and the one end surface of the contact deviation member

32

as the urging member for urging the contact deviation member

32

in the direction indicated by an arrow C, i.e., in the direction where the movable contact

24

A

2

approaches closely the movable contact

24

A

1

.

To an upper portion of the contact deviation member

32

is fixed the positioning member

28

. The accommodation portion

28

a

of the positioning member

28

is formed by a wall surface which is opened upward and is continued to the upper end of the contact deviation member

32

through the slope

28

s

. In the bottom of the accommodation portion

28

a

is formed an opening

28

b

where the electrode

30

a

of the semiconductor device

30

is disposed.

Around the positioning member

28

is provided a frame member

26

to be operated so as to surround the positioning member

28

. A lower end of the frame member

26

having the opening

26

a

touches an end of a lever member of the moving mechanism (not shown) of the contact deviation member

32

. It is herein noticed that a predetermined gap may be formed between the lower end of the frame member

26

and the end of the lever member.

Between the lower end of the frame member

26

and the socket body

22

is provided a return spring (not shown) for urging the frame member

26

upward. Provided that the frame member

26

is raised with the aid of the urging force of the coiled spring

34

, the need of such a return spring may be eliminated.

The moving mechanism of the contact deviation member

32

comprises a structure in a specification applied already by the present applicant as disclosed in Japanese Patent Application Publication No. 6-30280 (1994) for example.

In such a structure, in the case where upon the semiconductor device

30

being loaded on the semiconductor device-socket, the semiconductor device

30

held by a robot hand (not shown) is accommodated in the accommodation portion

28

a

of the positioning member

28

through the opening

26

a

as indicated by a chain double-dashed line in

FIG. 1

for example, the frame member

26

is first moved downward to a position indicated by the chain double-dashed line in FIG.

1

.

Accordingly, the contact deviation member

32

is moved against the urging force of the coiled spring

34

with the aid of the movement mechanism of the contact deviation member

32

. Accordingly, when the contact deviation member

32

is moved against the urging force of the coiled spring

34

in the direction indicated by an arrow O, the partition wall

32

W presses the movable contact

24

A

1

against its resilient force and separates the movable contact

24

A

1

from the movable contact

24

A

2

as indicated by the chain double-dashed line in FIG.

1

.

Then, in the case where the movable contact

24

A

2

of each contact terminal

24

ai

is separated from the movable contact

24

A

1

and is held, the semiconductor device

30

is placed on the accommodation portion

28

a

of the positioning member

28

, whereby the electrode

30

a

of the semiconductor device

30

is positioned between the movable contact

24

A

1

and movable contact

24

A

2

of each contact terminal

24

ai

through the opening

28

b.

When the frame member

26

is moved upward and is interrupted at a position indicated by a solid line in

FIG. 1

, the contact deviation member

32

is moved in the direction indicated by the arrow C with the aid of the urging force of the coiled spring

34

and the restoring force of the movable contact

24

A

2

, and then the contact deviation member

32

is interrupted by allowing the protrusion

22

P to be engaged with the internal periphery

32

a

of the contact deviation member

32

.

Accordingly, as shown in

FIG. 2

, the predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

, and the predetermined gap CL

2

is formed between the external peripheral surface of the partition wall

32

W and the movable contact

24

A

2

too, so that it is eliminated that the partition wall

32

W causes none of the movable contacts

24

A

1

and

24

A

2

to make contact with the electrode

30

a.

Upon removing the semiconductor device

30

from the socket the frame member

26

is moved downnward again up to the position indicated by the chain double-dashed line in

FIG. 1

as described above, and is then held, and the semiconductor device

30

is held and removed with a robot hand (not shown).

Although in the foregoing embodiment, the positioning member

28

is fixed to the upper end of the contact deviation member

32

, the present invention is not limited to such an example, and as illustrated in

FIG. 5

for example a contact deviation member

50

may be disposed in a accommodation portion

22

′

a

of a socket body

22

′ relatively movably with respect to a positioning member

52

.

