Semiconductor device with PZT/PLZT film and lead-containing electrode

Abstract

A semiconductor device comprising an oxide film, an electrode and a PZT or PLZT film formed in this order on a substrate, the electrode being a deposit of platinum containing lead.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a semiconductor device, and more particularly to a semiconductor device provided with a ferroelectric PZT or PLZT film.

2. Description of the Related Art

PZT (Pb-Zr-TiO.sub.3), PLZT (Pb-La-Zn-TiO.sub.3) or the like has a perovskite structure represented by the general formula ABO.sub.3 and shows a hysteresis effect on an external electric field and a very high dielectric constant. Such materials are actively utilized as a capacitor dielectric film for semiconductor devices such as large-scale DRAMs and non-volatile memory devices.

A principal portion of a conventional non-volatile, memory device having a PZT film is exemplified with reference to FIG. 2(c) as attached herein.

In FIG. 2, 1 is a substrate made of silicon and having thereon an oxide film 2 of SiO.sub.2. A platinum thin film is layered on the SiO.sub.2 film 2, forming an electrode 7 on which a PZT film 6 is deposited.

A preparing method of the semiconductor device as above is as follows.

Silicon halide or hydride is hydrolyzed or oxidized or organic oxysilane is thermally decomposed to form the SiO.sub.2 film on the silicon substrate 1 and platinum is then deposited 1000 to 2000.ANG. on the SiO.sub.2 film 2 by a DC magnetron sputtering method using a platinum target to form the electrode 7 (FIG. 2(a)).

PZT is deposited 2000 to 3000.ANG. in thickness on the electrode 7 by a RF sputtering method using a plasma ion of Ar/O.sub.2 preferably with a sintered PZT target of Ti, Zr and Pb in the ratio of 0.5:0.5:1.15 under reduced pressure to form the PZT film 4 (FIG. 2(b)).

The silicon substrate 1 having thereon the SiO.sub.2 film 2, electrode 7 and PZT film 4 is annealed for 30 mins to 1 hr at 550.degree. to 650.degree.C. in an oxidative atmosphere and then further applied with a separate electrode material in a desired pattern to complete a semiconductor device (not shown).

The semiconductor device uses platinum as the basic electrode 7 and the substrate is annealed after the PZT film 4 is formed on the basic electrode 7. Hence, the annealing causes PbO in the PZT film 4 to readily change to a vapor, leading to that the resultant PZT film 6 lacks Pb, particularly, at an interface between the electrode 7 and the PZT film 6. As a result, there is a problem that the PZT film 6 when provided with a space-charge region at the interface between the electrode 7 and the PZT film 6 is poor in reliability or other properties.

SUMMARY OF THE INVENTION

The present invention provides a semiconductor device comprising an oxide film, an electrode and a PZT or PLZT film formed in this order on a substrate, the electrode being a deposit of platinum containing lead.

According to the present invention, it provides a semiconductor device having a PZT or PLZT film being kept uniform in its composition in a vertical direction of the film after annealing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(a) through 1(c) are schematic diagrams of principal portions of a semiconductor device in production according to the present invention, showing a manufacturing process thereof.

FIGS. 2(a) through 2(c) are schematic diagrams of principal portions of a conventional semiconductor device in production, showing a manufacturing process thereof.

PREFERRED EMBODIMENTS OF THE INVENTION

The semiconductor device of the present invention comprises an oxide film, an electrode and a PZT or PLZT film formed in this order on a substrate, the electrode being a deposit of platinum containing lead.

The substrate to be employed in the invention is usually a silicon substrate, on which a transistor or capacitor element may be optionally formed beforehand.

The oxide film may be SiO.sub.2 film formed by conventional methods, such as hydrolysis or oxidation of a silicon halide or hydride or a thermal decomposition method of an organic oxysilane. Its thickness is preferably about 80 to 150.ANG..

The electrode to be formed on the oxide film is preferably made of platinum having a lead content of about 5 to 20 wt. %, preferably of about 8 to 20 wt. %, e.g., 8 wt. %, 10 wt. %, 12 wt. %, 15 wt. % or 17 wt. %, which may be formed by conventional methods, such as a DC magnetron sputtering method using a platinum target having a lead content of about 5 to 20 wt. %. Its thickness is preferably about 1000 to 2000.ANG..