It should be noted that

FIG. 5

, illustrates the situation where the semiconductor device

30

is loaded in the positioning member

52

, in which similar reference numerals are applied to similar elements to those in the example illustrated in

FIG. 1

, and hence overlapping of the description thereof will be omitted.

The contact deviation member

50

is disposed in the accommodation portion

22

′

a

of the socket body

22

′ movably along the direction of the movements of the movable contacts

24

A

1

and

24

A

2

of each contact terminal

24

ai

. The contact deviation member

50

has an opening through which the movable contact portion

24

A

1

and the movable contact portion

24

A

2

of each contact terminal

24

ai

are protruded. Each opening is partitioned with a partition wall (not shown).

In each opening through which the movable contacts

24

A

1

and

24

A

2

of each contact terminal

24

ai

in the contact deviation member

50

are protruded is provided the partition wall

50

w

as the movable contact press portion that is so formed as to divide a space between the movable contact

24

A

1

and the movable contact

24

A

2

. Further, between the one end of the contact deviation member

50

and the internal periphery of the accommodation portion

22

′

a

of the socket body

22

′ is provided the coiled spring

34

for urging the contact deviation member

50

to return it to the initial position.

In the upper end of the contact deviation member

50

on which the bottom of the positioning member

52

is placed, is provided a recess

50

a

formed by the wall surface engaged with the protrusion

52

P of the positioning member

52

when the contact deviation member

50

is moved in one direction. Accordingly, the contact deviation member

50

is made relatively slidable within a predetermined range with respect to the bottom of the accommodation portion

22

′

a

and the positioning member

52

, and is moved together with the positioning member

52

.

A protrusion

22

′P engaged with the internal periphery of the contact deviation member

50

, when the contact deviation member

50

is returned to the initial position, is provided on the bottom of the accommodation portion

22

′

a

in the same fashion as described in the foregoing example.

This causes the aforementioned action and effect in the same fashion to be ensured.

The positioning member

52

includes at the center thereof the accommodation portion

52

a

on which the semiconductor device

30

is loaded. The internal peripheral surface of the accommodation portion

52

a

is formed by a flat surface on which each end surface of the square semiconductor device

30

touches, and a slope that couples the upper end surface of the accommodation portion

52

a

and the flat surface, and a bottom surface that intersects the flat surface. The size of the internal peripheral surface of the accommodation portion

52

a

is set larger than the size of the external configuration of the semiconductor device

30

loaded with a predetermined tolerance.

In the bottom of the accommodation portion

52

a

is formed an opening

52

b

communicated with the opening in the contact deviation member

50

. On a portion of the bottom of the accommodation portion

52

a

opposing to the contact deviation member

50

is formed a protrusion

52

P engaged with a peripheral edge of the recess

50

a

in the contact deviation member

50

. Further, on the opposite ends of the bottom of the positioning member

52

opposing the socket body

22

′ are formed protrusions

52

ca

and

52

cb

guided to and restricted by grooves

22

′

ga

and

22

′

gb

of the socket body

22

′.

Although in the foregoing embodiment illustrated in

FIG. 1

the protrusion

22

P is provided on the bottom of the accommodation portion

22

a

of the socket body

22

, and further the internal periphery of the contact deviation member

32

is selectively engaged with the protrusion

22

P for the position restriction, instead of this, it may be allowed that a recessed portion

23

g

is provided at a predetermined position on the bottom of the accommodation portion

23

a

of the socket body

23

as illustrated in

FIG. 6

, and a contact deviation member

33

has a protruded end

33

e

selectively engaged with a peripheral edge of the recessed portion, whereby a positioning of the contact deviation member

33

may be restricted so that a predetermined gap is formed between the partition wall

33

W and the movable contact

24

A

1

or

24

A

2

as in the case of the aforementioned example. It is herein noticed that similar reference numerals in

FIG. 6

will be applied to the similar components in the example illustrated in

FIG. 1

, and hence overlapping of the description thereof will be omitted.

The socket body

23

includes the accommodation portion

23

a

thereinside, in which the contact deviation member

33

is movably accommodated within the range of a predetermined distance. There is formed a through-hole

23

bi

(i=1 to n, n is a positive integer.) in the bottom of the accommodation portion

23

a

, through which the contact terminal

24

ai

is inserted and supported. The through-holes

23

bi

are formed at a predetermined interval corresponding to the electrode

30

a

of the semiconductor device

30

. One end of the through-hole

23

bi

passes through the socket body

23

and is opened toward the printed circuit board

20

. Around the peripheral edge of the through-hole

23

bi

is formed a slope

23

S on one internal surface of the contact deviation member

33

on the side of the movement direction of the contact deviation member

33

for guiding the movable contact

24

A

2

of the contact terminal

24

ai.

The contact deviation member

33

is supported relatively movably on the bottom of the accommodation portion

23

a

. The adjacent openings

33

b

of the contact deviation member

33

is partitioned with a partition wall (not shown).

In each opening

33

b

is formed a partition wall

33

W as the press portion for partitioning between the movable contact

24

A

1

and the movable contact

24

A

2

. In the bottom of the accommodation portion

23

a

is formed a recessed portion

23

g

that is selectively engaged with an end

33

e

of the contact deviation member

33

. The recessed portion

23

g

is provided such that a predetermined gap CL

1

is formed between the partition wall

33

W and the movable contact

24

A

1

in the case where movable contact

24

A

1

and the movable contact

24

A

2

support the electrode

30

a

of the semiconductor device

30

loaded when the movement of the contact deviation member

33

is interrupted, as enlarged illustrated, in FIG.

2

. At the same time, a predetermined gap CL

2

is also formed between an outer peripheral surface of the partition wall

33

W and the movable contact

24

A

2

. The gaps CL

1

and CL

2

are set to be values beyond the amount of the positional deviation of the electrode

30

a

of the supposed semiconductor device

30

. Positioning member

28

is fixed to the upper end of the contact deviation member

33

.

Accordingly, in the present example the same action and effect as those in the foregoing example are therefore achieved.

FIG. 3

illustrates a second preferred embodiment of the semiconductor device-socket according to the present invention.

Although in the example illustrated in

FIG. 1

the position of the contact deviation member

32

is restricted owing to the protrusion

22

P in the accommodation portion

22

a

to form the predetermined gap CL

1

between the partition wall

32

W and the movable contact

24

A

1

, in the example in

FIG. 3

the position restriction for the contact deviation member

32

is instead achieved by a cam

38

CA of the frame member

38

.

FIG. 3

illustrates a situation where the semiconductor device

3

is loaded in the accommodation portion

28

a

of the positioning member

28

and is ready to be tested.

In the example in FIG.

3

and in examples described later, similar reference numerals will be applied to similar components to those constructed in the example illustrated in

FIG. 1

, and overlapping description thereof will be omitted.

Around the positioning member

28

the frame member

38

to be operated is provided so as to surround it. Between a lower end of the frame member

38

and the socket body

22

there is provided a return spring (not shown) for urging the frame member

38

(not shown) upward. On the lower end of the frame member

38

having the opening

38

a

a cam

38

Ca in contact at all times with the internal peripheral surface of the accommodation portion

22

a

and the one end of the contact deviation member

32

is formed, protruded downward.

The tip end of the cam

38

CA has been inserted into between the end of the contact deviation member

32

and the internal peripheral surface of the accommodation portion

22

a.

A slope

38

CS having a predetermined gradient is formed at a portion of the cam

38

CA opposing the contact deviation member

32

. Further, a flat surface in slidably contact with the internal peripheral surface of the accommodation portion

22

a

is formed in a region opposing the internal peripheral surface of the accommodation portion

22

a.

Referring to

FIG. 3

, the gradient of the slope

38

CS of the cam

38

CA is set such that when the frame member

38

is at a highest position, a distance between the end of the contact deviation member

32

and the internal peripheral surface of the accommodation portion

22

a

is a predetermined distance L. The predetermined distance L is set such that when the semiconductor device

30

is mounted on the accommodation portion

28

a

of the positioning member

28

, the predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

, and the predetermined gap CL

2

is formed also between the outer peripheral surface of the partition wall

32

W and the movable contact

24

A

2

, as illustrated in FIG.