The PZT or PLZT film to be formed on the electrode may be formed by conventional methods, such as a RF sputtering method using a plasma ion of Ar/O.sub.2 preferably with a sintered PZT or PLZT target of Ti, Zr and Pb in the ratio of 0.3 to 0.5: 0.5 to 0.7: 1.15 to 1.3 or Ti, Zr, Pb and La in the ratio of about 0.3 to 0.5: 0.5 to 0.7: 1.05 to 1.1: 0.05 to 1.0. Thickness of the PZT or PLZT film is preferably about 2000 to 3000.ANG..

The substrate after the formation of the PZT or PLZT film is preferably annealed at about 550.degree. to 650.degree. C. for about 30 mins to 1 hr under an oxidative atmosphere

DESCRIPTION OF PREFERRED EMBODIMENTS

Next, an example of the present invention will be detailed with reference to the accompanied drawings.

As shown in FIG. 1(c), on a substrate 1 made of silicon are layered in order an oxide film 2 of SiO.sub.2, an electrode 3 of Pt/Pb and a PZT film 4.

A manufacturing method of the semiconductor device having the above construction is as follows.

A SiO.sub.2 film 2 of about 100.ANG. was formed on the silicon substrate 1, for example, by a thermal decomposition method of an organic oxysilane. A Pt/Pb electrode 3 of about 2000.ANG. was then layered on the SiO.sub.2 film 2 by a DC magnetron sputtering method using platinum having a lead content of 10 wt. % (FIG. 1(a)).

A PZT film 4 of about 3000.ANG. was layered on the electrode 3 by a RF sputtering method using a PZT sintered target of Ti, Zr and Pb in the ratio of 0.5: 0.5: 1.15 with a plasma ion of Ar/O.sub.2 under reduced pressure (FIG. 1(b)).

The silicon substrate 1 having thereon the SiO.sub.2 film 2, Pt/Pb electrode 3 and PZT film 4 was annealed for 30 mins at 600.degree. C. under an oxidative atmosphere (FIG. 1(c)).

A separate electrode material was layered on the substrate and patterned in a desired pattern to complete a semiconductor (not shown).

A ferroelectric memory device provided with the above construction enabled high-speed writing and reading due to its polarization inversion property.

The PZT film may be replaced with a PLZT film which was prepared by a RF sputtering method using a sintered target of Ti, Zr, Pb and La in the ratio of 0.3: 0.1: 1.1: 0.1 and had the same effect as the PZT film.

The electrode of the semiconductor device was made of platinum containing lead (Pb) as foregoing. When Pb in the PZT or PLZT film 4 changed to a vapor in the form of PbO in the midst of the device manufacturing process, i.e., upon annealing of the substrate, leading to a lack of Pb as conventionally, particularly, at an interface between the electrode (denoted by 7 in FIG. 2) and the PZT or PLZT film 4, the platinum electrode 3 containing lead Pb supplied to the interface between the electrode 3 and the PZT or PLZT film 4, so that the resultant PZT or PLZT film 4 was uniform in composition in a vertical direction of the film.

Hence, the present invention provides a reliable PZT or PLZT film which is applicable to various semiconductor devices, such as a large-scale DRAM, nonvolatile memory or the like.

Claims

1. A semiconductor device comprising:

a substrate;

an oxide film formed on the substrate;

an electrode formed on the oxide film; and

a PZT or PLZT film formed on the electrode;

the electrode being a deposit of platinum containing lead, wherein said deposit contains 5 to 20 wt. % of lead.

2. A semiconductor device as set forth in claim 1, wherein the electrode is formed by sputtering using platinum containing lead as a target.

3. A semiconductor device comprising:

a substrate;

an oxide film formed on the substrate;

an electrode formed on the oxide film; and

a PZT or PLZT film formed on the electrode;

the electrode being a deposit which contains platinum and lead prior to formation of the PZT or PLZT film, wherein said deposit contains 5 to 20 wt. % of lead.