2

and in the aforementioned description.

In such a structure, upon the semiconductor device

30

being mounted on the semiconductor device-socket

30

, in the case where the semiconductor device

30

held by a robot hand (not shown) is accommodated in the accommodation portion

28

a

of the positioning member

28

through the opening

38

a

as indicated by a chain double-dashed line in

FIG. 3

for example, the frame member

38

is first lowered up to a position indicated by the chain double-dashed line in FIG.

3

.

Accordingly, the contact deviation member

32

is moved against the urging force of the coiled spring

34

with the aid of the slope

38

CS of the cam

38

CA as indicated by the chain double-dashed line. Therefore, when the contact deviation member

32

is moved against the urging force of the coiled spring

34

indicated by the arrow O, the partition wall

32

W presses the movable contact

24

A

2

against the resilient force of the movable contact, and is separated from the movable contact

24

A

2

as indicated by the chain double-dashed line in FIG.

3

.

In the situation where the movable contact

24

A

2

of each contact terminal

24

ai

is separated from the movable contact

24

A

1

and is held, the electrode

30

a

of the semiconductor device

30

is positioned between the movable contact

24

A

1

of each contact terminal

24

ai

and the movable contact

24

A

2

of the same by placing the semiconductor device

30

on the accommodation portion

28

a

of the positioning member

28

.

When the frame member

38

is raised and is stopped at a highest position indicated by a solid line in

FIG. 3

, the contact deviation member

32

is moved against the urging force of the coiled spring

34

and the restoring force of the movable contact

24

A

2

in the direct6ion indicated by the arrow C, and then the contact deviation member

32

is interrupted at a predetermined position owing to engagement of the end of the contact deviation member with the slope

38

CS of the cam

38

CA.

Accordingly, the predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

, and the predetermined gap CL

2

is formed also between the outer peripheral surface of the partition wall

32

W and the movable contact

24

A

2

, so that it is avoided that the partition wall

32

W causes none of the movable contacts to make contact with the electrode

30

a.

Upon the semiconductor device

30

being removed from the semiconductor device-socket, in the situation where the frame member

38

is lowered up to the position indicated by the chain double-dashed line in FIG.

3

and is then held again as described above, the semiconductor device

30

is held and removed with the aid of a robot hand (not shown).

FIG. 4

illustrates a third preferred embodiment of the semiconductor device-socket according to the present invention.

Although the embodiment illustrated in

FIG. 1

is adapted such that the predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

by restricting the position of the contact deviation member

32

with the aid of the protrusion

22

P in the accommodation portion

22

a

, the embodiment illustrated in

FIG. 4

is adapted such that the predetermined gap CL

1

9

s

formed between the partition wall

32

W and the movable contact

24

A

1

as illustrated in

FIG. 2

instead by restricting the position of the contact deviation member

32

to a predetermined position owing to interfere withnce thereof with the bottom of the accommodation portion

22

a

of the lever member

40

.

The lower end of the frame member

26

having the opening

26

a

abuts on the one end of the lever member

40

of the moving mechanism of the contact deviation member

32

. Between the lower end of the frame member

26

and the socket body

22

there is provided a return spring for urging the frame member

26

upward, although not illustrated. The other end of the lever member

40

has a transparent hole

40

a

that is supported rotatably in a support shaft

44

provided on the socket body

22

. An elongated hole

40

b

is formed in a portion of the lever member

40

adjacent to the transparent hole

40

a

. To the elongated hole

40

b

there is fitted the other end of an engagement pin

42

which has its one end coupled with the contact deviation member

32

.

Accordingly, when the frame member

26

is lowered, the lever member

40

is rotated counterclockwise around the support shaft

44

, so that the contact deviation member

32

is moved against the urging force of the coiled spring

34

in the direction indicated by the arrow O.

On the one hand, when the frame member

26

is moved upward, the contact deviation member

32

is moved by the urging force of the coiled spring

34

in the direction indicated by the arrow C as the lever member

40

is rotated clockwise around the support shaft

44

.

In rotating the lever member

40

, when the other end surface

40

e

of the lever member

40

interfere with the bottom of the accommodation portion

22

a

as indicated by a broken line, rotational motion of the lever member

40

is restricted, so that the movement of the contact deviation member

32

is interrupted.

In such a structure, in the situation where upon the semiconductor device

30

being mounted on the semiconductor device-socket, the semiconductor device

30

held by a robot hand (not shown) is accommodated in the accommodation portion

28

a

of the positioning member

28

through the opening

26

a

as indicated by a chain double-dashed line in

FIG. 4

, the frame member

26

is first lowered up to a position indicated by then chain double-dashed line.

Accordingly, the contact deviation member

32

is moved against the urging force of the coiled spring

34

with the aid of the counterclockwise rotation of the lever member

4

in FIG.

4

. Therefore, when the contact deviation member

32

is moved against the urging force of the coiled spring

34

indicated by the arrow O in

FIG. 4

, the partition wall

32

W presses the movable contact

24

A

2

against the resilience force of the same to separate the same from the movable contact

24

A

1

as indicated by the chain double-dashed line in FIG.

4

.

Subsequently, in the situation where the movable contact

24

A

2

of each contact terminal

24

ai

is separated from the movable contact

24

A

1

and is held, the electrode

30

a

of the semiconductor device

30

is positioned between the movable contact

24

A

1

of each contact terminal

24

ai

and the movable contact

24

A

2

of the same by placing the semiconductor device

30

on the accommodation portion

28

a

of the positioning member

28

.

When the frame member

26

is moved upward to interrupt at a position indicated by a solid line in

FIG. 4

, the contact deviation member

32

is moved with the aid of the urging force of the coiled spring

34

and the restoring force of the movable contact

24

A

2

in the direction indicated by the arrow C in

FIG. 4

, and thereafter the contact deviation member

32

is interrupted by permitting the end surface

40

e

of the lever member

40

rotated clockwise to interfere with the bottom surface of the accommodation portion

22

a.

Accordingly, as illustrated in

FIG. 2

the predetermined gap CL

1

is formed between the partition wall

32

W and the movable contact

24

A

1

, and the predetermined gap CL

2

is also formed between the outer peripheral surface of the partition wall

32

W and the movable contact

24

A

2

, so that it is avoided that the partition wall

32

W causes none of the movable contacts to make contact with the electrode

30

a.

Upon the semiconductor device

30

being removed from the semiconductor device-socket, the frame member

26

is lowered up to a position indicated by the chain double-dashed line in

FIG. 4

, and is then held again as described above, the semiconductor device

30

is held by a robot hand (not shown).

Although in the aforementioned embodiments the contact deviation member

32

and the positioning member

28

are adapted as separate parts, the present invention is not limited to such examples, and the contact deviation member

32

and the positioning member

28

may be constructed in a united manner.

Furthermore, the one example of the semiconductor device-socket according to the present invention may be applied to sockets of the type where no use is made of such a frame member as in the foregoing embodiments.

The present invention has been described in detail with respect to preferred embodiments, and it will now be apparent from the foregoing to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspects, and it is the intention, therefore, in the appended claims to cover all such changes and modifications as fall within the true spirit of the invention.

Number	Name	Date	Kind
5013256	Matsuoka et al.	May 1991	A
5186642	Matsuoka et al.	Feb 1993	A
5213531	Matsuoka et al.	May 1993	A
5320550	Uratsuji et al.	Jun 1994	A
6106319	Fukunaga et al.	Aug 2000	A
6149449	Abe	Nov 2000	A

Number	Date	Country
6-30280	Apr 1994	JP
3059946	Apr 2000	JP

Semiconductor device-socket

Information

Patent Number

Date Filed

Date Issued

Inventors

Original Assignees

Examiners

Agents

CPC

US Classifications

Field of Search

US

International Classifications

Abstract

Description

Claims

Priority Claims (1)

US Referenced Citations (6)

Foreign Referenced Citations (2)